Works matching AU Salleh, Mohd Arif Anuar Mohd

Results: 36

Effect of Temperature and Amount of Ag on TiO2 Thin Film Synthesised via Sol–Gel Method: Effect of Temperature and Amount of Ag...: D. S. C. Halin et al.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2672, doi. 10.1007/s11664-025-11767-0

By:

Halin, Dewi Suriyani Che;
Razak, Kamrosni Abdul;
Azhari, Ayu Wazira;
Salleh, Mohd Arif Anuar Mohd;
Karikalan, Dharshini;
Al Bakri Abdullah, Mohd Mustafa;
Nadzri, Nur Izzati Muhammad;
Wahab, Juyana A;
Kaczmarek, Lukasz;
Miszczak, Sebastian

Publication type:

Article

Effect of Epoxy Material Viscosity and Gold Wire Configuration on Light-Emitting Diode Encapsulation Process: Effect of Epoxy Material Viscosity and Gold Wire Configuration: C. Y. Khor et al.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2601, doi. 10.1007/s11664-024-11432-y

By:

Khor, C. Y.;
Abdul Aziz, Mohd Sharizal;
Qi, Chooi Jing;
Lim, Xing Qi;
Ishak, M. H. H.;
Salleh, Mohd Arif Anuar Mohd

Publication type:

Article

Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1169, doi. 10.1007/s11664-023-10782-3

By:

Lee, Jing Rou;
Chong, Mun Xi;
Abdul Aziz, Mohd Sharizal;
Khor, Chu Yee;
Mohd Salleh, Mohd Arif Anuar;
Mohd Arif Zainol, Mohd Remy Rozainy;
Ani, F. Che

Publication type:

Article

Controlling the Layer Thickness of Zinc Oxide Photoanode and the Dye-Soaking Time for an Optimal-Efficiency Dye-Sensitized Solar Cell.

Published in:

Coatings (2079-6412), 2023, v. 13, n. 1, p. 20, doi. 10.3390/coatings13010020

By:

Magiswaran, Kaiswariah;
Norizan, Mohd Natashah;
Mahmed, Norsuria;
Mohamad, Ili Salwani;
Idris, Siti Norhafizah;
Sabri, Mohd Faizul Mohd;
Amin, Nowshad;
Sandu, Andrei Victor;
Vizureanu, Petrica;
Nabiałek, Marcin;
Salleh, Mohd Arif Anuar Mohd

Publication type:

Article

Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor.

Published in:

Coatings (2079-6412), 2023, v. 13, n. 1, p. 12, doi. 10.3390/coatings13010012

By:

Selvan, Mark;
Abdul Aziz, Mohd Sharizal;
Salleh, Mohd Arif Anuar Mohd;
Sharif, Nurulakmal Mohd;
Khor, Chu Yee;
Ong, Heng Pin;
Zainol, Mohd Remy Rozaini Mohd Arif;
Vizureanu, Petrica;
Burduhos-Nergis, Diana-Petronela;
Sandu, Andrei Victor

Publication type:

Article

Metal-Doped TiO 2 Thin Film as an Electron Transfer Layer for Perovskite Solar Cells: A Review.

Published in:

Coatings (2079-6412), 2023, v. 13, n. 1, p. 4, doi. 10.3390/coatings13010004

By:

Che Halin, Dewi Suriyani;
Azhari, Ayu Wazira;
Mohd Salleh, Mohd Arif Anuar;
Muhammad Nadzri, Nur Izzati;
Vizureanu, Petrica;
Abdullah, Mohd Mustafa Al Bakri;
Wahab, Juyana A.;
Sandu, Andrei Victor

Publication type:

Article

High-Entropy Alloy for Thin Film Application: A Review.

Published in:

Coatings (2079-6412), 2022, v. 12, n. 12, p. 1842, doi. 10.3390/coatings12121842

By:

Muhammad Nadzri, Nur Izzati;
Halin, Dewi Suriyani Che;
Al Bakri Abdullah, Mohd Mustafa;
Joseph, Sudha;
Mohd Salleh, Mohd Arif Anuar;
Vizureanu, Petrica;
Burduhos-Nergis, Diana-Petronela;
Sandu, Andrei Victor

Publication type:

Article

Effect of Electromigration and Thermal Ageing on the Tin Whiskers' Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints.

