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Effect of the Second-Phase Particle Distribution on the Brittle Fracture Behavior of Sn-3Ag-0.5Cu Solder.
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- Journal of Electronic Materials, 2023, v. 52, n. 5, p. 3394, doi. 10.1007/s11664-023-10319-8
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- Article
Effect of Aging Time on Ductile–Brittle Transition Behaviors of Sn-3.5Ag Solder.
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- Journal of Electronic Materials, 2023, v. 52, n. 1, p. 471, doi. 10.1007/s11664-022-10013-1
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- Article
Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi 9 Microwire and Au Microlayer.
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- Micromachines, 2021, v. 12, n. 1, p. 51, doi. 10.3390/mi12010051
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Microstructure and Grain Orientation Evolution in Sn-3.0Ag-0.5Cu Solder Interconnects Under Electrical Current Stressing.
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- Journal of Electronic Materials, 2015, v. 44, n. 10, p. 3880, doi. 10.1007/s11664-015-3922-2
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- Article
Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 834, doi. 10.1007/s11664-009-0762-y
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- Article
Characterization of the Hot-Cutting Defect Generated from Shape Machining of Alumina Green Tape in the Ceramic-Package Manufacturing Process.
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- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 1, p. 55, doi. 10.4071/imaps.433
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- Article
Rapid Formation of Full Intermetallic Bondlines for Die Attachment in High-Temperature Power Devices Based on Micro-sized Sn-Coated Ag Particles.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2019, v. 71, n. 9, p. 3049, doi. 10.1007/s11837-019-03544-2
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- Article
Transient liquid phase bonding of Cu@Sn core–shell particles with added Sn–3.0Cu–0.5Ag.
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- Journal of Materials Science, 2022, v. 57, n. 12, p. 6640, doi. 10.1007/s10853-022-07013-1
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- Article
Mechanical Properties and Fatigue Life Analysis of Motion Cables in Sensors under Cyclic Loading.
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- Sensors (14248220), 2024, v. 24, n. 4, p. 1109, doi. 10.3390/s24041109
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- Article
Thermal cycle reliability and creep behavior of nano-IMC mixed solder joints.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 28, p. 1, doi. 10.1007/s10854-023-11395-6
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- Article
Effect of Cu<sub>6</sub>Sn<sub>5</sub> nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10075-9
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- Article
Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10123-4
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- Article
Interconnection method based on Cu-foam/Sn composite preform for high-temperature applications.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 25964, doi. 10.1007/s10854-022-09287-2
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- Article
Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17745, doi. 10.1007/s10854-022-08637-4
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- Article
A high-temperature-resistant die attach material based on Cu@In@Ag particles for high-power devices.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 5599, doi. 10.1007/s10854-022-07747-3
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- Article
Silver flake/polyaniline composite ink for electrohydrodynamic printing of flexible heaters.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 23, p. 27373, doi. 10.1007/s10854-021-07113-9
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- Article
Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16230, doi. 10.1007/s10854-021-06171-3
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- Article
Cu@Sn@Ag core–shell particles preform for power device packaging under harsh environments.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 11, p. 14703, doi. 10.1007/s10854-021-06026-x
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- Article
A low-temperature Cu-to-Cu interconnection method by using nanoporous Cu fabricated by dealloying electroplated Cu–Zn.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 21, p. 18381, doi. 10.1007/s10854-020-04384-6
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- Article
A low-temperature bonding method for high power device packaging based on In-infiltrated nanoporous Cu.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 17, p. 14157, doi. 10.1007/s10854-020-03970-y
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- Article
A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 1808, doi. 10.1007/s10854-019-02697-9
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- Article
Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 6, p. 5526, doi. 10.1007/s10854-019-00846-8
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- Article
Fabrication of high-temperature-resistant bondline based on multilayer core-shell hybrid microspheres for power devices.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3595, doi. 10.1007/s10854-018-00637-7
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- Article
Effect of SiC reinforcement on the reliability of Ag nanoparticle paste for high-temperature applications.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 3, p. 2413, doi. 10.1007/s10854-018-0514-y
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- Article
Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid-liquid interdiffusion bonding.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 9, p. 4170, doi. 10.1007/s10854-014-2145-2
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Phase transformation and grain orientation of Cu-Sn intermetallic compounds during low temperature bonding process.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3905, doi. 10.1007/s10854-013-1337-5
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- Article
A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package.
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- Applied Sciences (2076-3417), 2018, v. 8, n. 11, p. 2188, doi. 10.3390/app8112188
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- Article
Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock.
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- Applied Sciences (2076-3417), 2018, v. 8, n. 11, p. 2056, doi. 10.3390/app8112056
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- Article
Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging.
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- Scientific Reports, 2018, v. 8, n. 1, p. 1, doi. 10.1038/s41598-018-35708-6
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- Article
A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging.
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- Materials (1996-1944), 2022, v. 15, n. 3, p. 914, doi. 10.3390/ma15030914
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- Article
Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration.
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- Chinese Journal of Mechanical Engineering, 2023, v. 36, n. 1, p. 1, doi. 10.1186/s10033-023-00834-4
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Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface.
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- Journal of Materials Science, 2009, v. 44, n. 7, p. 1772, doi. 10.1007/s10853-009-3253-x
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- Article
Fabrication of Novel Printable Electrically Conductive Adhesives (ECAs) with Excellent Conductivity and Stability Enhanced by the Addition of Polyaniline Nanoparticles.
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- Nanomaterials (2079-4991), 2019, v. 9, n. 7, p. 960, doi. 10.3390/nano9070960
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- Article