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Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices.
- Published in:
- Micromachines, 2023, v. 14, n. 7, p. 1297, doi. 10.3390/mi14071297
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- Article
Short-Pulse Laser-Assisted Fabrication of a Si-SiO 2 Microcooling Device.
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- Micromachines, 2021, v. 12, n. 9, p. 1054, doi. 10.3390/mi12091054
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- Article
Neutrino tagging: a new tool for accelerator based neutrino experiments.
- Published in:
- European Physical Journal C -- Particles & Fields, 2022, v. 82, n. 5, p. 1, doi. 10.1140/epjc/s10052-022-10397-8
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- Article