Found: 7
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Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 78, doi. 10.4071/imaps.873073
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- Publication type:
- Article
Year-long 500°C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated Circuits.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 4, p. 163, doi. 10.4071/imaps.729648
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- Publication type:
- Article
Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 11, doi. 10.4071/imaps.529
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- Article
CIB: An Improved Communication Architecture for Real-Time Monitoring of Aerospace Materials, Instruments, and Sensors on the ISS.
- Published in:
- Scientific World Journal, 2013, p. 1, doi. 10.1155/2013/185769
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- Publication type:
- Article
CIB: an improved communication architecture for real-time monitoring of aerospace materials, instruments, and sensors on the ISS.
- Published in:
- 2013
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- Publication type:
- journal article
Cross-sectional TEM and KOH-Etch Studies of Extended Defects in 3C-SiC p<sup>+</sup>n Junction Diodes Grown on 4H-SiC Mesas.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 672, doi. 10.1007/s11664-007-0297-z
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- Publication type:
- Article
Epitaxial SiC Growth Morphology and Extended Defects Investigated by Electron Backscatter Diffraction and Electron Channeling Contrast Imaging.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 691, doi. 10.1007/s11664-007-0308-0
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- Publication type:
- Article