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Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration.
- Published in:
- Journal of Electronic Materials, 2020, v. 49, n. 11, p. 6737, doi. 10.1007/s11664-020-08399-x
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- Article
Ultra-High Density, Thin-Film Tantalum Capacitors with Improved Frequency Characteristics for MHz Switching Power Converters.
- Published in:
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5632, doi. 10.1007/s11664-018-6466-4
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- Article
Multilayered Electromagnetic Interference Shielding Structures for Suppressing Magnetic Field Coupling.
- Published in:
- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5243, doi. 10.1007/s11664-018-6387-2
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- Article
3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 3, p. 107, doi. 10.4071/imaps.656641
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- Article
Passive Impedance-Matched Neural Recording Systems for Improved Signal Sensitivity.
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- Sensors (14248220), 2023, v. 23, n. 14, p. 6441, doi. 10.3390/s23146441
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- Article
Hydrothermal Barium Titanate Thin-Film Characteristics and their Suitability as Decoupling Capacitors.
- Published in:
- Journal of the American Ceramic Society, 2010, v. 93, n. 9, p. 2764, doi. 10.1111/j.1551-2916.2010.03775.x
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- Article