Works matching AU Suganuma, Katsuaki

Results: 117

Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 10, p. 1066, doi. 10.1007/s10854-010-0099-6

By:

Baated, Alongheng;
Keun-Soo Kim;
Suganuma, Katsuaki;
Huang, Sharon;
Jurcik, Benjamin;
Nozawa, Shigeyoshi;
Ueshima, Minoru

Publication type:

Article

Synthesis of silver nanorods and application for die attach material in devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 713, doi. 10.1007/s10854-009-9983-3

By:

Jinting Jiu;
Keiichi Murai;
Keunsoo Kim;
Katsuaki Suganuma

Publication type:

Article

Influential factors in determining the adhesive strength of ACF joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 12, p. 1247, doi. 10.1007/s10854-009-9860-0

By:

Inoue, Masahiro;
Suganuma, Katsuaki

Publication type:

Article

Sn–Zn low temperature solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 121

By:

Katsuaki Suganuma;
Kuen-Soo Kim

Publication type:

Article

Three Dimensional Analyses of Degradation in PEMFCs.

Published in:

Microscopy & Microanalysis, 2017, v. 23, p. 962, doi. 10.1017/S1431927617005475

By:

Takeshi Daio;
Katsuaki Suganuma;
Ichihito Narita

Publication type:

Article

Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6597, doi. 10.1007/s11664-021-09221-y

By:

Zhang, Zheng;
Chen, Chuantong;
Suetake, Aiji;
Hsieh, Ming-Chun;
Suganuma, Katsuaki

Publication type:

Article

Highly thermostable joint of a Cu/Ni-P plating/Sn-0.7Cu solder added with Cu balls.

Published in:

Journal of Materials Science, 2017, v. 52, n. 6, p. 3244, doi. 10.1007/s10853-016-0613-1

By:

Kadoguchi, Takuya;
Take, Naoya;
Yamanaka, Kimihiro;
Nagao, Shijo;
Suganuma, Katsuaki

Publication type:

Article

Die-attaching silver paste based on a novel solvent for high-power semiconductor devices.

Published in:

Journal of Materials Science, 2016, v. 51, n. 7, p. 3422, doi. 10.1007/s10853-015-9659-8

By:

Jiu, Jinting;
Zhang, Hao;
Nagao, Shijo;
Sugahara, Tohru;
Kagami, Noriko;
Suzuki, Youji;
Akai, Yasuyuki;
Suganuma, Katsuaki

Publication type:

Article

Effect of additives on the morphology of single-crystal Au nanosheet synthesized using the polyol process.

Published in:

Journal of Materials Science, 2011, v. 46, n. 14, p. 4964, doi. 10.1007/s10853-011-5413-z

By:

Jiu, Jinting;
Suganuma, Katsuaki;
Nogi, Masaya

Publication type:

Article

Structures and purification of boron nitride nanotubes synthesized from boron-based powders with iron particles.

Published in:

Journal of Materials Science, 2008, v. 43, n. 8, p. 2955, doi. 10.1007/s10853-007-1750-3

By:

Koi, Naruhiro;
Oku, Takeo;
Inoue, Masahiro;
Suganuma, Katsuaki

Publication type:

Article

Differences in heat exposure degradation of Sn alloy platings joined with Ag-epoxy conductive adhesive.

Published in:

Journal of Materials Science, 2006, v. 41, n. 2, p. 583, doi. 10.1007/s10853-005-2155-9

By:

Yamashita, Munenori;
Suganuma, Katsuaki

Publication type:

Article

Development of a cryogenic stage for an ion-milling instrument.

Published in:

Journal of Electron Microscopy, 2011, v. 60, n. 1, p. 25, doi. 10.1093/jmicro/dfq069

By:

Terauchi, Masami;
Satou, Futami;
Sugizaki, Hideo;
Suganuma, Katsuaki

Publication type:

Article

Synthesis and structures of iron nanoparticles coated with boron nitride nanomaterials.

