Found: 13
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Oxygen Evolution Reaction of Co-Mn-O Electrocatalyst Prepared by Solution Combustion Synthesis.
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- Catalysts (2073-4344), 2019, v. 9, n. 6, p. 564, doi. 10.3390/catal9060564
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- Article
Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 21127, doi. 10.1007/s10854-022-08917-z
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- Article
Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28346, doi. 10.1007/s10854-021-07210-9
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- Article
Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 3, p. 3324, doi. 10.1007/s10854-020-05080-1
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- Article
Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 1, p. 1042, doi. 10.1007/s10854-020-04879-2
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- Article
Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 2, p. 1227, doi. 10.1007/s10854-019-02634-w
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- Article
Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15889, doi. 10.1007/s10854-019-01935-4
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- Article
Effects of graphene oxide on the electromigration lifetime of lead-free solder joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 3, p. 2334, doi. 10.1007/s10854-018-0506-y
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- Article
Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications.
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- Electronics (2079-9292), 2024, v. 13, n. 11, p. 2173, doi. 10.3390/electronics13112173
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- Article
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2458, doi. 10.1007/s11664-015-3781-x
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- Article
Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding.
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- Materials (1996-1944), 2021, v. 14, n. 2, p. 335, doi. 10.3390/ma14020335
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- Article
Nucleation and Morphology of Cu 6 Sn 5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate.
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- Metals (2075-4701), 2021, v. 11, n. 2, p. 210, doi. 10.3390/met11020210
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- Article
Framework for the validation of simulation-based productivity analysis: focused on curtain wall construction process.
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- Journal of Civil Engineering & Management, 2017, v. 23, n. 2, p. 163, doi. 10.3846/13923730.2014.992468
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- Article