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Winter Wheat Crop Models Improve Growth Simulation by Including Phenological Response to Water-Deficit Stress.
- Published in:
- Environmental Modeling & Assessment, 2024, v. 29, n. 2, p. 235, doi. 10.1007/s10666-023-09939-5
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- Publication type:
- Article
IP3RPEP6, a novel peptide inhibitor of IP<sub>3</sub> receptor channels that does not affect connexin‐43 hemichannels.
- Published in:
- Acta Physiologica, 2024, v. 240, n. 3, p. 1, doi. 10.1111/apha.14086
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- Publication type:
- Article
Segregated cation flux by TPC2 biases Ca<sup>2+</sup> signaling through lysosomes.
- Published in:
- Nature Communications, 2022, v. 13, n. 1, p. 1, doi. 10.1038/s41467-022-31959-0
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- Publication type:
- Article
WEBSTART WEPS: WEPS WITH REMOTE DATA ACCESS AND CLOUD-COMPUTING FUNCTIONALITY.
- Published in:
- Journal of the ASABE, 2022, v. 65, n. 2, p. 427, doi. 10.13031/ja.14773
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- Publication type:
- Article
Fluoride exposure alters Ca<sup>2+</sup> signaling and mitochondrial function in enamel cells.
- Published in:
- Science Signaling, 2020, v. 13, n. 619, p. 1, doi. 10.1126/scisignal.aay0086
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- Publication type:
- Article
Bcl-2 and IP<sub>3</sub> compete for the ligand-binding domain of IP<sub>3</sub>Rs modulating Ca<sup>2+</sup> signaling output.
- Published in:
- Cellular & Molecular Life Sciences, 2019, v. 76, n. 19, p. 3843, doi. 10.1007/s00018-019-03091-8
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- Publication type:
- Article
Winter Wheat Phenology Simulations Improve when Adding Responses to Water Stress.
- Published in:
- Agronomy Journal, 2019, v. 111, n. 5, p. 2350, doi. 10.2134/agronj2018.09.0615
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- Publication type:
- Article
NEW THERMO SCIENTIFIC PRISMA SEM COMBINES PERFORMANCE AND VERSATILITY.
- Published in:
- 2018
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- Publication type:
- Product Review
KIRIGAMI-INSPIRED TECHNIQUE MANIPULATES LIGHT AT NANOSCALE.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 4, p. 54
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- Publication type:
- Article
SCANNING ACOUSTIC MICROSCOPY: FROM LAB TO HIGH-THROUGHPUT FAB.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 4, p. 55
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- Publication type:
- Article
HIGH-RESOLUTION MICROSCOPY CONFIRMS NANOSCALE MAGNETIC PROPERTIES.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 4, p. 55
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- Publication type:
- Article
HUGE THERMOMETER TAKES TEMPERATURES OFTINY SAMPLES.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 4, p. 56
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- Publication type:
- Article
THERMO FISHER SCIENTIFICTO ACQUIRE GATAN FROM ROPER TECHNOLOGIES.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 4, p. 56
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- Publication type:
- Article
PRODUCT NEWS.
- Published in:
- 2018
- By:
- Publication type:
- Product Review
KEYSIGHT LAUNCHES AUTOMOTIVE ETHERNET SOLUTIONS.
- Published in:
- 2018
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- Publication type:
- Product Review
PHENOM-WORLD LAUNCHES NEW DESKTOP SEMS.
- Published in:
- 2018
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- Publication type:
- Product Review
INOVENSO INTRODUCES IEM DESKTOP SEM.
- Published in:
- 2018
- By:
- Publication type:
- Product Review
BRUKER DEBUTS NANOMECHANICS LAB.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 2, p. 46
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- Publication type:
- Article
HORIBA SCIENTIFIC INTRODUCES UVISEL PLUS.
- Published in:
- 2018
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- Publication type:
- Product Review
NEW MICROSCOPY TECHNIQUE REPORTED FOR NANOMECHANICAL SUBSURFACE IMAGING.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 2, p. 46
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- Publication type:
- Article
ZEISS ENTERS SEMICONDUCTOR PROCESS CONTROL MARKET.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 2, p. 47
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- Publication type:
- Article
AEROTECH'S HEXAPOD ADVANCES POSITIONING PERFORMANCE.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 2, p. 47
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- Publication type:
- Article
NEW ATOMIC FORCE MICROSCOPE STUDIES PIEZOELECTRICS ATTHE NANOSCALE.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 1, p. 44
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- Publication type:
- Article
PIEZOELECTRIC FORCE MICROSCOPY REVEALS CHARGE MAPPING.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 1, p. 44
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- Publication type:
- Article
OLYMPUS LAUNCHES LASER CONFOCAL SCANNING MICROSCOPE.