Published in:

Coatings (2079-6412), 2021, v. 11, n. 8, p. 935, doi. 10.3390/coatings11080935

By:

Mokhtar, Noor Zaimah Mohd;
Salleh, Mohd Arif Anuar Mohd;
Sandu, Andrei Victor;
Ramli, Muhammad Mahyiddin;
Chaiprapa, Jitrin;
Vizureanu, Petrica;
Ramli, Mohd Izrul Izwan

Publication type:

Article

Design, Modelling and Optimization of a Novel Concentrated Solar Powered (CSP) Flash Desalination System Involving Direct Heating and Pressure Modulation Using Response Surface Methodology (RSM).

Published in:

Sustainability (2071-1050), 2022, v. 14, n. 18, p. 11558, doi. 10.3390/su141811558

By:

Ahmed, Faizan;
Abdul Aziz, Mohd Sharizal;
Mohd Arif Zainol, Mohd Remy Rozainy;
Yee, Khor Chu;
Shaik, Feroz;
Che Halin, Dewi Suriyani;
Mohd Salleh, Mohd Arif Anuar;
Kheimi, Marwan

Publication type:

Article

Microstructure Evolution of Ag/TiO2 Thin Film.

Published in:

Magnetochemistry, 2021, v. 7, n. 1, p. 1, doi. 10.3390/magnetochemistry7010014

By:

Che Halin, Dewi Suriyani;
Razak, Kamrosni Abdul;
Anuar Mohd Salleh, Mohd Arif;
Izwan Ramli, Mohd Izrul;
Al Bakri Abdullah, Mohd Mustafa;
Azhari, Ayu Wazira;
Kazuhiro Nogita;
Hideyuki Yasuda;
Nabiałek, Marcin;
Wysłocki, Jerzy J.

Publication type:

Article

Alkaline-Activation Technique to Produce Low-Temperature Sintering Activated-HAp Ceramic.

Published in:

Applied Sciences (2076-3417), 2023, v. 13, n. 4, p. 2643, doi. 10.3390/app13042643

By:

Ibrahim, Wan Mohd Arif W.;
Abdullah, Mohd Mustafa Al Bakri;
Jamil, Noorina Hidayu;
Mohamad, Hasmaliza;
Salleh, Mohd Arif Anuar Mohd;
Sandu, Andrei Victor;
Vizureanu, Petrica;
Baltatu, Madalina Simona;
Sukmak, Patimapon

Publication type:

Article

Bonding Strength Characteristics of FA-Based Geopolymer Paste as a Repair Material When Applied on OPC Substrate.

Published in:

Applied Sciences (2076-3417), 2020, v. 10, n. 9, p. 3321, doi. 10.3390/app10093321

By:

Ahmad Zailani, Warid Wazien;
Bouaissi, Aissa;
Abdullah, Mohd Mustafa Al Bakri;
Abd Razak, Rafiza;
Yoriya, Sorachon;
Mohd Salleh, Mohd Arif Anuar;
Rozainy M. A. Z., Mohd Remy;
Fansuri, Hamzah

Publication type:

Article

Vacuum Annealing-Induced Modifications in CoCrFeMnNi Thin Films: Surface Morphology, Conductivity, and Work Function.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4632, doi. 10.1007/s11837-025-07346-7

By:

Sangar, Arnita Surieya;
Muhammad Nadzri, Nur Izzati;
Che Halin, Dewi Suriyani;
Mohd Salleh, Mohd Arif Anuar;
Abdullah, Mohd Mustafa Al Bakri;
Sandu, Andrei Victor;
Putthisigamany, Yoganash;
Vizureanu, Petrica

Publication type:

Article

Surface Modification of GO/TiO2 Thin Film by Sodium Dodecyl Sulphate for Photocatalytic Applications.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2024, v. 76, n. 8, p. 4028, doi. 10.1007/s11837-024-06694-0

By:

Azani, Azliza;
Che Halin, Dewi Suriyani;
Mohd Salleh, Mohd Arif Anuar;
Abdul Razak, Kamrosni;
Abdullah, Mohd Mustafa Al Bakri;
Ramli, Muhammad Mahyiddin;
Vizureanu, Petrica;
Abdul Razak, Mohd Fairul Sharin;
Sandu, Andrei Victor;
Mohamad, Noraiham

Publication type:

Article

Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process.

