Irregular Response of the Polypyrrole Films to H<sub>2</sub>S.
- Published in:
- Electroanalysis, 2000, v. 12, n. 15, p. 1195, doi. 10.1002/1521-4109(200010)12:15<1195::AID-ELAN1195>3.0.CO;2-1
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- Publication type:
- Article
Works matching AU Harsányi, Gábor
Results: 15
1
2
Conducting Polymer Based Electrochemical Sensors on Thick Film Substrate.
- Published in:
- Electroanalysis, 1999, v. 11, n. 10/11, p. 804, doi. 10.1002/(SICI)1521-4109(199907)11:10/11<804::AID-ELAN804>3.0.CO;2-B
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- Publication type:
- Article
3
Copper-oxide whisker growth on tin-copper alloy coatings caused by the corrosion of CuSn intermetallics.
- Published in:
- Journal of Materials Science, 2013, v. 48, n. 23, p. 8052, doi. 10.1007/s10853-013-7619-8
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- Publication type:
- Article
4
BME VIK Annual Research Report on Electrical Engineering and Computer Science 2016.
- Published in:
- Periodica Polytechnica: Electrical Engineering & Computer Science, 2017, v. 61, n. 2, p. 83, doi. 10.3311/ppee.11067
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- Publication type:
- Article
5
BME VIK Annual Research Report on Electrical Engineering and Computer Science 2015.
- Published in:
- Periodica Polytechnica: Electrical Engineering & Computer Science, 2016, v. 60, n. 1, p. 1, doi. 10.3311/PPee.9124
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- Publication type:
- Article
6
Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15308, doi. 10.1007/s10854-020-04095-y
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- Publication type:
- Article
7
The effect of chloride ion concentration on electrochemical migration of copper.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2010, doi. 10.1007/s10854-014-2640-5
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- Article
8
Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 7, p. 2315, doi. 10.1007/s10854-013-1095-4
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- Publication type:
- Article
9
Mechanical characterization of glass-ceramics substrate with embedded microstructure.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 12, p. 2123, doi. 10.1007/s10854-012-0718-5
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- Publication type:
- Article
10
Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 2, p. 551, doi. 10.1007/s10854-011-0435-5
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- Publication type:
- Article
11
In situ optical inspection of electrochemical migration during THB tests.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 694, doi. 10.1007/s10854-010-0198-4
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- Article
12
Electrochemical Corrosion of SAC Alloys: A Review.
- Published in:
- Metals (2075-4701), 2020, v. 10, n. 10, p. 1276, doi. 10.3390/met10101276
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- Publication type:
- Article
13
Design and application of low temperature co-fired ceramic substrates for sensors in road vehicles.
- Published in:
- Transport (16484142), 2013, v. 28, n. 1, p. 81, doi. 10.3846/16484142.2013.782464
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- Publication type:
- Article
14
On the Electrochemical Migration Mechanism of Gold in Electronics—Less Reliable Than Expected?
- Published in:
- Materials (1996-1944), 2021, v. 14, n. 18, p. 5237, doi. 10.3390/ma14185237
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- Publication type:
- Article
15
Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates.
- Published in:
- Materials (1996-1944), 2020, v. 13, n. 22, p. 5251, doi. 10.3390/ma13225251
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- Publication type:
- Article