- Published in:
- 2018
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- Publication type:
- Product Review
MINILOCK-PHANTOM RIE FEATURES VACUUM LOADLOCK.
- Published in:
- 2018
- By:
- Publication type:
- Product Review
OLYMPUS RELEASES NEW INVERTED METALLURGICAL MICROSCOPE.
- Published in:
- 2018
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- Publication type:
- Product Review
NEW TECHNIQUE IMPROVES RESOLUTION OFTERAHERTZ EMISSION SPECTROSCOPY.
- Published in:
- Electronic Device Failure Analysis, 2018, v. 20, n. 1, p. 47
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- Publication type:
- Article
PRODUCT NEWS.
- Published in:
- 2017
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- Publication type:
- Product Review
NOVEL LENS ENABLES SUPERRESOLUTION IMAGING.
- Published in:
- Electronic Device Failure Analysis, 2017, v. 19, n. 3, p. 40
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- Publication type:
- Article
SPIN-RESOLVED OSCILLOSCOPE DEVELOPED FOR CHARGE AND SPIN SIGNALS.
- Published in:
- Electronic Device Failure Analysis, 2017, v. 19, n. 3, p. 40
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- Publication type:
- Article
PARK SYSTEMS ANNOUNCES SINGLE-CLICK SMARTSCAN SOFTWARE.
- Published in:
- 2017
- By:
- Publication type:
- Product Review
MEGGITT SENSING SYSTEMS INTRODUCES HANDHELD TRANSDUCER SIMULATOR.
- Published in:
- 2017
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- Publication type:
- Product Review
MULTIPARAMETER MICROSCOPY OPTIMIZES PERFORMANCE OF OPTOELECTRONIC DEVICES.
- Published in:
- Electronic Device Failure Analysis, 2017, v. 19, n. 3, p. 43
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- Publication type:
- Article
NOVEL TECHNIQUE MEASURES WARPAGE IN NEXT-GENERATION ICs.
- Published in:
- Electronic Device Failure Analysis, 2017, v. 19, n. 3, p. 43
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- Publication type:
- Article
SCIENTISTS PRINT NANOSCALE IMAGING PROBE ONTO TIP OF OPTICAL FIBER.
- Published in:
- Electronic Device Failure Analysis, 2017, v. 19, n. 3, p. 45
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- Publication type:
- Article
M&A IN FAILURE ANALYSIS.
- Published in:
- 2017
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- Publication type:
- Editorial
NATIONAL INSTRUMENTS UPGRADES ALL-IN-ONE VIRTUALBENCH.
- Published in:
- 2017
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- Publication type:
- Product Review
ENGINEERS SHRINK MICROSCOPE TO DIME-SIZED DEVICE.
- Published in:
- 2017
- By:
- Publication type:
- Product Review
TERAHERTZ CHIPS OFFER NEW WAY OF SEEING THROUGH MATTER.
- Published in:
- 2017
- By:
- Publication type:
- Product Review
FEI OFFERS EFA WORKFLOW SOLUTIONS.
- Published in:
- 2017
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- Publication type:
- Product Review
3-D NANOPRINTING IMPROVES AFM PERFORMANCE.
- Published in:
- Electronic Device Failure Analysis, 2017, v. 19, n. 1, p. 41
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- Publication type:
- Article
ECONO BOARD PROBES ENHANCE MEASUREMENTS.
- Published in:
- Electronic Device Failure Analysis, 2017, v. 19, n. 1, p. 42
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- Publication type:
- Article
SELF-SENSING CANTILEVERS AVAILABLE FOR AFSEM.
- Published in:
- Electronic Device Failure Analysis, 2017, v. 19, n. 1, p. 42
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- Publication type:
- Article
TERAVIEW ADDS NEW TERAHERTZ APPLICATIONS.
- Published in:
- Electronic Device Failure Analysis, 2017, v. 19, n. 1, p. 43
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- Publication type:
- Article
NATIONAL INSTRUMENTS ANNOUNCES NEW OSCILLOSCOPE.
- Published in:
- 2017
- By:
- Publication type:
- Product Review
TELEDYNE LECROY INTRODUCES HIGH-DEFINITION OSCILLOSCOPE.
- Published in:
- 2017
- By:
- Publication type:
- Product Review
PARK SYSTEMS LAUNCHES RESEARCH AEM.
- Published in:
- 2016
- By:
- Publication type:
- Product Review
TERAVIEW INTRODUCES IC PACKAGE-INSPECTION SYSTEM.
- Published in:
- 2016
- By:
- Publication type:
- Product Review
NEW X-RAY IMAGING TECHNIQUE SLICES THROUGH MATERIALS.
- Published in:
- Electronic Device Failure Analysis, 2016, v. 18, n. 4, p. 50
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- Publication type:
- Article