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Sidewall patterning of organic–inorganic multilayer thin film encapsulation by adhesion lithography.
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- Scientific Reports, 2023, v. 13, n. 1, p. 1, doi. 10.1038/s41598-023-39155-w
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22‐1: Formation of Silicon‐Based Thin‐Film Encapsulation for Fabrication of Highly Flexible OLED Devices.
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- SID Symposium Digest of Technical Papers, 2020, v. 51, n. 1, p. 305, doi. 10.1002/sdtp.13864
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- Article