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P‐153: Improved Flexoelectric Coefficient Measurement by Means of Transmission Ellipsometry.
- Published in:
- SID Symposium Digest of Technical Papers, 2019, v. 50, n. 1, p. 1810, doi. 10.1002/sdtp.13309
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- Article
A Study of Difference in Reflow Characteristics Between Electroplated and Sputtered Cu in a Dual-Damascene Fabrication Process for Silicon Semiconductor Devices.
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- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1384, doi. 10.1007/s11664-011-1521-4
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- Article
Void Growth Behavior in ULSI Cu Interconnections by Grain-Boundary Diffusion Simulation.
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- Journal of Electronic Materials, 2010, v. 39, n. 10, p. 2255, doi. 10.1007/s11664-010-1311-4
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- Article
Reflow Phenomenon Analysis of Large Scale Integrated Cu Interconnections in Via Holes by Viscoelastic Deformation Simulation.
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- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 318, doi. 10.1007/s11664-010-1081-z
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- Article
Improvement of the Form Accuracy of a Slender Workpiece in Cylindrical Traverse Grinding.
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- International Journal of Automation Technology, 2019, v. 13, n. 6, p. 728, doi. 10.20965/ijat.2019.p0728
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- Article
Influence of different air CT numbers for IVDT on the dose distribution in TomoTherapy MVCT.
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- Journal of Applied Clinical Medical Physics, 2023, v. 24, n. 2, p. 1, doi. 10.1002/acm2.13835
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- Article
Tolerance levels of mass density for adaptive helical tomotherapy using MVCT.
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- Journal of Radiation Research, 2023, v. 64, n. 1, p. 195, doi. 10.1093/jrr/rrac071
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- Article