Published in:

Journal of Electron Microscopy, 2006, v. 55, n. 3, p. 123, doi. 10.1093/jmicro/dfl005

By:

Ichihito Narita;
Takeo Oku;
Hisato Tokoro;
Katsuaki Suganuma

Publication type:

Article

Aldehyde Absorption with Asp-OCP Inclusion Compound.

Published in:

Phosphorus, Sulfur & Silicon & the Related Elements, 2002, v. 177, n. 8/9, p. 2259, doi. 10.1080/10426500213345

By:

Aoki, Shinsuke;
Yamaguchi, Shunro;
Nakahira, Atsushi;
Nakayama, Hirokazu;
Suganuma, Katsuaki

Publication type:

Article

Metastable phases of Ag–Si: amorphous Si and Ag-nodule mediated bonding.

Published in:

Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-70298-6

By:

Nakayama, Koji S.;
Nishijima, Masahiko;
Zhang, Yicheng;
Chen, Chuantong;
Ueshima, Minoru;
Suganuma, Katsuaki

Publication type:

Article

Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light.

Published in:

Nano Research, 2016, v. 9, n. 2, p. 401, doi. 10.1007/s12274-015-0921-9

By:

Yang, Yang;
Ding, Su;
Araki, Teppei;
Jiu, Jinting;
Sugahara, Tohru;
Wang, Jun;
Vanfleteren, Jan;
Sekitani, Tsuyoshi;
Suganuma, Katsuaki

Publication type:

Article

Highly stretchable, electrically conductive textiles fabricated from silver nanowires and cupro fabrics using a simple dipping-drying method.

Published in:

Nano Research, 2015, v. 8, n. 5, p. 1604, doi. 10.1007/s12274-014-0649-y

By:

Cui, Hui-Wang;
Suganuma, Katsuaki;
Uchida, Hiroshi

Publication type:

Article

Low haze transparent electrodes and highly conducting air dried films with ultra-long silver nanowires synthesized by one-step polyol method.

Published in:

Nano Research, 2014, v. 7, n. 2, p. 236, doi. 10.1007/s12274-013-0391-x

By:

Araki, Teppei;
Jiu, Jinting;
Nogi, Masaya;
Koga, Hirotaka;
Nagao, Shijo;
Sugahara, Tohru;
Suganuma, Katsuaki

Publication type:

Article

Fabrication of silver nanowire transparent electrodes at room temperature.

Published in:

Nano Research, 2011, v. 4, n. 12, p. 1215, doi. 10.1007/s12274-011-0172-3

By:

Tokuno, Takehiro;
Nogi, Masaya;
Karakawa, Makoto;
Jiu, Jinting;
Nge, Thi;
Aso, Yoshio;
Suganuma, Katsuaki

Publication type:

Article

Evaluation of thermal resistance for metalized ceramic substrates using a microheater chip.

Published in:

International Journal of Applied Ceramic Technology, 2022, v. 19, n. 1, p. 232, doi. 10.1111/ijac.13819

By:

Kiyoshi Hirao;
You Zhou;
Hideki Hyuga;
Shijo Nagao;
Katsuaki Suganuma;
Naoki Wakasugi

Publication type:

Article

Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 2, p. 1106, doi. 10.1007/s11664-018-06842-8

By:

Chen, Chuantong;
Zhang, Zheng;
Choe, Chanyang;
Kim, Dongjin;
Noh, Seungjun;
Sugahara, Toru;
Suganuma, Katsuaki

Publication type:

Article

Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 1, p. 811, doi. 10.1007/s11664-017-5857-2

By:

Pei, Chun;
Chen, Chuantong;
Suganuma, Katsuaki;
Fu, Guicui

Publication type:

Article

Enhancing Low-Temperature and Pressureless Sintering of Micron Silver Paste Based on an Ether-Type Solvent.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 8, p. 5201, doi. 10.1007/s11664-017-5525-6

By:

Zhang, Hao;
Li, Wanli;
Gao, Yue;
Jiu, Jinting;
Suganuma, Katsuaki

Publication type:

Article

Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 7, p. 4575, doi. 10.1007/s11664-017-5464-2

By:

