Found: 10
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Object-Oriented Ontology in Shaping Perspective on Bacterial Art and Nonhuman Agency.
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- Leonardo, 2024, v. 57, n. 3, p. 286, doi. 10.1162/leon_a_02522
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- Article
BIODIVERSITY CONSERVATION EFFORTS AMONG MUSLIM COUNTRIES: EVIDENCE FROM THE ORGANIZATION OF ISLAMIC COOPERATION COUNTRIES.
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- Journal of International Studies (1823-691X), 2024, v. 20, n. 1, p. 83, doi. 10.32890/jis2024.20.1.4
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- Article
The Influence of Incentives, Work Environment and Work Discipline on Employee Satisfaction of PT XYZ Cakung Branch.
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- Journal of Social Science (2720-9938), 2024, v. 5, n. 2, p. 563, doi. 10.46799/jss.v5i2.820
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- Article
The Resilience of University Youth While Undergoing Digital Learning During the COVID-19 Pandemic.
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- European Journal of Educational Research, 2024, v. 13, n. 1, p. 29, doi. 10.12973/eu-jer.13.1.29
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- Article
THE LEVEL OF INVOLVEMENT OF WOMEN ENTREPRENEURS IN THE TEXTILE INDUSTRY IN THE EAST COAST OF PENINSULAR MALAYSIA.
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- International Journal of Business & Society, 2022, v. 23, n. 3, p. 1554, doi. 10.33736/ijbs.5181.2022
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- Article
Dorongan Kelangsungan Usahawan Wanita dalam Perusahaan Batik dan Songket.
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- Jurnal Pengurusan, 2021, v. 61, p. 1, doi. 10.17576/pengurusan-2021-61-06
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- Article
Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach.
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- Metallurgical & Materials Transactions. Part A, 2020, v. 51, n. 3, p. 1221, doi. 10.1007/s11661-019-05614-1
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- Article
Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures.
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- Journal of Electronic Materials, 2019, v. 48, n. 5, p. 2826, doi. 10.1007/s11664-019-06985-2
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- Article
Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 15, p. 12910, doi. 10.1007/s10854-018-9410-8
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- Article
The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2507, doi. 10.1007/s11664-015-3812-7
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- Article