Found: 25
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Evaluating Cu Printed Interconnects "Sinterconnects" versus Wire Bonds for Switching Converters.
- Published in:
- Electronics (2079-9292), 2022, v. 11, n. 9, p. N.PAG, doi. 10.3390/electronics11091373
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- Article
Die-Level Thinning for Flip-Chip Integration on Flexible Substrates.
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- Electronics (2079-9292), 2022, v. 11, n. 6, p. 849, doi. 10.3390/electronics11060849
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- Article
MWCNT–Epoxy Nanocomposite Sensors for Structural Health Monitoring.
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- Electronics (2079-9292), 2018, v. 7, n. 8, p. 143, doi. 10.3390/electronics7080143
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- Article
Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw's Method.
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- Sensors (14248220), 2020, v. 20, n. 8, p. 2398, doi. 10.3390/s20082398
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- Article
Formation of intermetallic reaction layer and joining strength in nano-composite solder joint.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 3, p. 839, doi. 10.1007/s10854-012-0829-z
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- Article
Ceria reinforced nanocomposite solder foils fabricated by accumulative roll bonding process.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 9, p. 1698, doi. 10.1007/s10854-012-0648-2
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- Article
ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 2, p. 2283, doi. 10.1007/s10854-020-04992-2
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- Publication type:
- Article
Inkjet printed adhesives for advanced M(O)EMS packaging.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 22, p. 20285, doi. 10.1007/s10854-019-02413-7
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- Publication type:
- Article
Sinter bonding of inkjet-printed Ag die-attach as an alternative to Ag paste.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 13, p. 11421, doi. 10.1007/s10854-018-9234-6
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- Publication type:
- Article
A comparative study on direct Cu-Cu bonding methodologies for copper pillar bumped flip-chips.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9347, doi. 10.1007/s10854-018-8965-8
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- Publication type:
- Article
Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn-3.8Ag-0.7Cu solders by adding Co nanoparticles.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 10965, doi. 10.1007/s10854-017-6877-7
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- Publication type:
- Article
High temperature MEMS packages: die-attach solutions for LiNbO under low bonding pressures.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 8784, doi. 10.1007/s10854-017-6605-3
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- Publication type:
- Article
On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.
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- Micromachines, 2020, v. 11, n. 6, p. 564, doi. 10.3390/mi11060564
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- Article
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles.
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- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6143, doi. 10.1007/s11664-016-4832-7
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- Publication type:
- Article
Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength.
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- Journal of Electronic Materials, 2016, v. 45, n. 8, p. 4390, doi. 10.1007/s11664-016-4584-4
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- Publication type:
- Article
Nanoindentation Creep Behavior of Nanocomposite Sn-Ag-Cu Solders.
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- Journal of Electronic Materials, 2012, v. 41, n. 8, p. 2057, doi. 10.1007/s11664-012-2086-6
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- Publication type:
- Article
Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders.
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- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1907, doi. 10.1007/s11664-012-1976-y
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- Article
Self-propagating reactive Al/Ni nanocomposites for bonding applications.
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- 2017
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- Publication type:
- Letter
Experimental solubility and modeling of Crizotinib (anti-cancer medication) in supercritical carbon dioxide.
- Published in:
- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-22366-y
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- Publication type:
- Article
Maxillary tooth displacement in the infratemporal fossa.
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- Dental Research Journal, 2016, v. 13, n. 4, p. 373, doi. 10.4103/1735-3327.187881
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- Publication type:
- Article
Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging.
- Published in:
- Materials (1996-1944), 2022, v. 15, n. 8, p. N.PAG, doi. 10.3390/ma15082786
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- Publication type:
- Article
Evaluation of a post-treatment follow-up program in patients with oral squamous cell carcinoma.
- Published in:
- Clinical Oral Investigations, 2017, v. 21, n. 1, p. 135, doi. 10.1007/s00784-016-1764-9
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- Publication type:
- Article
Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging.
- Published in:
- Energies (19961073), 2021, v. 14, n. 8, p. 2176, doi. 10.3390/en14082176
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- Publication type:
- Article
The effects of pulse plating variables on morphology and corrosion behavior of Zn-Fe alloy coatings.
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- Journal of Coatings Technology & Research, 2012, v. 9, n. 2, p. 215, doi. 10.1007/s11998-010-9249-2
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- Publication type:
- Article
Management of Dental Extraction in a Female Patient with Fanconi Anemia.
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- Journal of Dentistry of Tehran University of Medical Sciences, 2014, v. 11, n. 5, p. 613
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- Publication type:
- Article