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Effect of Electromigration and Thermal Ageing on the Tin Whiskers' Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints.
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- Coatings (2079-6412), 2021, v. 11, n. 8, p. 935, doi. 10.3390/coatings11080935
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- Article
A SHORT REVIEW ON THE INFLUENCE OF ANTIMONY ADDITION TO THE MICROSTRUCTURE AND THERMAL PROPERTIES OF LEAD-FREE SOLDER ALLOY.
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- Archives of Metallurgy & Materials, 2023, v. 68, n. 3, p. 981, doi. 10.24425/amm.2023.145463
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- Article
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint.
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- Metals (2075-4701), 2021, v. 11, n. 3, p. 380, doi. 10.3390/met11030380
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- Article
Microstructure Evolution of Ag/TiO<sub>2</sub> Thin Film.
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- Magnetochemistry, 2021, v. 7, n. 1, p. 1, doi. 10.3390/magnetochemistry7010014
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- Article
Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.
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- Materials (1996-1944), 2022, v. 15, n. 8, p. N.PAG, doi. 10.3390/ma15082758
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- Article
The Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin-Based Geopolymer Ceramic.
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- Materials (1996-1944), 2022, v. 15, n. 7, p. 2667, doi. 10.3390/ma15072667
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- Article
Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review.
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- Materials (1996-1944), 2022, v. 15, n. 4, p. 1451, doi. 10.3390/ma15041451
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- Article
Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing.
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- Materials (1996-1944), 2021, v. 14, n. 18, p. 5134, doi. 10.3390/ma14185134
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- Article
Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.
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- Materials (1996-1944), 2021, v. 14, n. 4, p. 776, doi. 10.3390/ma14040776
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- Article