Works by Pecht, Michael

Results: 105

Learnable Wavelet Scattering Networks: Applications to Fault Diagnosis of Analog Circuits and Rotating Machinery.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 3, p. 451, doi. 10.3390/electronics11030451

By:

Khemani, Varun;
Azarian, Michael H.;
Pecht, Michael G.

Publication type:

Article

Diversity maximization-based transfer diagnosis approach of rotating machinery.

Published in:

Structural Health Monitoring, 2024, v. 23, n. 1, p. 410, doi. 10.1177/14759217231164921

By:

She, Daoming;
Chen, Jin;
Yan, Xiaoan;
Zhao, Xiaoli;
Pecht, Michael

Publication type:

Article

Part manufacturer assessment process.

Published in:

Quality & Reliability Engineering International, 1999, v. 15, n. 6, p. 457, doi. 10.1002/(SICI)1099-1638(199911/12)15:6<457::AID-QRE293>3.0.CO;2-6

By:

Jackson, Margaret;
Mathur, Anant;
Pecht, Michael;
Kendall, Roxy

Publication type:

Article

A risk-informed methodology for parts selection and management.

Published in:

Quality & Reliability Engineering International, 1999, v. 15, n. 4, p. 261, doi. 10.1002/(SICI)1099-1638(199907/08)15:4<261::AID-QRE269>3.0.CO;2-0

By:

Jackson, Margaret;
Sandborn, Peter;
Pecht, Michael;
Hemens-Davis, Chantal;
Audette, Pierre

Publication type:

Article

THE INFLUENCE OF TEMPERATURE ON INTEGRATED CIRCUIT FAILURE MECHANISMS.

Published in:

Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 167, doi. 10.1002/qre.4680080304

By:

Pecht, Michael;
Lall, Pradeep

Publication type:

Article

TEMPERATURE DEPENDENCE OF MICROELECTRONIC DEVICE FAILURES.

Published in:

Quality & Reliability Engineering International, 1990, v. 6, n. 4, p. 275, doi. 10.1002/qre.4680060410

By:

Pecht, Michael;
Lall, Pradeep;
Whelan, Stanley J.

Publication type:

Article

THE RELIABILITY PHYSICS APPROACH TO FAILURE PREDICTION MODELLING.

Published in:

Quality & Reliability Engineering International, 1990, v. 6, n. 4, p. 267, doi. 10.1002/qre.4680060409

By:

Pecht, Michael;
Dasgupta, Abhijit;
Barker, Donald;
Leonard, Charles T.

Publication type:

Article

HOW FAILURE PREDICTION METHODOLOGY AFFECTS ELECTRONIC EQUIPMENT DESIGN.

Published in:

Quality & Reliability Engineering International, 1990, v. 6, n. 4, p. 243, doi. 10.1002/qre.4680060406

By:

Leonard, Charles T.;
Pecht, Michael

Publication type:

Article

Translation Invariance-Based Deep Learning for Rotating Machinery Diagnosis.

Published in:

Shock & Vibration, 2020, p. 1, doi. 10.1155/2020/1635621

By:

Du, Wenliao;
Wang, Shuangyuan;
Gong, Xiaoyun;
Wang, Hongchao;
Yao, Xingyan;
Pecht, Michael

Publication type:

Article

Online monitoring of oil wear debris image based on CNN.

Published in:

Mechanics & Industry, 2022, v. 23, n. 1, p. 1, doi. 10.1051/meca/2022006

By:

Wang, Han;
Zuo, Hongfu;
Liu, Zhenzhen;
Zhou, Di;
Yan, Hongsheng;
Zhao, Xin;
Pecht, Michael

Publication type:

Article

A Reliability and Risk Assessment of Solar Photovoltaic Panels Using a Failure Mode and Effects Analysis Approach: A Case Study.

Published in:

Sustainability (2071-1050), 2024, v. 16, n. 10, p. 4183, doi. 10.3390/su16104183

By:

Patil, Rajkumar Bhimgonda;
Khalkar, Arun;
Al-Dahidi, Sameer;
Pimpalkar, Rita S.;
Bhandari, Sheetal;
Pecht, Michael

Publication type:

Article

Fault detection in bearings using autocorrelation.

Published in:

International Journal of COMADEM, 2017, v. 20, n. 4, p. 37

By:

Shah, Rushit N.;
Azarian, Michael H.;
Pecht, Michael G.

Publication type:

Article

Prognostics and Health Management for Next Generation LED Lighting Systems.

