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Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1201, doi. 10.1007/s11664-023-10855-3
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A review on numerical approach of reflow soldering process for copper pillar technology.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 7/8, p. 4325, doi. 10.1007/s00170-022-09724-w
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- Article
Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process.
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- Metals (2075-4701), 2021, v. 11, n. 8, p. 1155, doi. 10.3390/met11081155
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- Article