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Grain Boundary Diffusion of Ni through Au-Doped Ni<sub>3</sub>Sn<sub>2</sub> Intermetallic Compound for Technological Applications.
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- Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6590, doi. 10.1007/s11664-021-09282-z
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- Article
Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish.
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- Journal of Electronic Materials, 2020, v. 49, n. 8, p. 5003, doi. 10.1007/s11664-020-08245-0
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- Article
Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 88, doi. 10.1007/s11664-019-07455-5
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- Article
Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation.
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- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-17119-w
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- Article
Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications.
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- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 25, doi. 10.1007/s11664-018-6599-5
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- Article
Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints.
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- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 9, doi. 10.1007/s11664-018-6587-9
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- Article
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2010, v. 39, n. 8, p. 1289, doi. 10.1007/s11664-010-1186-4
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- Article
Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates.
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- Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2234, doi. 10.1007/s11664-009-0866-4
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- Article
Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 25, doi. 10.1007/s11664-008-0541-1
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- Article
Analysis and Experimental Verification of the Volume Effect in the Reaction Between Zn-Doped Solders and Cu.
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- Journal of Electronic Materials, 2008, v. 37, n. 10, p. 1591, doi. 10.1007/s11664-008-0521-5
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- Article
Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 96, doi. 10.1007/s11664-007-0293-3
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- Article
Tin Whisker Growth Induced by High Electron Current Density.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 17, doi. 10.1007/s11664-007-0219-0
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- Article
Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2147, doi. 10.1007/s11664-006-0325-4
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- Article
Kinetics of AuSn<sub>4</sub> Migration in Lead-Free Solders.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1948, doi. 10.1007/s11664-006-0298-3
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- Article
In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing.
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- Journal of Electronic Materials, 2006, v. 35, n. 10, p. 1781, doi. 10.1007/s11664-006-0157-2
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- Article
Effects of Limited Cu Supply on Soldering Reactions Between SnAgCu and Ni.
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- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1017, doi. 10.1007/BF02692562
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- Article
Electromigration-Induced UBM Consumption and the Resulting Failure Mechanisms in Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1010, doi. 10.1007/BF02692561
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- Article
Local Melting Induced by Electromigration in Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1005, doi. 10.1007/BF02692560
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- Article
Cross-Interaction Between Au and Cu in Au/Sn/Cu Ternary Diffusion Couples.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 366, doi. 10.1007/BF02692458
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- Article
Microstructure Evolution of Gold-Tin Eutectic Solder on Cu and Ni Substrates.
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- Journal of Electronic Materials, 2006, v. 35, n. 1, p. 65, doi. 10.1007/s11664-006-0185-y
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- Article
Controlling the Microstructures from the Gold-Tin Reaction.
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- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 182, doi. 10.1007/s11664-005-0231-1
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- Article
Electromigration-lnduced Failure in Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2005, v. 34, n. 1, p. 27, doi. 10.1007/s11664-005-0176-4
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- Article
Cross-Interaction of Under-Bump Metallurgy and Surface Finish in Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1424, doi. 10.1007/s11664-004-0082-1
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- Article
Effects of the Gold Thickness of the Surface Finish on the Interfacial Reactions in Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1092, doi. 10.1007/s11664-004-0109-7
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- Article
Foreword.
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- Journal of Electronic Materials, 2004, v. 33, n. 10, p. 1057, doi. 10.1007/s11664-004-0104-z
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- Article
Effects of Lead on Heme-Synthesizing Enzymes and Urinary δ-Aminolevulinic Acid in the Rat<sup>1</sup>.
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- Proceedings of the Society for Experimental Biology & Medicine, 1973, v. 143, n. 1, p. 234, doi. 10.3181/00379727-143-37292
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- Article
Creep Behaviors Along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using Nanoindentation.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2019, v. 71, n. 9, p. 2998, doi. 10.1007/s11837-019-03557-x
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- Article
Bifunctional Nanocomposites Based on SiO<sub>2</sub>/NiS<sub>2</sub> Combination for Electrochemical Sensing and Environmental Catalysis.
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- Electroanalysis, 2022, v. 34, n. 1, p. 111, doi. 10.1002/elan.202100219
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- Article
Phase stabilities and interfacial reactions of the Cu–In binary systems.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 13, p. 10161, doi. 10.1007/s10854-020-03561-x
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- Article
Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 10, p. 8059, doi. 10.1007/s10854-020-03346-2
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- Article
Analyses and design for electrochemical migration suppression by alloying indium into silver.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 13878, doi. 10.1007/s10854-018-9520-3
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- Article
Effects of bottom topography on dynamics of river discharges in tidal regions: case study of twin plumes in Taiwan Strait.
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- Ocean Science Discussions, 2014, v. 11, n. 2, p. 1149, doi. 10.5194/osd-11-1149-2014
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- Article
Effects of bottom topography on dynamics of river discharges in tidal regions: case study of twin plumes in Taiwan Strait.
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- Ocean Science, 2014, v. 10, n. 5, p. 863, doi. 10.5194/os-10-863-2014
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- Article
Phase Equilibria of the Binary Ag-In System.
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- Journal of Phase Equilibria & Diffusion, 2024, v. 45, n. 4, p. 790, doi. 10.1007/s11669-024-01133-8
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- Article
Phase Equilibria Related to NiGa 5 in the Binary Ni-Ga System.
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- Materials (1996-1944), 2024, v. 17, n. 4, p. 883, doi. 10.3390/ma17040883
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- Article
Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate.
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- Materials (1996-1944), 2023, v. 16, n. 18, p. 6263, doi. 10.3390/ma16186263
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- Article
Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling.
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- Materials (1996-1944), 2023, v. 16, n. 9, p. 3290, doi. 10.3390/ma16093290
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- Article
Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration.
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- Materials (1996-1944), 2022, v. 15, n. 21, p. 7783, doi. 10.3390/ma15217783
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- Article
Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps.
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- Materials (1996-1944), 2022, v. 15, n. 12, p. 4297, doi. 10.3390/ma15124297
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- Article
Assembly of N type Bi<sub>2</sub>(Te, Se)<sub>3</sub> thermoelectric modules by low temperature bonding.
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- Science & Technology of Welding & Joining, 2013, v. 18, n. 5, p. 421, doi. 10.1179/1362171813Y.0000000116
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- Article