Published in:

International Journal of COMADEM, 2012, v. 15, n. 1, p. 34

By:

Gang Niu;
Lau, Daniel;
Pecht, Michael

Publication type:

Article

Experimental Approach to Determine Damage Curves for SnAgCu Solder Under Sequential Cyclic Loads.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 2, p. 1412, doi. 10.1007/s11664-019-07811-5

By:

George, Elviz;
Chen, Deng Yun;
Osterman, Michael;
Pecht, Michael

Publication type:

Article

Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 11, p. 4549, doi. 10.1007/s11664-015-3931-1

By:

Menon, Sandeep;
Osterman, Michael;
Pecht, Michael

Publication type:

Article

Review of Capabilities of the ENEPIG Surface Finish.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3885, doi. 10.1007/s11664-014-3322-z

By:

Ratzker, Menahem;
Pearl, Adam;
Osterman, Michael;
Pecht, Michael;
Milad, George

Publication type:

Article

Copper Wire Bonding Concerns and Best Practices.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2415, doi. 10.1007/s11664-013-2576-1

By:

Chauhan, Preeti;
Zhong, Z.;
Pecht, Michael

Publication type:

Article

Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2606, doi. 10.1007/s11664-013-2575-2

By:

Srinivas, Vikram;
Menon, Sandeep;
Osterman, Michael;
Pecht, Michael

Publication type:

Article

Modeling the Electrical Conduction in Epoxy-BaTiO Nanocomposites.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1101, doi. 10.1007/s11664-013-2523-1

By:

Alam, Mohammed;
Azarian, Michael;
Pecht, Michael

Publication type:

Article

Failure Causes of a Polymer Resettable Circuit Protection Device.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2419, doi. 10.1007/s11664-012-2148-9

By:

Cheng, Shunfeng;
Tom, Kwok;
Pecht, Michael

Publication type:

Article

Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2508, doi. 10.1007/s11664-012-2179-2

By:

Han, Sungwon;
Osterman, Michael;
Meschter, Stephan;
Pecht, Michael

Publication type:

Article

Embedded Capacitors in Printed Wiring Board: A Technological Review.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 8, p. 2286, doi. 10.1007/s11664-012-2044-3

By:

Alam, Mohammed;
Azarian, Michael;
Pecht, Michael

Publication type:

Article

Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1921, doi. 10.1007/s11664-011-1672-3

By:

He, Xiaofei;
Azarian, Michael;
Pecht, Michael

Publication type:

Article

Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 8, p. 1218, doi. 10.1007/s11664-010-1209-1

By:

Nie, Lei;
Mueller, Maik;
Osterman, Michael;
Pecht, Michael

Publication type:

Article

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z

By:

Weiqiang Wang;
Choubey, Anupam;
Azarian, Michael;
Pecht, Michael

Publication type:

Article

Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1130, doi. 10.1007/s11664-008-0466-8

By:

CHOUBEY, ANUPAM;
HAO YU;
OSTERMAN, MICHAEL;
PECHT, MICHAEL;
FU YUN;
LI YONGHONG;
XU MING

Publication type:

Article

Prognostics and Health Assessment Implementation for Electronic Products.

Published in:

Journal of the IEST, 2010, v. 53, n. 1, p. 44, doi. 10.17764/jiet.53.1.18763271g23n61x0

By:

Gu, Jie;
Pecht, Michael

Publication type:

Article

Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads.

Published in:

Journal of the IEST, 2007, v. 50, n. 1, p. 86, doi. 10.17764/jiet.50.1.l5721m6160258l22

By:

Mathew, Sony;
Das, Diganta;
Osterman, Michael;
Pecht, Michael

Publication type:

Article

Effect of different lubricant films on contact resistance of stationary separable gold-plated electrical contacts.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14368, doi. 10.1007/s10854-019-01806-y

By:

Kaushik, Lovlesh;
Azarian, Michael H.;
Pecht, Michael

Publication type:

Article

Effects of Sn addition on the microstructure and properties of Bi-11Ag high-temperature solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 14, p. 12028, doi. 10.1007/s10854-018-9308-5

By:

Yin, Limeng;
Li, Dong;
Yao, Zongxiang;
Wang, Gang;
Das, Diganta;
Pecht, Michael

Publication type:

Article

High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 4021, doi. 10.1007/s10854-015-2940-4

By:

Menon, Sandeep;
George, Elviz;
Osterman, Michael;
Pecht, Michael

Publication type:

Article

Detection of capacitor electrolyte residues with FTIR in failure analysis.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 635, doi. 10.1007/s10854-013-1146-x

By:

Shrivastava, Anshul;
Bangerth, Stefan;
Azarian, Michael;
Morillo, Carlos;
Pecht, Michael;
Levin, Mark;
Steinhardt, Larry;
Callini, Andrew

Publication type:

Article

Counterfeit capacitors in the supply chain.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 645, doi. 10.1007/s10854-013-1147-9

By:

Shrivastava, Anshul;
Pecht, Michael

Publication type:

Article

Erratum to: The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures.

