Works matching AU Shu, C. M.
1
- Clinical & Experimental Dermatology, 2011, v. 36, n. 2, p. 178, doi. 10.1111/j.1365-2230.2010.03916.x
- Wu, Y.;
- Matsui, M. S.;
- Chen, J. Z. S.;
- Jin, X.;
- Shu, C.-M.;
- Jin, G.-Y.;
- Dong, G.-H.;
- Wang, Y.-K.;
- Gao, X.-H.;
- Chen, H.-D.;
- Li, Y.-H.
- Article
2
- Journal of Thermal Analysis & Calorimetry, 2011, v. 106, n. 1, p. 159, doi. 10.1007/s10973-011-1452-6
- Jhu, C.-Y.;
- Wang, Y.-W.;
- Wen, C.-Y.;
- Chiang, C.-C.;
- Shu, C.-M.
- Article
4
- Journal of Thermal Analysis & Calorimetry, 2010, v. 102, n. 2, p. 541, doi. 10.1007/s10973-010-0871-0
- Lin, M. L.;
- Lin, N. K.;
- Chen, C. C.;
- Liaw, H. J.;
- Shu, C. M.
- Article
5
- Journal of Thermal Analysis & Calorimetry, 2009, v. 96, n. 3, p. 741, doi. 10.1007/s10973-009-0027-2
- Chang, Y.-M.;
- Lee, J.-C.;
- Chen, C.-C.;
- Shu, C.-M.
- Article
6
- Journal of Thermal Analysis & Calorimetry, 2009, v. 96, n. 3, p. 759, doi. 10.1007/s10973-009-0028-1
- Chiang, C.-C.;
- Lee, J.-C.;
- Chang, Y.-M.;
- Chuang, C.-F.;
- Shu, C.-M.
- Article
7
- Journal of Thermal Analysis & Calorimetry, 2009, v. 96, n. 3, p. 771, doi. 10.1007/s10973-009-0041-4
- Chou, Y.-P.;
- Hou, H.-Y.;
- Chang, R.-H.;
- You, M.-L.;
- Peng, J.-Y.;
- Shu, C.-M.
- Article
8
- Journal of Thermal Analysis & Calorimetry, 2009, v. 96, n. 3, p. 789, doi. 10.1007/s10973-009-0029-0
- Tseng, J.-M.;
- Liu, M.-Y.;
- Chen, S.-L.;
- Hwang, W.-T.;
- Gupta, J.-P.;
- Shu, C.-M.
- Article
9
- Journal of Thermal Analysis & Calorimetry, 2009, v. 96, n. 3, p. 783, doi. 10.1007/s10973-009-0042-3
- Peng, J.-J.;
- Wu, S.-H.;
- Hou, H.-Y.;
- Lin, C.-P.;
- Shu, C.-M.
- Article
10
- Journal of Thermal Analysis & Calorimetry, 2009, v. 95, n. 2, p. 639, doi. 10.1007/s10973-008-9163-3
- Chang, C. -W.;
- Chou, Y. -C.;
- Tseng, J. -M.;
- Liu, M. -Y.;
- Shu, C. -M.
- Article
11
- Journal of Thermal Analysis & Calorimetry, 2009, v. 95, n. 2, p. 645, doi. 10.1007/s10973-008-9164-2
- Lin, W. H.;
- Wu, S. H.;
- Shiu, G. Y.;
- Shieh, S. S.;
- Shu, C. M.
- Article
12
- Journal of Thermal Analysis & Calorimetry, 2009, v. 95, n. 2, p. 547, doi. 10.1007/s10973-008-9463-7
- Article
13
- Journal of Thermal Analysis & Calorimetry, 2009, v. 95, n. 2, p. 559, doi. 10.1007/s10973-008-9465-5
- Lin, S. -Y.;
- Tseng, J. -M.;
- Lee, M. -K.;
- Wu, T. -C.;
- Shu, C. -M.
- Article
14
- Journal of Thermal Analysis & Calorimetry, 2009, v. 95, n. 2, p. 553, doi. 10.1007/s10973-008-9464-6
- Wang, Y. -W.;
- Duh, Y. -S.;
- Shu, C. -M.
- Article
15
- Journal of Thermal Analysis & Calorimetry, 2009, v. 95, n. 2, p. 535, doi. 10.1007/s10973-008-9461-9
- Chen, Y. -L.;
- Chou, Y. -P.;
- Hou, H. -Y.;
- I, Y. -P.;
- Shu, C. -M.
- Article
16
- Journal of Thermal Analysis & Calorimetry, 2009, v. 95, n. 2, p. 541, doi. 10.1007/s10973-008-9462-8
- Hou, H.;
- Duh, Y.;
- Lee, W. -L.;
- Shu, C. -M.
- Article
17
- Journal of Thermal Analysis & Calorimetry, 2009, v. 95, n. 2, p. 525, doi. 10.1007/s10973-008-9460-x
- Chang, Y. -M.;
- Lee, J. -C.;
- Wu, S. -Y.;
- Chen, C. -C.;
- Shu, C. -M.