Gao, Yue;
Zhang, Hao;
Li, Wanli;
Jiu, Jinting;
Nagao, Shijo;
Sugahara, Tohru;
Suganuma, Katsuaki

Publication type:

Article

Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 3, p. 1576, doi. 10.1007/s11664-016-5200-3

By:

Chen, Chuantong;
Nagao, Shijo;
Zhang, Hao;
Jiu, Jinting;
Sugahara, Tohru;
Suganuma, Katsuaki;
Iwashige, Tomohito;
Sugiura, Kazuhiko;
Tsuruta, Kazuhiro

Publication type:

Article

Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 2, p. 1055, doi. 10.1007/s11664-016-5069-1

By:

Zhang, Hao;
Chen, Chuantong;
Nagao, Shijo;
Suganuma, Katsuaki

Publication type:

Article

Contact Resistance and Metallurgical Connections Between Silver Coated Polymer Particles in Isotropic Conductive Adhesives.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 7, p. 3734, doi. 10.1007/s11664-016-4498-1

By:

Pettersen, Sigurd;
Kristiansen, Helge;
Nagao, Shijo;
Helland, Susanne;
Njagi, John;
Suganuma, Katsuaki;
Zhang, Zhiliang;
He, Jianying

Publication type:

Article

Addition of SiC Particles to Ag Die-Attach Paste to Improve High-Temperature Stability; Grain Growth Kinetics of Sintered Porous Ag.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 10, p. 3896, doi. 10.1007/s11664-015-3919-x

By:

Zhang, Hao;
Nagao, Shijo;
Suganuma, Katsuaki

Publication type:

Article

Pressureless Bonding Using Sputtered Ag Thin Films.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4406, doi. 10.1007/s11664-014-3355-3

By:

Oh, Chulmin;
Nagao, Shijo;
Suganuma, Katsuaki

Publication type:

Article

Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4428, doi. 10.1007/s11664-014-3377-x

By:

Kim, Youngseok;
Nagao, Shijo;
Sugahara, Tohru;
Suganuma, Katsuaki;
Ueshima, Minoru;
Albrecht, Hans-Juergen;
Wilke, Klaus;
Strogies, Joerg

Publication type:

Article

Mitigation of Sn Whisker Growth by Small Bi Additions.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 1, p. 1, doi. 10.1007/s11664-013-2706-9

By:

Jo, Jung-Lae;
Nagao, Shijo;
Hamasaki, Kyoko;
Tsujimoto, Masanobu;
Sugahara, Tohru;
Suganuma, Katsuaki

Publication type:

Article

Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1859, doi. 10.1007/s11664-012-1962-4

By:

Mizuguchi, Yukiko;
Murakami, Yosuke;
Tomiya, Shigetaka;
Asai, Tadashi;
Kiga, Tomoya;
Suganuma, Katsuaki

Publication type:

Article

Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2278, doi. 10.1007/s11664-011-1712-z

By:

Baated, Alongheng;
Hamasaki, Kyoko;
Kim, Sun;
Kim, Keun-Soo;
Suganuma, Katsuaki

Publication type:

Article

Electrical Resistance and Microstructural Changes of Silver-Epoxy Isotropic Conductive Adhesive Joints Under High Humidity and Heat.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 2, p. 232, doi. 10.1007/s11664-010-1421-z

By:

Kim, Sun-Sik;
Kim, Keun-Soo;
Lee, KiJu;
Kim, Seongjun;
Suganuma, Katsuaki;
Tanaka, Hirokazu

Publication type:

Article

Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2598, doi. 10.1007/s11664-010-1344-8

By:

Sakurai, Hitoshi;
Baated, Alongheng;
Lee, Kiju;
Kim, Seongjun;
Kim, Keun-Soo;
Kukimoto, Youichi;
Kumamoto, Seishi;
Suganuma, Katsuaki

Publication type:

Article

Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2668, doi. 10.1007/s11664-009-0928-7

By:

Seongjun Kim;
Keun-Soo Kim;
Sun-Sik Kim;
Suganuma, Katsuaki;
Izuta, Goro

Publication type:

