Works by Ren, F.
1
- International Journal of Nanoscience, 2002, v. 1, n. 2, p. 149, doi. 10.1142/S0219581X02000127
- Lao, J. Y.;
- Wen, J. G.;
- Wang, D. Z.;
- Ren, Z. F.
- Article
2
- International Journal of Information Technology & Decision Making, 2005, v. 4, n. 1, p. 141, doi. 10.1142/S0219622005001428
- Article
3
- Journal of Animal Science, 2010, v. 88, n. 5, p. 1741, doi. 10.2527/jas.2009-2354
- Peng, Y.;
- Ren, F.;
- Yin, J. D.;
- Fang, Q.;
- Li, F. N.;
- Li, D. F.
- Article
4
- Chemical Engineering Communications, 2009, v. 196, n. 9, p. 1030, doi. 10.1080/00986440902896956
- Davies, RyanP.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Norton, D. P.;
- Ivill, M. P.;
- Ren, F.
- Article
5
- Analytical Letters, 2016, v. 49, n. 14, p. 2279, doi. 10.1080/00032719.2016.1144060
- Yang, Y. R.;
- Ren, Y. F.;
- Dong, G. M.;
- Yang, R. J.;
- Liu, H. X.;
- Du, Y. H.;
- Zhang, W. Y.
- Article
6
- Journal of Viral Hepatitis, 2017, v. 24, n. 1, p. 59, doi. 10.1111/jvh.12612
- Li, X.;
- Gou, C.;
- Yao, L.;
- Lei, Z.;
- Gu, T.;
- Ren, F.;
- Wen, T.
- Article
7
- Journal of Viral Hepatitis, 2016, v. 23, n. 1, p. 23, doi. 10.1111/jvh.12438
- Ren, F.;
- Shi, H.;
- Zhang, L.;
- Zhang, X.;
- Wen, T.;
- Xie, B.;
- Zheng, S.;
- Chen, Y.;
- Li, L.;
- Chen, D.;
- Duan, Z.
- Article
8
- Journal of Viral Hepatitis, 2010, v. 17, n. 11, p. 816, doi. 10.1111/j.1365-2893.2009.01242.x
- Ren, F.;
- chen, Y.;
- Wang, Y.;
- Yan, Y.;
- Zhao, J.;
- Ding, M.;
- Zhang, J.;
- Jiang, Y.;
- Zhai, Y.;
- Duan, Z.
- Article
9
- Journal of Viral Hepatitis, 2002, v. 9, n. 3, p. 194, doi. 10.1046/j.1365-2893.2002.00349.x
- Hino, K;
- Korenaga, M;
- Orito, E;
- Katoh, Y;
- Yamaguchi, Y;
- Ren, F;
- Kitase, A;
- Satoh, Y;
- Fujiwara, D;
- Okita, K
- Article
10
- Journal of Power Technologies, 2017, v. 97, n. 2, p. 89
- Yan, D.;
- Bian, D. C.;
- Ren, F.;
- Yin, Z. Q.;
- Zhao, J. C.;
- Niu, S. Q.
- Article
11
- Clinical & Experimental Dermatology, 2016, v. 41, n. 5, p. 541, doi. 10.1111/ced.12853
- Article
12
- European Physical Journal B: Condensed Matter, 2021, v. 94, n. 8, p. 1, doi. 10.1140/epjb/s10051-021-00169-w
- Yang, Z.;
- Song, J. Y.;
- Guo, J. T.;
- Zhao, X. W.;
- Hu, G. C.;
- Yuan, X. B.;
- Ren, J. F.
- Article
13
- Modern Physics Letters B, 2017, v. 31, n. 35, p. -1, doi. 10.1142/S0217984917503353
- Tian, Y. L.;
- Hua, H. L.;
- Yue, W. W.;
- Chen, M. N.;
- Hu, G. C.;
- Ren, J. F.;
- Yuan, X. B.
