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92‐5: Late‐News Paper: Development of a Full‐Color MicroLED Display Utilizing Novel Simultaneous Transfer and Bonding (SITRAB) Process and SITRAB Film Technology.
- Published in:
- SID Symposium Digest of Technical Papers, 2024, v. 55, n. 1, p. 1309, doi. 10.1002/sdtp.17785
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- Article
91‐2: Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology.
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- SID Symposium Digest of Technical Papers, 2024, v. 55, n. 1, p. 1278, doi. 10.1002/sdtp.17777
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- Article
30‐5: Late‐News Paper: Development of a highly reliable Mini‐LED display module using simultaneous transfer and bonding (SITRAB) technology.
- Published in:
- SID Symposium Digest of Technical Papers, 2023, v. 54, n. 1, p. 433, doi. 10.1002/sdtp.16585
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- Article
74‐4: Development of Flexible Full‐Color Mini‐LED Display Using Simultaneous Transfer and Bonding (SITRAB) Technology.
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- SID Symposium Digest of Technical Papers, 2022, v. 53, n. 1, p. 1005, doi. 10.1002/sdtp.15667
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- Article
59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display.
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- SID Symposium Digest of Technical Papers, 2021, v. 52, n. 1, p. 841, doi. 10.1002/sdtp.14814
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- Article
Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding.
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- Micromachines, 2023, v. 14, n. 3, p. 601, doi. 10.3390/mi14030601
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- Article
Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining.
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- Polymers (20734360), 2021, v. 13, n. 6, p. 957, doi. 10.3390/polym13060957
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- Article
Single-chip photonic transceiver based on bulk-silicon, as a chip-level photonic I/O platform for optical interconnects.
- Published in:
- Scientific Reports, 2015, p. 11329, doi. 10.1038/srep11329
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- Article
Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging.
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- ETRI Journal, 2024, v. 46, n. 2, p. 347, doi. 10.4218/etrij.2022-0471
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- Article