Published in:

Metals (2075-4701), 2021, v. 11, n. 8, p. 1155, doi. 10.3390/met11081155

By:

Ahmad, Muhammad Iqbal;
Abdul Aziz, Mohd Sharizal;
Abdullah, Mohd Zulkifly;
Salleh, Mohd Arif Anuar Mohd;
Ishak, Mohammad Hafifi Hafiz;
Rahiman, Wan;
Nabiałek, Marcin

Publication type:

Article

The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint.

Published in:

Metals (2075-4701), 2021, v. 11, n. 3, p. 380, doi. 10.3390/met11030380

By:

Ramli, Mohd Izrul Izwan;
Salleh, Mohd Arif Anuar Mohd;
Said, Rita Mohd;
Abdullah, Mohd Mustafa Al Bakri;
Halin, Dewi Suriyani Che;
Saud, Norainiza;
Nabiałek, Marcin;
Vrestal, Jan

Publication type:

Article

A SHORT REVIEW ON THE INFLUENCE OF ANTIMONY ADDITION TO THE MICROSTRUCTURE AND THERMAL PROPERTIES OF LEAD-FREE SOLDER ALLOY.

Published in:

Archives of Metallurgy & Materials, 2023, v. 68, n. 3, p. 981, doi. 10.24425/amm.2023.145463

By:

ZAIMI, NUR SYAHIRAH MOHAMAD;
SALLEH, MOHD ARIF ANUAR MOHD;
AL BAKRI ABDULLAH, MOHD MUSTAFA;
RAMLI, MOHD IZRUL IZWAN

Publication type:

Article

THE INVESTIGATION OF GROUND GRANULATED BLAST FURNACE SLAG GEOPOLYMER AT HIGH TEMPERATURE BY USING ELECTRON BACKSCATTER DIFFRACTION ANALYSIS.

Published in:

Archives of Metallurgy & Materials, 2022, v. 67, n. 1, p. 227, doi. 10.24425/amm.2022.137494

By:

AZIZ, IKMAL HAKEM;
AL BAKRI ABDULLAH, MOHD MUSTAFA;
ANUAR MOHD SALLEH, MOHD ARIF;
YORIYA, SORACHON;
RAZAK, RAFIZA ABD;
MOHAMED, ROSNITA;
BALTATU, MADALINA SIMONA

Publication type:

Article

Effect of Multiple Reflow Cycles and Isothermal Aging on Shear Strength in SAC305/Sn58Bi/Cu-OSP Hybrid Solder Joint.

Published in:

International Journal of Nanoelectronics & Materials, 2024, v. 17, n. 5, p. 341, doi. 10.58915/ijneam.v17idecember.1640

By:

Mokhtar, Muhammad Luqman;
Somidin, Flora;
Anuar Mohd Salleh, Mohd Arif

Publication type:

Article

Comparative Wetting Study of Sn-0.7Cu Solder on Dimple and Pillar Micro-Texture Fabricated by the Photolithography Technique.

Published in:

International Journal of Nanoelectronics & Materials, 2024, v. 17, n. 5, p. 197, doi. 10.58915/ijneam.v17idecember.1626

By:

Wahab, Juyana A.;
Anuar Mohd Salleh, Mohd Arif;
Zakaria, Marliza Mostapha;
Mohd Nazeri, Muhammad Firdaus;
Mohd Mahayuddin, Nurul Aida Husna;
Roduan, Siti Faqihah

Publication type:

Article

Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis.

Published in:

Materials (1996-1944), 2023, v. 16, n. 12, p. 4360, doi. 10.3390/ma16124360

By:

Amli, Siti Farahnabilah Muhd;
Salleh, Mohd Arif Anuar Mohd;
Aziz, Mohd Sharizal Abdul;
Yasuda, Hideyuki;
Nogita, Kazuhiro;
Abdullah, Mohd Mustafa Al Bakri;
Nemes, Ovidiu;
Sandu, Andrei Victor;
Vizureanu, Petrica

Publication type:

Article

Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint.