- Article
14
- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2018, v. 32, n. 9, p. -1, doi. 10.1142/S0217979218501023
- Zhao, X. W.;
- Tian, Y. L.;
- Yue, W. W.;
- Chen, M. N.;
- Hu, G. C.;
- Ren, J. F.;
- Yuan, X. B.
- Article
15
- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2017, v. 31, n. 11, p. -1, doi. 10.1142/S0217979217500722
- Cai, L. L.;
- Tian, Y. L.;
- Yuan, X. B.;
- Hu, G. C.;
- Ren, J. F.
- Article
16
- Journal of Plant Pathology, 2022, v. 104, n. 2, p. 849, doi. 10.1007/s42161-022-01057-7
- Fan, X. D.;
- Dong, Y. F.;
- Zhang, Z. P.;
- Ren, F.;
- Hu, G. J.
- Article
17
- Journal of Plant Pathology, 2014, v. 96, n. 2, p. 403
- Hu, G. J.;
- Dong, Y. F.;
- Zhang, Z. P.;
- Fan, X. D.;
- Ren, F.;
- Zhu, H. J.
- Article
18
- Advanced Materials, 2007, v. 19, n. 19, p. 2889, doi. 10.1002/adma.200602377
- Gao, F.;
- Chen, X. Y.;
- Yin, K. B.;
- Dong, S.;
- Ren, Z. F.;
- Yuan, F.;
- Yu, T.;
- Zou, Z. G.;
- Liu, J.-M.
- Article
19
- Advanced Materials, 2007, v. 19, n. 8, p. 1043, doi. 10.1002/adma.200600527
- Dresselhaus, M. S.;
- Chen, G.;
- Tang, M. Y.;
- Yang, R. G.;
- Lee, H.;
- Wang, D. Z.;
- Ren, Z. F.;
- Fleurial, J.-P.;
- Gogna, P.
- Article
20
- Advanced Materials, 2007, v. 19, n. 3, p. 421, doi. 10.1002/adma.200601187
- Kempa, K.;
- Rybczynski, J.;
- Huang, Z.;
- Gregorczyk, K.;
- Vidan, A.;
- Kimball, B.;
- Carlson, J.;
- Benham, G.;
- Wang, Y.;
- Herczynski, A.;
- Ren, Z. F.
- Article
21
- Advanced Materials, 2006, v. 18, n. 24, p. 3275, doi. 10.1002/adma.200601274
- Wang, W. Z.;
- Zeng, B. Q.;
- Yang, J.;
- Poudel, B.;
- Huang, J. Y.;
- Naughton, M. J.;
- Ren, Z. F.
- Article
22
- Advanced Materials, 2005, v. 17, n. 17, p. 2110, doi. 10.1002/adma.200500514
- W. Z. Wang;
- B. Poudel;
- D. Z. Wang;
- Z. F. Ren
- Article
23
- Advanced Materials, 2000, v. 12, n. 21, p. 1571, doi. 10.1002/1521-4095(200011)12:21<1571::AID-ADMA1571>3.0.CO;2-T
- Article
24
- Journal of Materials Science, 2008, v. 43, n. 21, p. 6925, doi. 10.1007/s10853-008-2988-0
- Tien, L.;
- Pearton, S.;
- Norton, D.;
- Ren, F.
- Article
25
- Journal of Materials Science, 2007, v. 42, n. 17, p. 7294, doi. 10.1007/s10853-007-1606-x
- Wang, Y. H.;
- Jiang, C. Z.;
- Ren, F.;
- Wang, Q. Q.;
- Chen, D. J.;
- Fu, D. J.
- Article
26
- Nature, 2006, v. 439, n. 7074, p. 281, doi. 10.1038/439281a
- Huang, J. Y.;
- Chen, S.;
- Wang, Z. Q.;
- Kempa, K.;
- Wang, Y. M.;
- Jo, S. H.;
- Chen, G.;
- Dresselhaus, M. S.;
- Ren, Z. F.
