Found: 2
Select item for more details and to access through your institution.
Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint.
- Published in:
- Materials (1996-1944), 2021, v. 14, n. 4, p. 738, doi. 10.3390/ma14040738
- By:
- Publication type:
- Article
Effect of Electromigration and Thermal Ageing on the Tin Whiskers' Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints.
- Published in:
- Coatings (2079-6412), 2021, v. 11, n. 8, p. 935, doi. 10.3390/coatings11080935
- By:
- Publication type:
- Article