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Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 117, doi. 10.1007/s11664-017-5834-9
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Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn-3.8Ag-0.7Cu solders by adding Co nanoparticles.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 10965, doi. 10.1007/s10854-017-6877-7
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Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range.
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- Journal of Phase Equilibria & Diffusion, 2017, v. 38, n. 3, p. 217, doi. 10.1007/s11669-017-0532-0
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- Article
Synthesis and Characterization of Pure Ni and Ni-Sn Intermetallic Nanoparticles.
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- Nanoscale Research Letters, 2017, v. 12, n. 1, p. 1, doi. 10.1186/s11671-017-1894-2
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Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles.
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- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6143, doi. 10.1007/s11664-016-4832-7
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The Enthalpies of Mixing of Liquid Ni-Sn-Zn Alloys.
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- Journal of Phase Equilibria & Diffusion, 2014, v. 35, n. 4, p. 359, doi. 10.1007/s11669-014-0288-8
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Characterization of Stress-Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling.
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- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 294, doi. 10.1007/s11664-012-2276-2
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The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections.
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- Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2275, doi. 10.1007/s11664-009-0854-8
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Cu-Ni-Sn: A Key System for Lead-Free Soldering.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 10, doi. 10.1007/s11664-008-0522-4
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Size effects in small scaled lead-free solder joints.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 4, p. 383, doi. 10.1007/s10854-007-9349-7
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Thermodynamics and phase diagrams of lead-free solder materials.
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- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 3
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- Article
A Statistical-Thermodynamic Model for Intermetallic Phases with L1<sub>2</sub>-Structure and Its Application to the Compound Ni<sub>3</sub>Al.
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- Physica Status Solidi (B), 1999, v. 216, n. 2, p. 943, doi. 10.1002/(SICI)1521-3951(199912)216:2<943::AID-PSSB943>3.0.CO;2-6
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