Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 3, p. 855, doi. 10.1007/s11664-020-08641-6

By:

• Muhd Amli, S. F. N.;
• Mohd Salleh, M. A. A.;
• Ramli, M. I. I.;
• Abdul Razak, N. R.;
• Yasuda, H.;
• Chaiprapa, J.;
• Nogita, K.

Publication type:

Article