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The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 10055, doi. 10.1007/s10854-015-3687-7
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- Publication type:
- Article
Monosymptomatic rest tremor due to a midbrain arteriovenous malformation.
- Published in:
- Movement Disorders, 2008, v. 23, n. 14, p. 2094, doi. 10.1002/mds.22213
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- Publication type:
- Article
Kaposiform hemangioendothelioma of skull base with dura invasion in a pediatric patient: a case report.
- Published in:
- 2023
- By:
- Publication type:
- Case Study
Disseminated juvenile xanthogranuloma occurring after treatment of Langerhans cell histiocytosis: a case report.
- Published in:
- 2018
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- Publication type:
- Case Study
Electrically Insulative Performances of Ceramic and Clay Films Deposited via Supersonic Spraying.
- Published in:
- Journal of Thermal Spray Technology, 2016, v. 25, n. 4, p. 763, doi. 10.1007/s11666-016-0384-x
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- Publication type:
- Article
Robust Mechanical Properties of Electrically Insulative Alumina Films by Supersonic Aerosol Deposition.
- Published in:
- Journal of Thermal Spray Technology, 2015, v. 24, n. 6, p. 1046, doi. 10.1007/s11666-015-0257-8
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- Publication type:
- Article
Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2013, v. 65, n. 10, p. 1362, doi. 10.1007/s11837-013-0720-2
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- Publication type:
- Article
Impact of in situ current stressing on Sn-based solder joint shear stability.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 3, p. 2853, doi. 10.1007/s10854-020-05038-3
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- Publication type:
- Article
The role of a nonconductive film (NCF) on Cu/Ni/Sn-Ag microbump interconnect reliability.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15530, doi. 10.1007/s10854-020-04115-x
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- Publication type:
- Article
Analysis of stromal PDGFR-β and α-SMA expression and their clinical relevance in brain metastases of breast cancer patients.
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- BMC Cancer, 2023, v. 23, n. 1, p. 1, doi. 10.1186/s12885-023-10957-5
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- Publication type:
- Article
Flagellin synergistically enhances anti-tumor effect of EGFRvIII peptide in a glioblastoma-bearing mouse brain tumor model.
- Published in:
- 2022
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- Publication type:
- journal article
A population‐based study of pyogenic liver abscess in Korea: Incidence, mortality and temporal trends during 2007‐2017.
- Published in:
- Liver International, 2021, v. 41, n. 11, p. 2747, doi. 10.1111/liv.15034
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- Publication type:
- Article
Diurnally fluctuating frontal dysequilibrium secondary to a pineal pilocytic astrocytoma: is this symptom associated with a check-valve mechanism in a pineal region tumor?
- Published in:
- Child's Nervous System, 2009, v. 25, n. 3, p. 367, doi. 10.1007/s00381-008-0738-x
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- Publication type:
- Article
From the perspective of pseudo-progression rather than treatment failure, how long should we wait before considering treatment failure if large cystic enlargement occurs after Gamma Knife radiosurgery for vestibular schwannoma?: insight into pseudoprogression based on two case reports
- Published in:
- Acta Neurochirurgica, 2023, v. 165, n. 8, p. 2105, doi. 10.1007/s00701-023-05684-6
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- Publication type:
- Article
Clinical results of intraarterial thrombolysis according to tPA administration and perfusion/diffusion mismatching.
- Published in:
- Acta Neurochirurgica, 2015, v. 157, n. 3, p. 389, doi. 10.1007/s00701-014-2341-0
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- Publication type:
- Article
Regional Cerebral Blood Flow Changes in Patients with Intractable Obsessive Compulsive Disorders Treated by Limbic Leukotomy.
- Published in:
- Stereotactic & Functional Neurosurgery, 2002, v. 76, n. 3/4, p. 249, doi. 10.1159/000066727
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- Publication type:
- Article
Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration.
- Published in:
- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1214, doi. 10.1007/s11664-023-10845-5
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- Publication type:
- Article
Intermediate Low-Melting-Temperature Solder Thermal Cycling Enhancement Using Bismuth and Indium Microalloying.
- Published in:
- Journal of Electronic Materials, 2023, v. 52, n. 2, p. 810, doi. 10.1007/s11664-022-10121-y
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- Publication type:
- Article
Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability.
