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Effect of the Noble Metals Addition on the Oxidation Behavior of Ni<sub>3</sub>Al.
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- Advances in Materials Science & Engineering, 2018, p. 1, doi. 10.1155/2018/1616340
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- Article
PRODUCTION OF AL FOAMS USING THE SDP METHOD: PROCESSING PARAMETERS AND INTRODUCTION OF A NEW SINTERING DEVICE.
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- Journal of Mining & Metallurgy. Section B: Metallurgy, 2016, v. 52, n. 1, p. 47, doi. 10.2298/JMMB150128024C
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- Article
ANALYSIS OF THE MICROSTRUCTURAL EVOLUTION AND SOLIDIFICATION BEHAVIOUR OF Sn-9 wt% Zn ALLOY WITH SMALL ADDITIONS OF Mg.
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- Journal of Mining & Metallurgy. Section B: Metallurgy, 2013, v. 49, n. 3, p. 293, doi. 10.2298/JMMB120321031F
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- Article
Effect of quenching rate on the average grain size and martensitic transformation temperature in rapidly solidified polycrystalline Ni<sub>50</sub> Mn<sub>37</sub> Sn<sub>13</sub> alloy ribbons.
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- Physica Status Solidi. A: Applications & Materials Science, 2013, v. 210, n. 10, p. 2159, doi. 10.1002/pssa.201329146
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- Article
Metallic glass formation in the binary Cu-Hf system.
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- Journal of Materials Science, 2013, v. 48, n. 4, p. 1819, doi. 10.1007/s10853-012-6946-5
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- Article
In situ X-ray study of order–disorder phase transitions in Cu–Al–Be melt spun ribbons.
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- Journal of Materials Science, 2006, v. 41, n. 15, p. 4755, doi. 10.1007/s10853-006-0026-7
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- Article
Effect of Pt, Pd, Au and Ag on oxidation behaviour of Fe 3 Al intermetallic.
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- Corrosion Engineering, Science & Technology, 2016, v. 51, n. 3, p. 179, doi. 10.1179/1743278215Y.0000000045
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- Article
Electrochemical study on effect of Au, Ag, Pd and Pt on corrosion behaviour of Fe<sub>3</sub>Al in molten NaCl-KCl.
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- Corrosion Engineering, Science & Technology, 2014, v. 49, n. 5, p. 378, doi. 10.1179/1743278214Y.0000000150
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- Article
In-situ porosity formation of self-foaming Al-Fe-Cu alloys.
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- Applied Physics A: Materials Science & Processing, 2022, v. 128, n. 4, p. 1, doi. 10.1007/s00339-022-05454-8
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- Article
Influence of alloying elements on microstructure, mechanical properties and corrosion behaviour of hypoeutectic Sn-6.5wt%Zn-0.5 wt%X (X = Ag, Al, Cu) lead-free solders.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 22, p. 1, doi. 10.1007/s10854-024-13277-x
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- Article