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Replantation and revascularization of amputated upper limb appendages outcome and predicting the factors influencing the success rates of these procedures in a tertiary hospital: An 8-year retrospective, cross-sectional study.
Published in:
2018
By:
- Kamarul, Tunku;
- Mansor, Azura;
- Robson, Noorzurani;
- Albusaidi, Salim H. H.;
- Suhaeb, Abdulrazzaq M.;
- Samsudin, Ely Z.;
- Albusaidi, Salim Hh
Publication type:
journal article
Study on Surface Roughness Quality of FDM and MJM Additive Manufacturing Model for Implementation as Investment Casting Sacrificial Pattern.
Published in:
Journal of Mechanical Engineering (1823-5514), 2018, v. 5, p. 25
By:
- Hafsa, M. N.;
- Kassim, N.;
- Ismail, S.;
- Kamaruddin, S. A.;
- Hafeez, T. M.;
- Ibrahim, M.;
- Samsudin, Z. H.
Publication type:
Article
Effect of Stretchable Circuit Deformation on Its Electrical Performance for Automotive Lighting Application.
Published in:
Journal of Mechanical Engineering (1823-5514), 2017, v. 4, p. 279
By:
- Sharif, M. F. M.;
- Saad, A. A.;
- An, F. C.;
- Ali, M. Y. T.;
- Samsudin, Z.
Publication type:
Article
Effect of Stretchable Circuit Deformation on Its Electrical Performance for Automotive Lighting Application.
Published in:
Journal of Mechanical Engineering (1823-5514), 2017, v. 14, p. 279
By:
- Sharif, M. F. M.;
- Saad, A. A.;
- An, F. C.;
- Ali, M. Y. T.;
- Samsudin, Z.
Publication type:
Article
Effect of Stretchable Circuit Deformation on Its Electrical Performance for Automotive Lighting Application.
Published in:
Journal of Mechanical Engineering (1823-5514), 2017, v. 14, n. 2, p. 279
By:
- Sharif, M. F. M.;
- Saad, A. A.;
- An, F. C.;
- Ali, M. Y. T.;
- Samsudin, Z.
Publication type:
Article
Paediatric Whole-body Magnetic Resonance Imaging and its Role in Oncological and Non-oncological Cases.
Published in:
Hong Kong Journal of Radiology, 2022, v. 25, n. 2, p. 149, doi. 10.12809/hkjr2217427
By:
- Mohd Rusli, E. R.;
- Mohd Zaki, F.;
- Samsudin, A. H. Z.;
- C-Khai, L.;
- Hing, E. Y.;
- Alias, H.;
- Abdul Hamid, H.
Publication type:
Article
A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process.
Published in:
International Journal of Advanced Manufacturing Technology, 2019, v. 105, n. 7/8, p. 3521, doi. 10.1007/s00170-019-04573-6
By:
- Ng, Fei Chong;
- Ali, M. Yusuf Tura;
- Abas, Aizat;
- Khor, C. Y.;
- Samsudin, Z.;
- Abdullah, M. Z.
Publication type:
Article
Backward Compatibility Solder Joint Formation at High Peak Reflow Temperature for Aerospace Applications.
Published in:
Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2016, v. 41, n. 5, p. 1813, doi. 10.1007/s13369-015-1986-1
By:
- Che Ani, F.;
- Jalar, A.;
- Ismail, R.;
- Othman, N.;
- Khor, C.;
- Samsudin, Z.;
- Abdullah, M.;
- Azmi, A.
Publication type:
Article

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