Found: 20
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Synthesis of Cu@Ag core-shell nanoparticles for characterization of thermal stability and electric resistivity.
- Published in:
- Applied Physics A: Materials Science & Processing, 2018, v. 124, n. 7, p. 1, doi. 10.1007/s00339-018-1887-8
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- Article
On the thickness of CuSn compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 7, p. 7699, doi. 10.1007/s10854-016-4756-2
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- Article
Effect of the degree of supercooling on growth mechanism of Cu6Sn5 in pure Sn/Cu solder joint.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 7528, doi. 10.1007/s10854-021-05467-8
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- Article
Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4359, doi. 10.1007/s10854-019-00758-7
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- Article
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 3, p. 2872, doi. 10.1007/s10854-018-00564-7
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- Article
All-round suppression of Cu<sub>6</sub>Sn<sub>5</sub> growth in Sn/Cu joints by utilizing TiO<sub>2</sub> nanoparticles.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15966, doi. 10.1007/s10854-018-9682-z
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- Article
Shielding effect of Ag<sub>3</sub>Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 4383, doi. 10.1007/s10854-017-8428-7
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- Article
Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 1, p. 589, doi. 10.1007/s10854-017-7951-x
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- Article
Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders during multiple reflows.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 1, p. 602, doi. 10.1007/s10854-017-7952-9
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- Article
Formation mechanism and kinetic analysis of the morphology of CuSn in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 7, p. 5398, doi. 10.1007/s10854-016-6200-z
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- Article
Antibiotic resistance and detection of plasmid mediated colistin resistance mcr-1 gene among Escherichia coli and Klebsiella pneumoniae isolated from clinical samples.
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- Gut Pathogens, 2021, v. 13, n. 1, p. 1, doi. 10.1186/s13099-021-00441-5
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- Article
Modeling of surface phenomena of liquid Al–Ni alloys using molecular dynamics.
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- Scientific Reports, 2023, v. 13, n. 1, p. 1, doi. 10.1038/s41598-023-31844-w
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- Article
In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu 6 Sn 5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage.
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- Metals (2075-4701), 2023, v. 13, n. 8, p. 1445, doi. 10.3390/met13081445
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- Article
State-of-the-Art Review on the Aspects of Martensitic Alloys Studied via Machine Learning.
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- Metals (2075-4701), 2022, v. 12, n. 11, p. 1884, doi. 10.3390/met12111884
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- Article
Automatic Featurization Aided Data-Driven Method for Estimating the Presence of Intermetallic Phase in Multi-Principal Element Alloys.
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- Metals (2075-4701), 2022, v. 12, n. 6, p. 964, doi. 10.3390/met12060964
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- Article
Study of Cosmic-Ray Intensity Variations Associated with Anomalous, Long-Duration High-Speed Solar Wind Streams in 2003.
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- Solar Physics, 2007, v. 241, n. 1, p. 171, doi. 10.1007/s11207-006-0256-5
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- Article
Author Correction: Modeling of surface phenomena of liquid Al–Ni alloys using molecular dynamics.
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- 2023
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- Correction Notice
Modeling of surface phenomena of liquid Al–Ni alloys using molecular dynamics.
- Published in:
- Scientific Reports, 2023, v. 13, n. 1, p. 1, doi. 10.1038/s41598-023-31844-w
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- Publication type:
- Article
Phase-field approach to simulate BCC-B2 phase separation in the Al<sub>n</sub>CrFe<sub>2</sub>Ni<sub>2</sub> medium-entropy alloy.
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- Journal of Materials Science, 2022, v. 57, n. 23, p. 10600, doi. 10.1007/s10853-022-07058-2
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- Article
Superhydrophobic Surface and Lubricant‐Infused Surface: Implementing Two Extremes on Electrodeposited NiTiO<sub>2</sub> Surface to Drive Optimal Wettability Regimes for Droplets' Multifunctional Behaviors.
- Published in:
- Advanced Engineering Materials, 2021, v. 23, n. 10, p. 1, doi. 10.1002/adem.202100266
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- Article