Found: 51
Select item for more details and to access through your institution.
Influence of Macroscale Dimension on the Electrocrystallization of Cu Pad and Redistributed Layer in Advanced Packaging.
- Published in:
- Advanced Engineering Materials, 2024, v. 26, n. 12, p. 1, doi. 10.1002/adem.202400304
- By:
- Publication type:
- Article
Research Overview on the Electromigration Reliability of SnBi Solder Alloy.
- Published in:
- Materials (1996-1944), 2024, v. 17, n. 12, p. 2848, doi. 10.3390/ma17122848
- By:
- Publication type:
- Article
Improving Electromigration Resistance of Fine‐Pitch Redistributed Layer Using Graphene‐Doped Twinned Copper Composites.
- Published in:
- Advanced Engineering Materials, 2024, v. 26, n. 6, p. 1, doi. 10.1002/adem.202301649
- By:
- Publication type:
- Article
Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions.
- Published in:
- Metals (2075-4701), 2024, v. 14, n. 2, p. 139, doi. 10.3390/met14020139
- By:
- Publication type:
- Article
Will Better Sintering Quality of Ag Nanoparticles Lead to More Reliable Ag Bonding Interfaces?
- Published in:
- Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7475, doi. 10.1007/s11664-023-10677-3
- By:
- Publication type:
- Article
Clinical Features of Non-Alcoholic Fatty Liver Disease in the Non-Lean Population.
- Published in:
- Obesity Facts: The European Journal of Obesity, 2023, v. 16, n. 5, p. 427, doi. 10.1159/000530845
- By:
- Publication type:
- Article
Rapid Cu–Cu bonding by pressure-sintering of anti-oxidized Cu nanoparticle pastes under ambient atmosphere.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 23, p. 1, doi. 10.1007/s10854-023-11095-1
- By:
- Publication type:
- Article
Mucilage secretion by aerial roots in sorghum (Sorghum bicolor): sugar profile, genetic diversity, GWAS and transcriptomic analysis.
- Published in:
- Plant Molecular Biology, 2023, v. 112, n. 6, p. 309, doi. 10.1007/s11103-023-01365-1
- By:
- Publication type:
- Article
Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging.
- Published in:
- Materials (1996-1944), 2023, v. 16, n. 13, p. 4614, doi. 10.3390/ma16134614
- By:
- Publication type:
- Article
Synthesis of Cu Nanowires by Template Electrodeposition and Their Application in Pressure Sensors.
- Published in:
- Journal of Electronic Materials, 2023, v. 52, n. 5, p. 3463, doi. 10.1007/s11664-023-10317-w
- By:
- Publication type:
- Article
Regulating the orientation and distribution of nanotwins by trace of gelatin during direct current electroplating copper on titanium substrate.
- Published in:
- Journal of Materials Science, 2022, v. 57, n. 37, p. 17797, doi. 10.1007/s10853-022-07731-6
- By:
- Publication type:
- Article
Detrimental angle range between c axis of Sn crystal and electron flow for the electromigration reliability of ball grid array devices.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17877, doi. 10.1007/s10854-022-08651-6
- By:
- Publication type:
- Article
Cu–Cu bonding using bimodal submicron–nano Cu paste and its application in die attachment for power device.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 12604, doi. 10.1007/s10854-022-08210-z
- By:
- Publication type:
- Article
Numerical Simulation of V-Shaped Diversion Pier for Improving the Flow Pattern in Forward Inlet Forebay of the Pumping Station.
- Published in:
- China Rural Water & Hydropower, 2022, n. 3, p. 183
- By:
- Publication type:
- Article
Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 3576, doi. 10.1007/s10854-021-07551-5
- By:
- Publication type:
- Article
Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 4, p. 1942, doi. 10.1007/s10854-021-07395-z
- By:
- Publication type:
- Article
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 2, p. 2172, doi. 10.1007/s10854-020-04982-4
- By:
- Publication type:
- Article
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure.
- Published in:
- Journal of Electronic Materials, 2020, v. 49, n. 10, p. 6223, doi. 10.1007/s11664-020-08372-8
- By:
- Publication type:
- Article
Clinical features of hepatitis B patients at immune‐tolerance phase with basal core promoter and/or precore mutations.
- Published in:
- Journal of Viral Hepatitis, 2020, v. 27, n. 10, p. 1044, doi. 10.1111/jvh.13315
- By:
- Publication type:
- Article
Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters.
- Published in:
- Journal of Microscopy, 2020, v. 279, n. 3, p. 212, doi. 10.1111/jmi.12868
- By:
- Publication type:
- Article
Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging.
- Published in:
- Journal of Electronic Materials, 2020, v. 49, n. 4, p. 2651, doi. 10.1007/s11664-019-07909-w
- By:
- Publication type:
- Article
Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 4, p. 2967, doi. 10.1007/s10854-019-02840-6
- By:
- Publication type:
- Article
Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm).
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 2466, doi. 10.1007/s10854-019-02784-x
- By:
- Publication type:
- Article
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 17583, doi. 10.1007/s10854-019-02107-0
- By:
- Publication type:
- Article
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15054, doi. 10.1007/s10854-019-01878-w
- By:
- Publication type:
- Article
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12840, doi. 10.1007/s10854-019-01729-8
- By:
- Publication type:
- Article
Effects of salinity acclimation on the growth performance, osmoregulation and energy metabolism of the oriental river prawn, Macrobrachium nipponense (De Haan).
