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Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1201, doi. 10.1007/s11664-023-10855-3
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Analysis Study of Thermal and Exergy Efficiency in Double-Layers Porous Media Combustion Using Different Sizes of Burner: A Comparison.
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- Pertanika Journal of Science & Technology, 2024, v. 32, n. 2, p. 481, doi. 10.47836/pjst.32.2.01
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- Article
Influence of Nanoparticles on Thermophysical Properties of Hybrid Nanofluids of Different Volume Fractions.
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- Nanomaterials (2079-4991), 2022, v. 12, n. 15, p. 2570, doi. 10.3390/nano12152570
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- Article