Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 41, doi. 10.1007/s10854-011-0402-1
- By:
- Publication type:
- Article
Works by Noh, Bo
Results: 20
1
2
Effect of adding Ce on interfacial reactions between Sn-Ag solder and Cu.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 745, doi. 10.1007/s10854-010-0204-x
- By:
- Publication type:
- Article
3
Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni-Cr)/PI interfaces in flexible printed circuits.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 790, doi. 10.1007/s10854-010-0213-9
- By:
- Publication type:
- Article
4
Interfacial reaction between Au-Sn solder and Au/Ni-metallized Kovar.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 1, p. 84, doi. 10.1007/s10854-010-0089-8
- By:
- Publication type:
- Article
5
Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 885, doi. 10.1007/s10854-008-9811-1
- By:
- Publication type:
- Article
6
Characteristics of environmental factor for electrochemical migration on printed circuit board.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 10, p. 952, doi. 10.1007/s10854-007-9421-3
- By:
- Publication type:
- Article
7
Effect of underfill on bending fatigue behavior of chip scale package.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 406, doi. 10.1007/s10854-007-9354-x
- By:
- Publication type:
- Article
8
Electrical properties and interfacial reaction of BGA package with underfill.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 1, p. 75, doi. 10.1007/s10854-007-9282-9
- By:
- Publication type:
- Article
9
Thermal oxidative stability of corn oil in ultra-high temperature short-time processed seasoned laver.
- Published in:
- Food Science & Biotechnology, 2015, v. 24, n. 3, p. 947, doi. 10.1007/s10068-015-0122-z
- By:
- Publication type:
- Article
10
Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste.
- Published in:
- Journal of Adhesion Science & Technology, 2008, v. 22, n. 13, p. 1355, doi. 10.1163/156856108X309512
- By:
- Publication type:
- Article
11
Role of NADPH Oxidase 4 in Corneal Endothelial Cells Is Mediated by Endoplasmic Reticulum Stress and Autophagy.
- Published in:
- Antioxidants, 2023, v. 12, n. 6, p. 1228, doi. 10.3390/antiox12061228
- By:
- Publication type:
- Article
12
A p-Tyr42 RhoA Inhibitor Promotes the Regeneration of Human Corneal Endothelial Cells by Ameliorating Cellular Senescence.
- Published in:
- Antioxidants, 2023, v. 12, n. 6, p. 1186, doi. 10.3390/antiox12061186
- By:
- Publication type:
- Article
13
Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF).
- Published in:
- Journal of Adhesion, 2009, v. 85, n. 6, p. 341, doi. 10.1080/00218460902880198
- By:
- Publication type:
- Article
14
SURFACE MODIFICATION OF PLASMA TREATMENT ON SiO<sub>2</sub> LAYER WITH UNDERFILL.
- Published in:
- Surface Review & Letters, 2007, v. 14, n. 4, p. 849, doi. 10.1142/S0218625X07010160
- By:
- Publication type:
- Article
15
Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1950, doi. 10.1007/s11664-011-1686-x
- By:
- Publication type:
- Article
16
Effects of Different Kinds of Underfills and Temperature-Humidity Treatments on Drop Reliability of Board-Level Packages.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 224, doi. 10.1007/s11664-010-1423-x
- By:
- Publication type:
- Article
17
Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 35, doi. 10.1007/s11664-010-1408-9
- By:
- Publication type:
- Article
18
Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 902, doi. 10.1007/s11664-009-0737-z
- By:
- Publication type:
- Article
19
Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 46, doi. 10.1007/s11664-008-0543-z
- By:
- Publication type:
- Article
20
No borna disease virus-specific RNA detected in blood of race horses and jockeys.
- Published in:
- Acta Neuropsychiatrica, 2006, v. 18, n. 3/4, p. 177, doi. 10.1111/j.1601-5215.2006.00118.x
- By:
- Publication type:
- Article