Perspective of NO<sub>2</sub> Sensor Using Armchair-Graphene Nanoribbon via Dopant Engineering.
- Published in:
- Journal of Electronic Materials, 2025, v. 54, n. 8, p. 6204, doi. 10.1007/s11664-025-12026-y
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- Publication type:
- Article
Works by Majumder, Manoj Kumar
Results: 20
1
2
Insights into the Effects of Co-doping on the Electronic Properties of Armchair Graphene Nanoribbon-based NO<sub>2</sub> Gas Sensors.
- Published in:
- Journal of Electronic Materials, 2025, v. 54, n. 1, p. 300, doi. 10.1007/s11664-024-11539-2
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- Publication type:
- Article
3
Tunnel FET ambipolarity‐based energy efficient and robust true random number generator against reverse engineering attacks.
- Published in:
- IET Circuits, Devices & Systems (Wiley-Blackwell), 2019, v. 13, n. 5, p. 689, doi. 10.1049/iet-cds.2018.5297
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- Publication type:
- Article
4
Significance of Porous Graphene for Gas Sensing and Charge Storage Applications.
- Published in:
- IETE Journal of Research, 2024, v. 70, n. 8, p. 6976, doi. 10.1080/03772063.2024.2315191
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- Publication type:
- Article
5
Adsorption Analysis at Critical Temperature of PM<sub>2.5</sub> Contaminants.
- Published in:
- IETE Journal of Research, 2024, v. 70, n. 5, p. 5139, doi. 10.1080/03772063.2023.2251445
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- Publication type:
- Article
6
Role of Through Silicon Via in 3D Integration: Impact on Delay and Power.
- Published in:
- Journal of Circuits, Systems & Computers, 2021, v. 30, n. 3, p. N.PAG, doi. 10.1142/S0218126621500511
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- Publication type:
- Article
7
Crosstalk Induced Delay Analysis of Randomly Distributed Mixed CNT Bundle Interconnect.
- Published in:
- Journal of Circuits, Systems & Computers, 2015, v. 24, n. 10, p. -1, doi. 10.1142/S0218126615501455
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- Publication type:
- Article
8
Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via.
- Published in:
- Active & Passive Electronic Components, 2014, p. 1, doi. 10.1155/2014/524107
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- Publication type:
- Article
9
Relative stability of shielded top- and side-contact MLGNR interconnects.
- Published in:
- International Journal of Electronics Letters, 2021, v. 9, n. 4, p. 447, doi. 10.1080/21681724.2020.1793393
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- Publication type:
- Article
10
Performance analysis of mixed CNT bundle interconnects at 10 nm technology.
- Published in:
- IET Circuits, Devices & Systems (Wiley-Blackwell), 2020, v. 14, n. 7, p. 1049, doi. 10.1049/iet-cds.2019.0516
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- Publication type:
- Article
11
Low area overhead DPA countermeasure exploiting tunnel transistor‐based random number generator.
- Published in:
- IET Circuits, Devices & Systems (Wiley-Blackwell), 2020, v. 14, n. 5, p. 640, doi. 10.1049/iet-cds.2019.0504
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- Publication type:
- Article
12
Tunnel FET‐based ultra‐lightweight reconfigurable TRNG and PUF design for resource‐constrained internet of things.
- Published in:
- International Journal of Circuit Theory & Applications, 2021, v. 49, n. 8, p. 2299, doi. 10.1002/cta.3030
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- Publication type:
- Article
13
Tunnel FET‐based ultralow‐power and hardware‐secure circuit design considering p‐i‐n forward leakage.
- Published in:
- International Journal of Circuit Theory & Applications, 2020, v. 48, n. 4, p. 524, doi. 10.1002/cta.2731
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- Publication type:
- Article
14
Impact of Polymer Liners on Crosstalk Induced Delay of Different TSV Shapes.
- Published in:
- IETE Journal of Research, 2024, v. 70, n. 1, p. 686, doi. 10.1080/03772063.2022.2108915
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- Publication type:
- Article
15
Compact AC Modeling of Eddy Current for Cylindrical Through Silicon Via.
- Published in:
- IETE Journal of Research, 2023, v. 69, n. 8, p. 5399, doi. 10.1080/03772063.2021.1982410
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- Publication type:
- Article
16
Impact of Interconnect Spacing on Crosstalk for Multi-layered Graphene Nanoribbon.
- Published in:
- IETE Journal of Research, 2022, v. 68, n. 2, p. 1064, doi. 10.1080/03772063.2019.1637788
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- Publication type:
- Article
17
Modeling and Fabrication Aspects of Cu- and Carbon Nanotube-Based Through-Silicon Vias.
- Published in:
- IETE Journal of Research, 2021, v. 67, n. 3, p. 377, doi. 10.1080/03772063.2018.1553638
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- Publication type:
- Article
18
Process-Induced Delay Variation in SWCNT, MWCNT, and Mixed CNT Interconnects.
- Published in:
- IETE Journal of Research, 2015, v. 61, n. 5, p. 533, doi. 10.1080/03772063.2015.1025110
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- Publication type:
- Article
19
Performance analysis for randomly distributed mixed carbon nanotube bundle interconnects.
- Published in:
- Micro & Nano Letters (Wiley-Blackwell), 2014, v. 9, n. 11, p. 792, doi. 10.1049/mnl.2014.0502
- By:
- Publication type:
- Article
20
Frequency response and bandwidth analysis of multi-layer graphene nanoribbon and multi-walled carbon nanotube interconnects.
- Published in:
- Micro & Nano Letters (Wiley-Blackwell), 2014, v. 9, n. 9, p. 557, doi. 10.1049/mnl.2013.0742
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- Publication type:
- Article