- Article
18
- Journal of Thermal Analysis & Calorimetry, 2008, v. 93, n. 1, p. 195, doi. 10.1007/s10973-007-8875-0
- C.-H. Lin;
- Y.-M. Chang;
- J.-C. Lee;
- S.-Y. Lin;
- C.-M. Shu
- Article
19
- Journal of Thermal Analysis & Calorimetry, 2008, v. 93, n. 1, p. 257, doi. 10.1007/s10973-007-8826-9
- S.-Y. Lin;
- J.-M. Tseng;
- Y.-F. Lin;
- W.-T. Huang;
- C.-M. Shu
- Article
20
- Journal of Thermal Analysis & Calorimetry, 2008, v. 93, n. 1, p. 269, doi. 10.1007/s10973-007-8832-y
- R.-P. Lee;
- H.-Y. Hou;
- J.-M. Tseng;
- M.-K. Chang;
- C.-M. Shu
- Article
21
- Journal of Thermal Analysis & Calorimetry, 2008, v. 93, n. 1, p. 275, doi. 10.1007/s10973-007-8833-x
- Y.-P. Chou;
- J.-Y. Huang;
- J.-M. Tseng;
- S.-Y. Cheng;
- C.-M. Shu
- Article
22
- Journal of Thermal Analysis & Calorimetry, 2008, v. 93, n. 1, p. 183, doi. 10.1007/s10973-007-8873-2
- Y. M. Chang;
- J.-C. Lee;
- J.-R. Chen;
- H.-J. Liaw;
- C.-M. Shu
- Article
23
- Journal of Thermal Analysis & Calorimetry, 2008, v. 93, n. 1, p. 189, doi. 10.1007/s10973-007-8874-1
- Wu, S.-H.;
- Wang, Y.-W.;
- Wu, T.-C.;
- Hu, W.-N.;
- Shu, C.-M.
- Article
24
- Journal of Thermal Analysis & Calorimetry, 2008, v. 93, n. 1, p. 115, doi. 10.1007/s10973-007-8829-6
- L.-K. Wu;
- K.-Y. Chen;
- S.-Y. Cheng;
- B.-S. Lee;
- C.-M. Shu
- Article
25
- Journal of Thermal Analysis & Calorimetry, 2008, v. 93, n. 1, p. 121, doi. 10.1007/s10973-007-8831-z
- S.-Y. Cheng;
- J.-M. Tseng;
- S.-Y. Lin;
- Gupta, J.-P.;
- C.-M. Shu
- Article
26
- Journal of Thermal Analysis & Calorimetry, 2008, v. 93, n. 1, p. 127, doi. 10.1007/s10973-007-8834-9
- J.-R. Chen;
- S.-H. Wu;
- S.-Y. Lin;
- H.-Y. Hou;
- C.-M. Shu
- Article
27
- Journal of Thermal Analysis & Calorimetry, 2008, v. 93, n. 1, p. 135, doi. 10.1007/s10973-007-8837-6
- Article
28
- Journal of Thermal Analysis & Calorimetry, 2006, v. 85, n. 1, p. 87, doi. 10.1007/s10973-005-7362-8
- Chen, K. Y.;
- Lin, C. M.;
- Shu, C. M.;
- Kao, C. S.
- Article
29
- Journal of Thermal Analysis & Calorimetry, 2006, v. 85, n. 1, p. 107, doi. 10.1007/s10973-005-7363-7
- Yun, R.-L.;
- Chang, Y.-M.;
- Lin, C.-H.;
- Hu, K.-H.;
- Shu, C.-M.
- Article
30
- Journal of Thermal Analysis & Calorimetry, 2006, v. 85, n. 1, p. 65, doi. 10.1007/s10973-005-7359-3
- Liao, C. C.;
- Wu, S. H.;
- Su, T. S.;
- Shyu, M. L.;
- Shu, C. M.
- Article
31
- Journal of Thermal Analysis & Calorimetry, 2006, v. 85, n. 1, p. 189, doi. 10.1007/s10973-005-7360-x
- Tseng, J. M.;
- Chang, R. H.;
- Horng, J. J.;
- Chang, M. K.;
- Shu, C. M.
- Article
32
- Journal of Thermal Analysis & Calorimetry, 2006, v. 85, n. 1, p. 225, doi. 10.1007/s10973-005-7361-9
- Wang, Y. W.;
- Duh, Y. S.;
- Shu, C. M.
- Article
33
- Journal of Thermal Analysis & Calorimetry, 2006, v. 85, n. 1, p. 145, doi. 10.1007/s10973-005-7364-6
- Hou, H. Y.;
- Duh, Y. S.;
- Lin, W. H.;
- Shu, C. M.
- Article
34
- Journal of Thermal Analysis & Calorimetry, 2006, v. 83, n. 1, p. 57, doi. 10.1007/s10973-005-7055-3
- Chang, R. H.;
- Tseng, J. M.;
- Jehng, J. M.;
- Shu, C. M.;
- Hou, H. Y.
