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  • 29‐1: Invited Paper: Analysis of Dynamic Strain on Foldable Devices.

    Published in:
    SID Symposium Digest of Technical Papers, 2020, v. 51, n. 1, p. 417, doi. 10.1002/sdtp.13893
    By:
    • Ando, Nao;
    • Hyodo, Kei;
    • Sasaki, Hisao;
    • Ota, Yoshihito;
    • Terasaki, Nao;
    • Sasayama, Tomoki;
    • Yokoi, Yusuke;
    • Shishido, Atsushi;
    • Akamatsu, Norihisa;
    • Taguchi, Ryo
    Publication type:
    Article