- Article
27
- Bulletin of Environmental Contamination & Toxicology, 2002, v. 69, n. 4, p. 494, doi. 10.1007/s00128-002-0089-3
- Zhang, Y.;
- Zhu, Y.;
- Wang, S.;
- Zheng, F.;
- Ren, F.;
- Kim, S.-J.
- Article
28
- 2006
- Tanioka T;
- Kawanishi C;
- Tada T;
- Onishi C;
- Locsin RC;
- Ren F;
- Osaka K
- Journal Article
29
- Alimentary Pharmacology & Therapeutics, 2018, v. 47, n. 4, p. 526, doi. 10.1111/apt.14429
- He, Y. L.;
- Yang, S. J.;
- Hu, C. H.;
- Dong, J.;
- Gao, H.;
- Yan, T. T.;
- Liu, J. F.;
- Yang, Y.;
- Ren, D. F.;
- Zhu, L.;
- Zhao, Y. R.;
- Chen, T. Y.
- Article
30
- Epidemiology & Infection, 2014, v. 142, n. 12, p. 2647, doi. 10.1017/S0950268814000272
- HUANG, Y.;
- XU, K.;
- REN, D. F.;
- AI, J.;
- JI, H.;
- GE, A. H.;
- BAO, C. J.;
- SHI, G. Q.;
- SHEN, T.;
- TANG, F. Y.;
- ZHU, Y. F.;
- ZHOU, M. H.;
- WANG, H.
- Article
31
- 2006
- Le Page, C.;
- Ouellet, V.;
- Madore, J.;
- Ren, F.;
- Hudson, T. J.;
- Tonin, P. N.;
- Provencher, D. M.;
- Mes-Masson, A.-M.
- journal article
32
- Journal of Electronic Materials, 2021, v. 50, n. 3, p. 1307, doi. 10.1007/s11664-020-08618-5
- Li, C. J.;
- Yan, Y. F.;
- Ren, X. F.
- Article
33
- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1568, doi. 10.1007/s11664-018-06885-x
- Fares, Chaker;
- Ren, F.;
- Lambers, Eric;
- Hays, David C.;
- Gila, B. P.;
- Pearton, S. J.
- Article
34
- Journal of Electronic Materials, 2009, v. 38, n. 4, p. 490, doi. 10.1007/s11664-008-0596-z
- Johnson, Jason L.;
- Yongho Choi;
- Ural, Ant;
- Lim, Wantae;
- Wright, J. S.;
- Gila, B. P.;
- Ren, F.;
- Pearton, S. J.
- Article
35
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1426, doi. 10.1007/s11664-008-0416-5
- PEARTON, S. J.;
- LIM, W. T.;
- WRIGHT, J. S.;
- TIEN, L. C.;
- KIM, H. S.;
- NORTON, D. P.;
- WANG, H. T.;
- KANG, B. S.;
- REN, F.;
- JUN, J.;
- LIN, J.;
- OSINSKY, A.
- Article
36
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 550, doi. 10.1007/s11664-007-0298-y
- Kang, B. S.;
- Wang, H. T.;
- Ren, F.;
- Hlad, M.;
- Gila, B. P.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Li, C.;
- Low, Z. N.;
- Lin, J.;
- Johnson, J. W.;
- Rajagopal, P.;
- Roberts, J. C.;
- Piner, E. L.;
- Linthicum, K. J.
- Article
37
- Journal of Electronic Materials, 2008, v. 37, n. 4, p. 384, doi. 10.1007/s11664-007-0326-y
- Anderson, T. J.;
- Ren, F.;
- Kim, J.;
- Lin, J.;
- Hlad, M.;
- Gila, B. P.;
- Voss, L.;
- Pearton, S. J.;
- Bove, P.;
- Lahreche, H.;
- Thuret, J.
- Article
38
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 161, doi. 10.1007/s11664-007-0334-y
- Lim, W. T.;
- Sadik, P. W.;
- Norton, D. P.;
- Gila, B. P.;
- Pearton, S. J.;
- Kravchenko, I. I.;
- Ren, F.