- Article
35
- Journal of Thermal Analysis & Calorimetry, 2006, v. 83, n. 1, p. 41, doi. 10.1007/s10973-005-6983-2
- Wu, K. W.;
- Hou, H. Y.;
- Shu, C. M.
- Article
36
- Journal of Thermal Analysis & Calorimetry, 2006, v. 83, n. 1, p. 75, doi. 10.1007/s10973-005-7056-2
- Liao, C. C.;
- Duh, Y. S.;
- Shu, C. M.;
- Tzeng, J. H.
- Article
37
- Journal of Thermal Analysis & Calorimetry, 2006, v. 83, n. 1, p. 107, doi. 10.1007/s10973-005-7062-4
- Chang, Y. M.;
- Hu, K. H.;
- Chen, J. K.;
- Shu, C. M.
- Article
38
- Journal of Thermal Analysis & Calorimetry, 2006, v. 83, n. 1, p. 167, doi. 10.1007/s10973-005-7054-4
- Hou, H. Y.;
- Liao, T. S.;
- Duh, Y. S.;
- Shu, C. M.
- Article
39
- Process Safety & Environmental Protection: Transactions of the Institution of Chemical Engineers Part B, 2009, v. 87, n. 6, p. 353, doi. 10.1016/j.psep.2009.07.005
- Lin, C. P.;
- Chang, H. K.;
- Chang, Y. M.;
- Chen, S. W.;
- Shu, C. M.
- Article
40
- Process Safety & Environmental Protection: Transactions of the Institution of Chemical Engineers Part B, 2008, v. 86, n. 6, p. 415, doi. 10.1016/j.psep.2008.05.004
- Tseng, J. M.;
- Kuo, C. Y.;
- Liu, M. Y.;
- Shu, C. M.
- Article
41
- Process Safety & Environmental Protection: Transactions of the Institution of Chemical Engineers Part B, 2007, v. 85, n. 3, p. 251, doi. 10.1205/psep06055
- Yun, R. L.;
- Wan, T. J.;
- Lin, C. H.;
- Chang, Y. M.;
- Shu, C. M.
- Article
42
- Process Safety & Environmental Protection: Transactions of the Institution of Chemical Engineers Part B, 2007, v. 85, n. 2, p. 125, doi. 10.1205/psep06015
- Tseng, J. M.;
- Shu, C. M.;
- Horng, J. J.;
- Kuan, C. M.;
- Hsu, H. I.
- Article
43
- Process Safety & Environmental Protection: Transactions of the Institution of Chemical Engineers Part B, 2007, v. 85, n. 2, p. 139, doi. 10.1205/psep06019
- Hwang, W. T.;
- Tien, S. W.;
- Shu, C. M.
- Article
44
- Process Safety & Environmental Protection: Transactions of the Institution of Chemical Engineers Part B, 2007, v. 85, n. 2, p. 133, doi. 10.1205/psep06016
- Tsai, D. H.;
- Tseng, J. M.;
- Shu, C. M.;
- Wu, H. J.;
- Su, T. S.
- Article
45
- Clinical & Experimental Immunology, 2015, v. 181, n. 1, p. 142, doi. 10.1111/cei.12624
- Ma, L.;
- Xue, H.‐B.;
- Wang, F.;
- Shu, C.‐M.;
- Zhang, J.‐H.
- Article
46
- Clinical & Experimental Immunology, 2014, v. 175, n. 1, p. 25, doi. 10.1111/cei.12198
- Ma, L.;
- Xue, H.‐B.;
- Guan, X.‐H.;
- Shu, C.‐M.;
- Zhang, J.‐H.;
- Yu, J.
- Article
47
- European Review for Medical & Pharmacological Sciences, 2021, v. 25, n. 19, p. 6077
- ZHANG, C.-X.;
- SHU, C.-M.;
- ZHANG, X.-Y.;
- LIN, X.-T.;
- GUAN, Q.-H.;
- ZHANG, F.;
- ZHI, X.-T.
- Article
48
- Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers Part A, 2007, v. 85, n. 7, p. 1020, doi. 10.1205/cherd06213
- Chang, Y. M.;
- Yun, R. L.;
- Wan, T. J.;
- Shu, C. M.
- Article
49
- Journal of the European Academy of Dermatology & Venereology, 2014, v. 28, n. 8, p. 1079, doi. 10.1111/jdv.12288
- Ma, L.;
- Xue, H. ‐ B.;
- Guan, X. ‐ H.;
- Shu, C. ‐ M.;
- Wang, F.;
- Zhang, J. ‐ H.;
- An, R. ‐ Z.
- Article
50
- Process Safety Progress, 2007, v. 26, n. 4, p. 299, doi. 10.1002/prs.10215
- Wang, Y.-W.;
- Duh, Y.-S.;
- Shu, C.-M.
- Article