Found: 2

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  • Wafer-scale and universal van der Waals metal semiconductor contact.

    Published in:
    Nature Communications, 2023, v. 14, n. 1, p. 1, doi. 10.1038/s41467-023-36715-6
    By:
    • Kong, Lingan;
    • Wu, Ruixia;
    • Chen, Yang;
    • Huangfu, Ying;
    • Liu, Liting;
    • Li, Wei;
    • Lu, Donglin;
    • Tao, Quanyang;
    • Song, Wenjing;
    • Li, Wanying;
    • Lu, Zheyi;
    • Liu, Xiao;
    • Li, Yunxin;
    • Li, Zhiwei;
    • Tong, Wei;
    • Ding, Shuimei;
    • Liu, Songlong;
    • Ma, Likuan;
    • Ren, Liwang;
    • Wang, Yiliu
    Publication type:
    Article

  • Efficient strain modulation of 2D materials via polymer encapsulation.

    Published in:
    Nature Communications, 2020, v. 11, n. 1, p. 1, doi. 10.1038/s41467-020-15023-3
    By:
    • Li, Zhiwei;
    • Lv, Yawei;
    • Ren, Liwang;
    • Li, Jia;
    • Kong, Lingan;
    • Zeng, Yujia;
    • Tao, Quanyang;
    • Wu, Ruixia;
    • Ma, Huifang;
    • Zhao, Bei;
    • Wang, Di;
    • Dang, Weiqi;
    • Chen, Keqiu;
    • Liao, Lei;
    • Duan, Xidong;
    • Duan, Xiangfeng;
    • Liu, Yuan
    Publication type:
    Article