Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 10, p. 1066, doi. 10.1007/s10854-010-0099-6
- By:
- Publication type:
- Article
Works by Ueshima, Minoru
Results: 6
1
2
Metastable phases of Ag–Si: amorphous Si and Ag-nodule mediated bonding.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-70298-6
- By:
- Publication type:
- Article
3
Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4428, doi. 10.1007/s11664-014-3377-x
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- Publication type:
- Article
4
Numerical Prediction of Fraction of Eutectic Phase in Sn-Ag-Cu Soldering Using the Phase-Field Method.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1969, doi. 10.1007/s11664-006-0301-z
- By:
- Publication type:
- Article
5
Enhanced reliability of Sn-Ag-Bi-In joint under electric current stress by adding Co/Ni elements.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 7, p. 3090, doi. 10.1007/s10854-014-1988-x
- By:
- Publication type:
- Article
6
A Novel Low-Temperature Solder Based on Intermetallic-Compound Phases: Alloy Design, High-Homologous Temperature Properties and Reliability.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2008, v. 60, n. 6, p. 71, doi. 10.1007/s11837-008-0076-1
- By:
- Publication type:
- Article