- Article
39
- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1662, doi. 10.1007/s11664-007-0277-3
- Voss, L. F.;
- Stafford, L.;
- Khanna, R.;
- Gila, B. P.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Ren, F.;
- Kravchenko, I. I.
- Article
40
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 384, doi. 10.1007/s11664-006-0054-8
- Voss, L. F.;
- Stafford, L.;
- Thaler, G. T.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Chen, J.-J.;
- Ren, F.
- Article
41
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 488, doi. 10.1007/s11664-006-0039-7
- Wright, J. S.;
- Stafford, L.;
- Gila, B. P.;
- Norton, D. P.;
- Pearton, S. J.;
- Hung-Ta Wang;
- Ren, F.
- Article
42
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 368, doi. 10.1007/s11664-006-0037-9
- Chen, J.-J.;
- Hlad, M.;
- Gerger, A. P.;
- Gila, B. P.;
- Ren, F.;
- Abernathy, C. R.;
- Pearton, S. J.
- Article
43
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 379, doi. 10.1007/s11664-006-0036-x
- Khanna, Rohit;
- Stafford, L.;
- Pearton, S. J.;
- Anderson, T. J.;
- Ren, F.;
- Kravchenko, I. I.;
- Dabiran, Amir;
- Osinsky, A.;
- Joon Yeob Lee;
- Kwan-Young Lee;
- Jihyun Kim
- Article
44
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 519, doi. 10.1007/s11664-006-0035-y
- Allums, K. K.;
- Hlad, M.;
- Gerger, A. P.;
- Gila, B. P.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Ren, F.;
- Dwivedi, R.;
- Fogarty, T. N.;
- Wilkins, R.
- Article
45
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 862, doi. 10.1007/BF02692541
- Pearton, S. J.;
- Norton, D. P.;
- Heo, Y. W.;
- Tien, L. C.;
- Ivill, M. P.;
- Li, Y.;
- Kang, B. S.;
- Ren, F.;
- Kelly, J.;
- Hebard, A. F.
- Article
46
- Journal of Electronic Materials, 2006, v. 35, n. 4, p. 738, doi. 10.1007/s11664-006-0131-z
- Chih-Yang Chang;
- Gou-Chung Chi;
- Wei-Ming Wang;
- Li-Chyong Chen;
- Kuei-Hsien Chen;
- Ren, F.;
- Pearton, S. J.
- Article
47
- Journal of Electronic Materials, 2006, v. 35, n. 4, p. 685, doi. 10.1007/s11664-006-0121-1
- Soohwan Jang;
- Ren, F.;
- Pearton, S. J.;
- Gila, B. P.;
- Hlad, M.;
- Abernathy, C. R.;
- Hyucksoo Yang;
- Pan, C. J.;
- Jenn-Inn Chyi;
- Bove, P.;
- Lahreche, H.;
- Thuret, J.
- Article
48
- Journal of Electronic Materials, 2006, v. 35, n. 4, p. 680, doi. 10.1007/s11664-006-0120-2
- Hlad, M.;
- Voss, L.;
- Gila, B. P.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Ren, F.
- Article
49
- Journal of Electronic Materials, 2006, v. 35, n. 4, p. 675, doi. 10.1007/s11664-006-0119-8
- Anderson, T. J.;
- Ren, F.;
- Covert, L.;
- Lin, J.;
- Pearton, S. J.;
- Dalrymple, T. W.;
- Bozada, C.;
- Fitch, R. C.;
- Moser, N.;
- Bedford, R. G.;
- Schimpf, M.
- Article
50
- Journal of Electronic Materials, 2006, v. 35, n. 4, p. 658, doi. 10.1007/s11664-006-0116-y
- Khanna, Rohit;
- Pearton, S. J.;
- Ren, F.;
- Kravchenko, I.
- Article