- Published in:
- Aquaculture Research, 2019, v. 50, n. 2, p. 685, doi. 10.1111/are.13950
- By:
- Publication type:
- Article
Sweet Sorghum Originated through Selection of Dry, a Plant-Specific NAC Transcription Factor Gene.
- Published in:
- Plant Cell, 2018, v. 30, n. 10, p. 2286, doi. 10.1105/tpc.18.00313
- By:
- Publication type:
- Article
The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 13774, doi. 10.1007/s10854-018-9508-z
- By:
- Publication type:
- Article
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8371, doi. 10.1007/s10854-018-8848-z
- By:
- Publication type:
- Article
Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via.
- Published in:
- Materials (1996-1944), 2018, v. 11, n. 2, p. 319, doi. 10.3390/ma11020319
- By:
- Publication type:
- Article
Review of Large Spacecraft Deployable Membrane Antenna Structures.
- Published in:
- Chinese Journal of Mechanical Engineering, 2017, v. 30, n. 6, p. 1447, doi. 10.1007/s10033-017-0198-x
- By:
- Publication type:
- Article
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling.
- Published in:
- Journal of Electronic Materials, 2017, v. 46, n. 8, p. 5338, doi. 10.1007/s11664-017-5554-1
- By:
- Publication type:
- Article
A superior interfacial reliability of Fe-Ni UBM during high temperature storage.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 8537, doi. 10.1007/s10854-017-6576-4
- By:
- Publication type:
- Article
Properties and Microstructures of Sn-Bi-X Lead-Free Solders.
- Published in:
- Advances in Materials Science & Engineering, 2016, p. 1, doi. 10.1155/2016/9265195
- By:
- Publication type:
- Article
The reliability of copper pillar under the coupling of thermal cycling and electric current stressing.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9748, doi. 10.1007/s10854-016-5038-8
- By:
- Publication type:
- Article
Sweet sorghum ideotypes: genetic improvement of the biofuel syndrome.
- Published in:
- Food & Energy Security, 2015, v. 4, n. 3, p. 159, doi. 10.1002/fes3.63
- By:
- Publication type:
- Article
Reliability and failure mechanism of copper pillar joints under current stressing.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7690, doi. 10.1007/s10854-015-3410-8
- By:
- Publication type:
- Article
Low Temperature Sintering Cu<sub>6</sub>Sn<sub>5</sub> Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections.
- Published in:
- Small, 2015, v. 11, n. 33, p. 4097, doi. 10.1002/smll.201500896
- By:
- Publication type:
- Article
Stability and genetic control of morphological, biomass and biofuel traits under temperate maritime and continental conditions in sweet sorghum ( Sorghum bicolour).
- Published in:
- Theoretical & Applied Genetics, 2015, v. 128, n. 9, p. 1685, doi. 10.1007/s00122-015-2538-5
- By:
- Publication type:
- Article
Sweet sorghum ideotypes: genetic improvement of stress tolerance.
- Published in:
- Food & Energy Security, 2015, v. 4, n. 1, p. 3, doi. 10.1002/fes3.54
- By:
- Publication type:
- Article
PAV markers in Sorghum bicolour: genome pattern, affected genes and pathways, and genetic linkage map construction.
- Published in:
- Theoretical & Applied Genetics, 2015, v. 128, n. 4, p. 623, doi. 10.1007/s00122-015-2458-4
- By:
- Publication type:
- Article
Impairment of Myocardial Mitochondria in Viral Myocardial Disease and Its Reflective Window in Peripheral Cells.
- Published in:
- PLoS ONE, 2014, v. 9, n. 12, p. 1, doi. 10.1371/journal.pone.0116239
- By:
- Publication type:
- Article
SbHKT1;4, a member of the high-affinity potassium transporter gene family from Sorghum bicolor, functions to maintain optimal Na<sup>+</sup>/K<sup>+</sup> balance under Na<sup>+</sup> stress.
- Published in:
- Journal of Integrative Plant Biology, 2014, v. 56, n. 3, p. 315, doi. 10.1111/jipb.12144
- By:
- Publication type:
- Article
Genome- wide patterns of large- size presence/ absence variants in sorghum.
- Published in:
- Journal of Integrative Plant Biology, 2014, v. 56, n. 1, p. 24, doi. 10.1111/jipb.12121
- By:
- Publication type:
- Article
Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging.
- Published in:
- Microscopy & Microanalysis, 2013, v. 19, n. S5, p. 105, doi. 10.1017/S1431927613012439
- By:
- Publication type:
- Article
Spermatic cord seal-up injection for acute epididymitis: Clinical observation of 56 cases.
- Published in:
- National Journal of Andrology / Zhonghua Nankexue, 2013, v. 19, n. 7, p. 622
- By:
- Publication type:
- Article
Fabrication of Metal-Oxide-Diamond Field-Effect Transistors with Submicron-Sized Gate Length on Boron-Doped (111) H-Terminated Surfaces Using Electron Beam Evaporated SiO and AlO.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 247, doi. 10.1007/s11664-010-1500-1
- By:
- Publication type:
- Article
Low-temperature oxidation of CO catalysed by Co<sub>3</sub>O<sub>4</sub> nanorods.
- Published in:
- Nature, 2009, v. 458, n. 7239, p. 746, doi. 10.1038/nature07877
- By:
- Publication type:
- Article
RELATION OF INTRAMYOCARDIAL PRESSURE TO CORONARY PRESSURE AT ZERO FLOW.
- Published in:
- Clinical & Experimental Pharmacology & Physiology, 1986, v. 13, n. 6, p. 477, doi. 10.1111/j.1440-1681.1986.tb00928.x
- By:
- Publication type:
- Article