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A Universal Method for Extracting and Quantitatively Analyzing Bias‐Dependent Contact Resistance in Carbon‐Nanotube Thin‐Film Transistors.
- Published in:
- Advanced Electronic Materials, 2023, v. 9, n. 3, p. 1, doi. 10.1002/aelm.202201148
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- Article
Ultra-Flexible Monolithic 3D Complementary Metal-Oxide-Semiconductor Electronics.
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- Advanced Functional Materials, 2023, v. 33, n. 48, p. 1, doi. 10.1002/adfm.202305379
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- Article
Mixed‐Dimensional van der Waals Engineering for Charge Transfer Enables Wafer‐Level Flexible Electronics.
- Published in:
- Advanced Functional Materials, 2022, v. 32, n. 36, p. 1, doi. 10.1002/adfm.202205111
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- Article
Hydrogen‐Bonding Integrated Low‐Dimensional Flexible Electronics Beyond the Limitations of van der Waals Contacts (Adv. Mater. 35/2024).
- Published in:
- Advanced Materials, 2024, v. 36, n. 35, p. 1, doi. 10.1002/adma.202470281
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- Article
Hydrogen‐Bonding Integrated Low‐Dimensional Flexible Electronics Beyond the Limitations of van der Waals Contacts.
- Published in:
- Advanced Materials, 2024, v. 36, n. 35, p. 1, doi. 10.1002/adma.202404626
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- Article
Multi‐Body Biomarker Entrapment System: An All‐Encompassing Tool for Ultrasensitive Disease Diagnosis and Epidemic Screening.
- Published in:
- Advanced Materials, 2023, v. 35, n. 46, p. 1, doi. 10.1002/adma.202304119
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- Article