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Effect of the Lapping Platen Groove Density on the Characteristics of Microabrasive-Based Lapping.
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- Micromachines, 2020, v. 11, n. 8, p. 775, doi. 10.3390/mi11080775
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- Article
Effect of Process Conditions on Uniformity of Velocity and Wear Distance of Pad and Wafer during Chemical Mechanical Planarization.
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- Journal of Electronic Materials, 2004, v. 33, n. 1, p. 53, doi. 10.1007/s11664-004-0294-4
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- Article
Self-dressing effect using a fixed abrasive platen for single-sided lapping of sapphire substrate.
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- Journal of Mechanical Science & Technology, 2017, v. 31, n. 12, p. 5649, doi. 10.1007/s12206-017-1105-1
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- Article
Characterization of diamond wire-cutting performance for lifetime estimation and process optimization.
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- Journal of Mechanical Science & Technology, 2016, v. 30, n. 2, p. 847, doi. 10.1007/s12206-016-0139-0
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- Article
Ultrahigh Power Output from Triboelectric Nanogenerator Based on Serrated Electrode via Spark Discharge.
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- Advanced Energy Materials, 2020, v. 10, n. 44, p. 1, doi. 10.1002/aenm.202002312
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- Article
Investigation on diamond wire break-in and its effects on cutting performance in multi-wire sawing.
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- International Journal of Advanced Manufacturing Technology, 2016, v. 87, n. 1-4, p. 1, doi. 10.1007/s00170-015-7984-3
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- Article
Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad.
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- Applied Sciences (2076-3417), 2021, v. 11, n. 10, p. 4358, doi. 10.3390/app11104358
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- Article
Material Removal Model for Lapping Process Based on Spiral Groove Density.
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- Applied Sciences (2076-3417), 2021, v. 11, n. 9, p. 3950, doi. 10.3390/app11093950
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- Article