Elastic Modulus and Coefficient of Thermal Expansion of 91.84Sn-3.33Ag-4.83Bi Pb-Free Solder.
- Published in:
- Journal of Electronic Materials, 2023, v. 52, n. 3, p. 2116, doi. 10.1007/s11664-022-10159-y
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- Publication type:
- Article
Works matching AU Vianco, Paul T.
Results: 13
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An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis.
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- Journal of Materials Science, 2011, v. 46, n. 1, p. 263, doi. 10.1007/s10853-010-4976-4
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- Publication type:
- Article
3
Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties.
- Published in:
- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 152, doi. 10.1007/s11664-019-07456-4
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- Publication type:
- Article
4
Solderability Testing of Sn-Ag-XCu Pb-Free Solders on Copper and Au-Ni-Plated Kovar Substrates.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 299, doi. 10.1007/s11664-005-0217-z
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- Publication type:
- Article
5
Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder--Part I: As-Cast Condition.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1389, doi. 10.1007/s11664-004-0169-8
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- Article
6
Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder: Part II-Aged Condition.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1473, doi. 10.1007/s11664-004-0089-7
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- Publication type:
- Article
7
Solid-State Intermetallic Compound Layer Growth Between Copper and 95.5Sn-3.9Ag-0.6Cu Solder.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 991, doi. 10.1007/s11664-004-0026-9
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- Publication type:
- Article
8
Solid-State Interface Reactions between Silver and 95.5Sn-3.9Ag-0.6Cu and 63Sn-37Pb Solders.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2007, v. 38, n. 10, p. 2488, doi. 10.1007/s11661-007-9289-0
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- Article
9
Dissolution and Interface Reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb Solders on Silver Base Metal.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2006, v. 37, n. 5, p. 1551, doi. 10.1007/s11661-006-0099-6
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- Publication type:
- Article
10
Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to a Ag-Pd-Pt Thick Film Metallization: Part 2--Isothermal Aging Effects.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 3, p. 97, doi. 10.4071/imaps.1463995
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- Publication type:
- Article
11
Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1--Processing Effects.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 3, p. 81, doi. 10.4071/imaps.1435232
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- Publication type:
- Article
12
A Review of Interface Microstructures in Electronic Packaging Applications: Brazing and Welding Technologies.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2022, v. 74, n. 9, p. 3557, doi. 10.1007/s11837-022-05308-x
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- Article
13
A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2019, v. 71, n. 1, p. 158, doi. 10.1007/s11837-018-3219-z
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- Publication type:
- Article