Found: 13
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Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder.
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- Journal of Electronic Materials, 2013, v. 42, n. 12, p. 3559, doi. 10.1007/s11664-013-2763-0
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- Article
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder.
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- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 223, doi. 10.1007/s11664-009-0970-5
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- Article
Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2479, doi. 10.1007/s11664-009-0925-x
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- Article
Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder.
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- Journal of Electronic Materials, 2008, v. 37, n. 4, p. 515, doi. 10.1007/s11664-008-0379-6
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- Article
Lead-Free Solder Reinforced with Multiwalled Carbon Nanotubes.
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- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1518, doi. 10.1007/s11664-006-0142-9
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- Article
Texture evolution in a CrMnFeCoNi high-entropy alloy manufactured by laser powder bed fusion.
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- Journal of Materials Science, 2022, v. 57, n. 21, p. 9714, doi. 10.1007/s10853-022-07025-x
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- Article
INDENTATION SIZE EFFECT ON THE CREEP BEHAVIOR OF A SnAgCu SOLDER.
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- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2010, v. 24, n. 1/2, p. 267, doi. 10.1142/S0217979210064204
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- Article
Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 3, p. 315, doi. 10.1007/s10854-010-0135-6
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- Article
NANOMECHANICAL PROPERTIES OF A Sn-Ag-Cu SOLDER REINFORCED WITH Ni-COATED CARBON NANOTUBES.
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- International Journal of Nanoscience, 2010, v. 9, n. 4, p. 283, doi. 10.1142/S0219581X10006818
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- Article
DEVELOPMENT OF NOVEL LEAD-FREE SOLDER COMPOSITES USING CARBON NANOTUBE REINFORCEMENTS.
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- International Journal of Nanoscience, 2005, v. 4, n. 4, p. 423, doi. 10.1142/S0219581X0500367X
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- Article
Integrating copper at the nanometer length scale with Sn-3⋅5Ag solder to develop high performance nanocomposites.
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- Materials Science & Technology, 2009, v. 25, n. 10, p. 1258, doi. 10.1179/174328408X378582
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- Article
Using carbon nanotubes to enhance creep performance of lead free solder.
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- Materials Science & Technology, 2008, v. 24, n. 4, p. 443, doi. 10.1179/174328408X282155
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- Article
Synthesis and wear of Al based, free standing functionally gradient materials: effects of different reinforcements.
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- Materials Science & Technology, 2004, v. 20, n. 1, p. 57, doi. 10.1179/026708304225010352
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- Article