Published in:

Materials (1996-1944), 2023, v. 16, n. 5, p. 1852, doi. 10.3390/ma16051852

By:

Hashim, Aimi Noorliyana;
Salleh, Mohd Arif Anuar Mohd;
Ramli, Muhammad Mahyiddin;
Abdullah, Mohd Mustafa Al Bakri;
Sandu, Andrei Victor;
Vizureanu, Petrica;
Sandu, Ioan Gabriel

Publication type:

Article

Mechanical Performance, Microstructure, and Porosity Evolution of Fly Ash Geopolymer after Ten Years of Curing Age.

Published in:

Materials (1996-1944), 2023, v. 16, n. 3, p. 1096, doi. 10.3390/ma16031096

By:

Aziz, Ikmal Hakem A.;
Abdullah, Mohd Mustafa Al Bakri;
Razak, Rafiza Abd;
Yahya, Zarina;
Salleh, Mohd Arif Anuar Mohd;
Chaiprapa, Jitrin;
Rojviriya, Catleya;
Vizureanu, Petrica;
Sandu, Andrei Victor;
Tahir, Muhammad FaheemMohd;
Abdullah, Alida;
Jamaludin, Liyana

Publication type:

Article

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.

Published in:

Materials (1996-1944), 2023, v. 16, n. 1, p. 96, doi. 10.3390/ma16010096

By:

Roduan, Siti Faqihah;
Wahab, Juyana A.;
Salleh, Mohd Arif Anuar Mohd;
Mahayuddin, Nurul Aida Husna Mohd;
Abdullah, Mohd Mustafa Al Bakri;
Halil, Aiman Bin Mohd;
Zaifuddin, Amira Qistina Syamimi;
Muhammad, Mahadzir Ishak;
Sandu, Andrei Victor;
Baltatu, Mădălina Simona;
Vizureanu, Petrica

Publication type:

Article

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.

Published in:

Materials (1996-1944), 2022, v. 15, n. 8, p. N.PAG, doi. 10.3390/ma15082758

By:

Zaimi, Nur Syahirah Mohamad;
Salleh, Mohd Arif Anuar Mohd;
Abdullah, Mohd Mustafa Al-Bakri;
Nadzri, Nur Izzati Muhammad;
Sandu, Andrei Victor;
Vizureanu, Petrica;
Ramli, Mohd Izrul Izwan;
Nogita, Kazuhiro;
Yasuda, Hideyuki;
Sandu, Ioan Gabriel

Publication type:

Article

The Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin-Based Geopolymer Ceramic.

Published in:

Materials (1996-1944), 2022, v. 15, n. 7, p. 2667, doi. 10.3390/ma15072667

By:

Ramli, Mohd Izrul Izwan;
Salleh, Mohd Arif Anuar Mohd;
Abdullah, Mohd Mustafa Al Bakri;
Aziz, Ikmal Hakem;
Ying, Tan Chi;
Shahedan, Noor Fifinatasha;
Kockelmann, Winfried;
Fedrigo, Anna;
Sandu, Andrei Victor;
Vizureanu, Petrica;
Chaiprapa, Jitrin;
Burduhos Nergis, Dumitru Doru

Publication type:

Article

Recent Developments in Steelmaking Industry and Potential Alkali Activated Based Steel Waste: A Comprehensive Review.

Published in:

Materials (1996-1944), 2022, v. 15, n. 5, p. 1948, doi. 10.3390/ma15051948

By:

Aziz, Ikmal Hakem;
Abdullah, Mohd Mustafa Al Bakri;
Salleh, Mohd Arif Anuar Mohd;
Ming, Liew Yun;
Li, Long Yuan;
Sandu, Andrei Victor;
Vizureanu, Petrica;
Nemes, Ovidiu;
Mahdi, Shaik Numan

Publication type:

Article

Contribution of Interfacial Bonding towards Geopolymers Properties in Geopolymers Reinforced Fibers: A Review.