Published in:

2013

By:

Yin, Limeng;
Wei, Song;
Xu, Zhangliang;
Geng, Yanfei;
Das, Diganta;
Pecht, Michael

Publication type:

Correction Notice

Effects of moisture absorption on the electrical parameters of embedded capacitors with epoxy-BaTiO nanocomposite dielectric.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 8, p. 1504, doi. 10.1007/s10854-011-0618-0

By:

Alam, Mohammed;
Azarian, Michael;
Pecht, Michael

Publication type:

Article

Disassembly methodology for conducting failure analysis on lithium-ion batteries.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 10, p. 1616, doi. 10.1007/s10854-011-0452-4

By:

Williard, Nick;
Sood, Bhanu;
Osterman, Michael;
Pecht, Michael

Publication type:

Article

Screening for counterfeit electronic parts.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 10, p. 1511, doi. 10.1007/s10854-011-0500-0

By:

Sood, Bhanu;
Das, Diganta;
Pecht, Michael

Publication type:

Article

Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardants.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 10, p. 1602, doi. 10.1007/s10854-011-0449-z

By:

Sood, Bhanu;
Pecht, Michael

Publication type:

Article

CONDITION MONITORING OF A WORM-TYPE GEARBOX IN TERMS OF TRIBO-PROGNOSTICS THROUGH VIBRO-THERMAL ANALYSIS.

Published in:

Proceedings of the Romanian Academy, Series A: Mathematics, Physics, Technical Sciences, Information Science, 2021, v. 22, n. 1, p. 83

By:

EROL, S. Seckin;
PECHT, Michael

Publication type:

Article

OPTIMIZED REDUNDANCY ALLOCATION FOR ELECTRONIC EQUIPMENT.

Published in:

Engineering Optimization, 1988, v. 14, n. 2, p. 101, doi. 10.1080/03052158808941203

By:

PECHT, MICHAEL G.;
AZARM, SHAPOUR;
PRAHARAJ, SRINIBAS Y.

Publication type:

Article

KNOWLEDGE GATHERING FOR HEURISTIC PROGRAMMING IN DESIGN OPTIMIZATION.

Published in:

Engineering Optimization, 1987, v. 11, n. 3/4, p. 317, doi. 10.1080/03052158708941054

By:

AZARM, SHAPOUR;
PECHT, MICHAEL

Publication type:

Article

Position and enforcement practice of the People's Republic of China's pharmaceutical data exclusivity protection.

Published in:

Drug Design, Development & Therapy, 2016, v. 10, p. 2015, doi. 10.2147/DDDT.S104642

By:

Na Li;
Xiang Yu;
Michael Pecht

Publication type:

Article

Precursor monitoring approach for reliability assessment of cooling fans.

Published in:

Journal of Intelligent Manufacturing, 2012, v. 23, n. 2, p. 173, doi. 10.1007/s10845-009-0342-2

By:

Oh, Hyunseok;
Shibutani, Tadahiro;
Pecht, Michael

Publication type:

Article

Assessment of Reliability Allocation Methods for Electronic Systems: A Systematic and Bibliometric Analysis.

Published in:

Stats, 2025, v. 8, n. 1, p. 11, doi. 10.3390/stats8010011

By:

Patil, Rajkumar B.;
Kyeong, San;
Pecht, Michael;
Gujar, Rahul A.;
Mane, Sandip

Publication type:

Article

Quantum Computing: Navigating the Future of Computation, Challenges, and Technological Breakthroughs.

Published in:

Quantum Reports, 2024, v. 6, n. 4, p. 627, doi. 10.3390/quantum6040039

By:

Memon, Qurban A.;
Al Ahmad, Mahmoud;
Pecht, Michael

Publication type:

Article

Evaluation of Present Accelerated Temperature Testing and Modeling of Batteries.

Published in:

Applied Sciences (2076-3417), 2018, v. 8, n. 10, p. 1786, doi. 10.3390/app8101786

By:

Diao, Weiping;
Xing, Yinjiao;
Saxena, Saurabh;
Pecht, Michael

Publication type:

Article

Computed Tomography Analysis of Li-Ion Battery Case Ruptures.

Published in:

Fire Technology, 2020, v. 56, n. 6, p. 2565, doi. 10.1007/s10694-020-00996-w

By:

Kong, Lingxi;
Hu, Xiaosong;
Gui, Guan;
Su, Yan;
Pecht, Michael

Publication type:

Article

Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders.

Published in:

Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 4, p. 137, doi. 10.4071/imaps.424

By:

George, Elviz;
Osterman, Michael;
Pecht, Michael;
Coyle, Richard;
Parker, Richard;
Benedetto, Elizabeth

Publication type:

Article

Small data challenges for intelligent prognostics and health management: a review.

Published in:

Artificial Intelligence Review, 2024, v. 57, n. 8, p. 1, doi. 10.1007/s10462-024-10820-4

By:

Li, Chuanjiang;
Li, Shaobo;
Feng, Yixiong;
Gryllias, Konstantinos;
Gu, Fengshou;
Pecht, Michael

Publication type:

Article

Reliability modeling for planetary gear transmission system considering dependent failure processes.

Published in:

Quality & Reliability Engineering International, 2022, v. 38, n. 1, p. 229, doi. 10.1002/qre.2972

By:

Lyu, Hao;
Wang, Shuai;
Ma, Li;
Zhang, Xiaowen;
Pecht, Michael

Publication type:

Article