Found: 10
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Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9721, doi. 10.1007/s10854-015-3640-9
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- Article
CONFUCIANISM, KOREAN CONFUCIANISM AND ECOLOGICAL DISCOURSE.
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- Acta Koreana, 2011, v. 14, n. 2, p. 15, doi. 10.18399/acta.2011.14.2.002
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- Article
KOREANS' FORMATION OF RELATIONSHIPS BASED ON 'URI(WE)' AND ITS PHILOSOPHICAL BACKGROUND.
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- Acta Koreana, 2008, v. 11, n. 2, p. 45, doi. 10.18399/acta.2008.11.2.003
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- Article
Power Cycling Reliability with Temperature Deviation of Pressureless Silver Sintered Joint for Silicon Carbide Power Module.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2024, v. 76, n. 6, p. 2763, doi. 10.1007/s11837-024-06398-5
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- Article
Pressureless Silver Sintering of Silicon-Carbide Power Modules for Electric Vehicles.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2020, v. 72, n. 2, p. 889, doi. 10.1007/s11837-019-03815-y
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- Article
Electrical and Microstructural Reliability of Pressureless Silver-Sintered Joints on Silicon Carbide Power Modules Under Thermal Cycling and High-Temperature Storage.
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- Journal of Electronic Materials, 2021, v. 50, n. 3, p. 914, doi. 10.1007/s11664-020-08698-3
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- Article
Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 188, doi. 10.1007/s11664-019-07654-0
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- Article
Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 48, doi. 10.1007/s11664-019-07595-8
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- Article
Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module.
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- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 122, doi. 10.1007/s11664-018-6769-5
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- Article
Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 902, doi. 10.1007/s11664-009-0737-z
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- Article