Published in:

Materials (1996-1944), 2022, v. 15, n. 4, p. 1496, doi. 10.3390/ma15041496

By:

Yazid, Muhd Hafizuddin;
Faris, Meor Ahmad;
Abdullah, Mohd Mustafa Al Bakri;
Nabiałek, Marcin;
Rahim, Shayfull Zamree Abd;
Salleh, Mohd Arif Anuar Mohd;
Kheimi, Marwan;
Sandu, Andrei Victor;
Rylski, Adam;
Jeż, Bartłomiej

Publication type:

Article

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review.

Published in:

Materials (1996-1944), 2022, v. 15, n. 4, p. 1451, doi. 10.3390/ma15041451

By:

Ramli, Mohd Izrul Izwan;
Salleh, Mohd Arif Anuar Mohd;
Abdullah, Mohd Mustafa Al Bakri;
Zaimi, Nur Syahirah Mohamad;
Sandu, Andrei Victor;
Vizureanu, Petrica;
Rylski, Adam;
Amli, Siti Farahnabilah Muhd

Publication type:

Article

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing.

Published in:

Materials (1996-1944), 2021, v. 14, n. 18, p. 5134, doi. 10.3390/ma14185134

By:

Ramli, Mohd Izrul Izwan;
Salleh, Mohd Arif Anuar Mohd;
Sandu, Andrei Victor;
Amli, Siti Farahnabilah Muhd;
Said, Rita Mohd;
Saud, Norainiza;
Abdullah, Mohd Mustafa Al Bakri;
Vizureanu, Petrica;
Rylski, Adam;
Chaiprapa, Jitrin;
Nabialek, Marcin

Publication type:

Article

Influence of Sintering Temperature of Kaolin, Slag, and Fly Ash Geopolymers on the Microstructure, Phase Analysis, and Electrical Conductivity.

Published in:

Materials (1996-1944), 2021, v. 14, n. 9, p. 2213, doi. 10.3390/ma14092213

By:

Zulkifli, Nur Nadiah Izzati;
Abdullah, Mohd Mustafa Al Bakri;
Przybył, Anna;
Pietrusiewicz, Paweł;
Salleh, Mohd Arif Anuar Mohd;
Aziz, Ikmal Hakem;
Kwiatkowski, Dariusz;
Gacek, Marcin;
Gucwa, Marek;
Chaiprapa, Jitrin;
Torgal, F. Pacheco

Publication type:

Article

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.

Published in:

Materials (1996-1944), 2021, v. 14, n. 4, p. 776, doi. 10.3390/ma14040776

By:

Zaimi, Nur Syahirah Mohamad;
Salleh, Mohd Arif Anuar Mohd;
Sandu, Andrei Victor;
Abdullah, Mohd Mustafa Al Bakri;
Saud, Norainiza;
Rahim, Shayfull Zamree Abd;
Vizureanu, Petrica;
Said, Rita Mohd;
Ramli, Mohd Izrul Izwan;
Gokuldoss, Prashanth Konda

Publication type:

Article

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint.

Published in:

Materials (1996-1944), 2021, v. 14, n. 4, p. 738, doi. 10.3390/ma14040738

By:

Hashim, Aimi Noorliyana;
Salleh, Mohd Arif Anuar Mohd;
Sandu, Andrei Victor;
Ramli, Muhammad Mahyiddin;
Yee, Khor Chu;
Mohd Mokhtar, Noor Zaimah;
Chaiprapa, Jitrin

Publication type:

Article

Strength Development and Elemental Distribution of Dolomite/Fly Ash Geopolymer Composite under Elevated Temperature.

Published in:

Materials (1996-1944), 2020, v. 13, n. 4, p. 1015, doi. 10.3390/ma13041015

By:

Azimi, Emy Aizat;
Abdullah, Mohd Mustafa Al Bakri;
Vizureanu, Petrica;
Salleh, Mohd Arif Anuar Mohd;
Sandu, Andrei Victor;
Chaiprapa, Jitrin;
Yoriya, Sorachon;
Hussin, Kamarudin;
Aziz, Ikmal Hakem

Publication type:

Article

Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint.

