Works matching AU Nozawa, Shigeyoshi

Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 10, p. 1066, doi. 10.1007/s10854-010-0099-6

By:

• Baated, Alongheng;
• Keun-Soo Kim;
• Suganuma, Katsuaki;
• Huang, Sharon;
• Jurcik, Benjamin;
• Nozawa, Shigeyoshi;
• Ueshima, Minoru

Publication type:

Article