Found: 2
Select item for more details and to access through your institution.
Thermal interface materials for cooling microelectronic systems: present status and future challenges.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 9, p. 11339, doi. 10.1007/s10854-021-05635-w
- By:
- Publication type:
- Article
Thermal conformance parameters for assessment of heat transfer between similar and dissimilar metal contacts.
- Published in:
- Heat Transfer, 2024, v. 53, n. 5, p. 2416, doi. 10.1002/htj.23036
- By:
- Publication type:
- Article