- Published in:
- Journal of Electronic Materials, 2022, v. 51, n. 3, p. 1169, doi. 10.1007/s11664-021-09379-5
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- Publication type:
- Article
Impact of Thermal Cycling on Cu Press-Fit Connector Pin Interconnect Mechanical Stability.
- Published in:
- Journal of Electronic Materials, 2021, v. 50, n. 8, p. 4991, doi. 10.1007/s11664-021-09045-w
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- Publication type:
- Article
Effect of Electromigration-Induced Joule Heating on the Reliability of Sn-Ag Microbump with Different UBM Structures.
- Published in:
- Journal of Electronic Materials, 2020, v. 49, n. 12, p. 7228, doi. 10.1007/s11664-020-08527-7
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- Publication type:
- Article
Heating Rate Dependence of the Mechanisms of Copper Pumping in Through-Silicon Vias.
- Published in:
- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 159, doi. 10.1007/s11664-018-6805-5
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- Publication type:
- Article
Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance.
- Published in:
- Journal of Electronic Materials, 2017, v. 46, n. 10, p. 6224, doi. 10.1007/s11664-017-5650-2
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- Publication type:
- Article
Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6177, doi. 10.1007/s11664-016-4902-x
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- Publication type:
- Article
Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 6, p. 3013, doi. 10.1007/s11664-016-4343-6
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- Publication type:
- Article
Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages.
- Published in:
- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 895, doi. 10.1007/s11664-014-3572-9
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- Publication type:
- Article
Effect of Board Thickness on Sn-Ag-Cu Joint Interconnect Mechanical Shock Performance.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4522, doi. 10.1007/s11664-014-3479-5
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- Publication type:
- Article
Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4126, doi. 10.1007/s11664-014-3315-y
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- Publication type:
- Article
The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2521, doi. 10.1007/s11664-014-3176-4
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- Publication type:
- Article
Influence of High- G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 69, doi. 10.1007/s11664-013-2736-3
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- Publication type:
- Article
Impact of Electrical Current on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 4, p. 599, doi. 10.1007/s11664-012-2292-2
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- Publication type:
- Article
Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 319, doi. 10.1007/s11664-012-2307-z
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- Publication type:
- Article
The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 215, doi. 10.1007/s11664-012-2340-y
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- Publication type:
- Article
Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 201, doi. 10.1007/s11664-012-2339-4
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- Publication type:
- Article
Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 273, doi. 10.1007/s11664-011-1775-x
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- Publication type:
- Article
In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 262, doi. 10.1007/s11664-011-1785-8
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- Publication type:
- Article
The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 283, doi. 10.1007/s11664-011-1811-x
- By:
- Publication type:
- Article
Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2111, doi. 10.1007/s11664-011-1705-y
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- Publication type:
- Article
Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1895, doi. 10.1007/s11664-011-1654-5
- By:
- Publication type:
- Article
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1967, doi. 10.1007/s11664-011-1702-1
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- Publication type:
- Article
Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2588, doi. 10.1007/s11664-010-1348-4
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- Publication type:
- Article
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2564, doi. 10.1007/s11664-010-1352-8
- By:
- Publication type:
- Article
Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu- xNi/Au/Ni Sandwich Structures.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2544, doi. 10.1007/s11664-010-1372-4
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- Publication type:
- Article
Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2669, doi. 10.1007/s11664-010-1380-4
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- Publication type:
- Article
Association between Cockroach-specific Immunoglobulin E and periodontitis in Korean male adults Based on Korean National Health and Nutrition Examination Survey.
- Published in:
- Scientific Reports, 2017, p. 46373, doi. 10.1038/srep46373
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- Publication type:
- Article
Estimating soil water retention function from its particle-size distribution.
- Published in:
- Geosciences Journal, 2014, v. 18, n. 2, p. 219, doi. 10.1007/s12303-014-0017-7
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- Publication type:
- Article
The Corrosion of Stainless Steel Made by Additive Manufacturing: A Review.
- Published in:
- Metals (2075-4701), 2021, v. 11, n. 3, p. 516, doi. 10.3390/met11030516
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- Publication type:
- Article
Effect of Choline Alphoscerate on the Survival of Glioblastoma Patients: A Retrospective, Single-Center Study.
- Published in:
- Journal of Clinical Medicine, 2022, v. 11, n. 20, p. 6052, doi. 10.3390/jcm11206052
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- Publication type:
- Article