Article

Electrical Properties of Isotropic Conductive Adhesives Composed of Silicone-Based Elastomer Binders Containing Ag Particles.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 9, p. 2013, doi. 10.1007/s11664-009-0837-9

By:

Inoue, Masahiro;
Muta, Hiroaki;
Yamanaka, Shinsuke;
Suganuma, Katsuaki

Publication type:

Article

Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 896, doi. 10.1007/s11664-009-0738-y

By:

Kim, Sun Sik;
Kim, Keun Soo;
Kim, Seong Jun;
Suganuma, Katsuaki

Publication type:

Article

Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 873, doi. 10.1007/s11664-009-0770-y

By:

Kim, Seongjun;
Kim, Keun-Soo;
Suganuma, Katsuaki;
Izuta, Goro

Publication type:

Article

Physical Factors Determining Thermal Conductivities of Isotropic Conductive Adhesives.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 3, p. 430, doi. 10.1007/s11664-008-0593-2

By:

Inoue, Masahiro;
Muta, Hiroaki;
Maekawa, Takuji;
Yamanaka, Shinsuke;
Suganuma, Katsuaki

Publication type:

Article

Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 266, doi. 10.1007/s11664-008-0550-0

By:

Kim, Seongjun;
Kim, Keun-Soo;
Kim, Sun-Sik;
Suganuma, Katsuaki

Publication type:

Article

Foreword.

Published in:

2009

By:

Chen, Sinn-wen;
Chada, Srinivas;
Chen, Chih-ming;
Flandorfer, Hans;
Greer, A. Lindsay;
Lee, Jae-Ho;
Zeng, Kejun;
Suganuma, Katsuaki

Publication type:

Editorial

Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 806, doi. 10.1007/s11664-008-0408-5

By:

Kumamoto, Seishi;
Sakural, Hitoshi;
Kukimoto, Youichi;
Suganuma, Katsuaki

Publication type:

Article

Temperature Dependence of Electrical and Thermal Conductivities of an Epoxy-Based Isotropic Conductive Adhesive.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 4, p. 462, doi. 10.1007/s11664-007-0378-z

By:

Inoue, Masahiro;
Muta, Hiroaki;
Maekawa, Takuji;
Yamanaka, Shinsuke;
Suganuma, Katsuaki

Publication type:

Article

Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1732, doi. 10.1007/s11664-007-0284-4

By:

Shih-Kang Lin;
Yorikado, Yuhi;
Junxiang Jiang;
Keun-Soo Kim;
Suganuma, Katsuaki;
Sinn-Wen Chen;
Tsujimoto, Masanobu;
Yanada, Isamu

Publication type:

Article

Foreword.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1407, doi. 10.1007/s11664-007-0236-z

By:

Sinn-wen Chen;
Chada, Srinivas;
Chih-ming Chen;
Greer, A. Lindsay;
Young-chang Joo;
Hyuck Mo Lee;
Lewis, Daniel J.;
Suganuma, Katsuaki

Publication type:

Article

The Dependence on Thermal History of the Electrical Properties of an Epoxy-Based Isotropic Conductive Adhesive.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 6, p. 669, doi. 10.1007/s11664-007-0125-5

By:

Inoue, Masahiro;
Suganuma, Katsuaki

Publication type:

Article

Suppression of Tin Whisker Formation on Fine Pitch Connectors by Surface Roughening.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1918, doi. 10.1007/s11664-006-0294-7

By:

Takeuchi, Makoto;
Kamiyama, Kouichi;
Suganuma, Katsuaki

Publication type:

Article

Effects of Bi and Pb on Oxidation in Humidity for Low-Temperature Lead-Free Solder Systems.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 41, doi. 10.1007/s11664-006-0182-1

By:

Keun-Soo Kim;
Matsuura, Toshinori;
Suganuma, Katsuaki

Publication type:

Article

Foreword.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 1, p. 1, doi. 10.1007/s11664-006-0175-0

By:

Sinn-Wen Chen;
Kao, C. Robert;
Hyuck Mo Lee;
Mohney, Suzanne;
Suganuma, Katsuaki;
Swenson, Douglas J.;
Chada, Srinivas

Publication type:

Article