Reliability of lead-free solder joints in CSP device under thermal cycling.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1209, doi. 10.1007/s10854-014-1711-y
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- Publication type:
- Article
Works matching AU He, Cheng-Wen
Results: 8
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Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 9, p. 3249, doi. 10.1007/s10854-013-1236-9
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- Publication type:
- Article
3
Reliability behavior of lead-free solder joints in electronic components.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 172, doi. 10.1007/s10854-012-0720-y
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- Publication type:
- Article
4
Effect of Zn on properties and microstructure of SnAgCu alloy.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 11, p. 1950, doi. 10.1007/s10854-012-0686-9
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- Publication type:
- Article
5
Does Instruction-First or Problem-Solving-First Depend on Learners’ Prior Knowledge?
- Published in:
- Educational Psychology Review, 2025, v. 37, n. 1, p. 1, doi. 10.1007/s10648-025-09993-3
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- Publication type:
- Article
6
Genetic Analysis of Floral Symmetry Transition in African Violet Suggests the Involvement of Trans-acting Factor for CYCLOIDEA Expression Shifts.
- Published in:
- Frontiers in Plant Science, 2018, p. N.PAG, doi. 10.3389/fpls.2018.01008
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- Publication type:
- Article
7
Membrane recruitment of Atg8 by Hfl1 facilitates turnover of vacuolar membrane proteins in yeast cells approaching stationary phase.
- Published in:
- BMC Biology, 2021, v. 19, n. 1, p. 1, doi. 10.1186/s12915-021-01048-7
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- Publication type:
- Article
8
Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging.
- Published in:
- International Journal of Nonlinear Sciences & Numerical Simulation, 2014, v. 15, n. 3/4, p. 197, doi. 10.1515/ijnsns-2012-0063
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- Publication type:
- Article