Published in:

Materials (1996-1944), 2018, v. 11, n. 11, p. 2229, doi. 10.3390/ma11112229

By:

Somidin, Flora;
Maeno, Hiroshi;
Tran, Xuan Quy;
D. McDonald, Stuart;
Mohd Salleh, Mohd Arif Anuar;
Matsumura, Syo;
Nogita, Kazuhiro

Publication type:

Article

The behavior of Sn whisker growth on Sn-0.7Cu-0.05Ni solder joint during thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 32, p. 1, doi. 10.1007/s10854-024-13805-9

By:

Hashim, Aimi Noorliyana;
Mohd Salleh, Mohd Arif Anuar;
Ramli, Muhammad Mahyiddin;
Al Bakri Abdullah, Mohd Mustafa;
Sandu, Andrei Victor;
Vizureanu, Petrica

Publication type:

Article

Works matching AU Salleh, Mohd Arif Anuar Mohd

Effect of Temperature and Amount of Ag on TiO<sub>2</sub> Thin Film Synthesised via Sol–Gel Method: Effect of Temperature and Amount of Ag...: D. S. C. Halin et al.

Effect of Epoxy Material Viscosity and Gold Wire Configuration on Light-Emitting Diode Encapsulation Process: Effect of Epoxy Material Viscosity and Gold Wire Configuration: C. Y. Khor et al.

Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.

Controlling the Layer Thickness of Zinc Oxide Photoanode and the Dye-Soaking Time for an Optimal-Efficiency Dye-Sensitized Solar Cell.

Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor.

Metal-Doped TiO 2 Thin Film as an Electron Transfer Layer for Perovskite Solar Cells: A Review.

High-Entropy Alloy for Thin Film Application: A Review.

Effect of Electromigration and Thermal Ageing on the Tin Whiskers' Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints.

Design, Modelling and Optimization of a Novel Concentrated Solar Powered (CSP) Flash Desalination System Involving Direct Heating and Pressure Modulation Using Response Surface Methodology (RSM).

Microstructure Evolution of Ag/TiO<sub>2</sub> Thin Film.

Alkaline-Activation Technique to Produce Low-Temperature Sintering Activated-HAp Ceramic.

Bonding Strength Characteristics of FA-Based Geopolymer Paste as a Repair Material When Applied on OPC Substrate.

Vacuum Annealing-Induced Modifications in CoCrFeMnNi Thin Films: Surface Morphology, Conductivity, and Work Function.

Surface Modification of GO/TiO<sub>2</sub> Thin Film by Sodium Dodecyl Sulphate for Photocatalytic Applications.

Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process.

The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint.

A SHORT REVIEW ON THE INFLUENCE OF ANTIMONY ADDITION TO THE MICROSTRUCTURE AND THERMAL PROPERTIES OF LEAD-FREE SOLDER ALLOY.

THE INVESTIGATION OF GROUND GRANULATED BLAST FURNACE SLAG GEOPOLYMER AT HIGH TEMPERATURE BY USING ELECTRON BACKSCATTER DIFFRACTION ANALYSIS.

Effect of Multiple Reflow Cycles and Isothermal Aging on Shear Strength in SAC305/Sn58Bi/Cu-OSP Hybrid Solder Joint.

Comparative Wetting Study of Sn-0.7Cu Solder on Dimple and Pillar Micro-Texture Fabricated by the Photolithography Technique.

Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis.

Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint.

Mechanical Performance, Microstructure, and Porosity Evolution of Fly Ash Geopolymer after Ten Years of Curing Age.

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.

The Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin-Based Geopolymer Ceramic.

Recent Developments in Steelmaking Industry and Potential Alkali Activated Based Steel Waste: A Comprehensive Review.

Contribution of Interfacial Bonding towards Geopolymers Properties in Geopolymers Reinforced Fibers: A Review.

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review.

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing.

Influence of Sintering Temperature of Kaolin, Slag, and Fly Ash Geopolymers on the Microstructure, Phase Analysis, and Electrical Conductivity.

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint.

Strength Development and Elemental Distribution of Dolomite/Fly Ash Geopolymer Composite under Elevated Temperature.

Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint.

The behavior of Sn whisker growth on Sn-0.7Cu-0.05Ni solder joint during thermal cycling.