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Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 1, p. 56, doi. 10.1007/s11664-009-0962-5
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- Article
The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 51, doi. 10.1007/s11664-007-0248-8
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- Article
In situ imaging of microstructure formation in electronic interconnections.
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- Scientific Reports, 2017, p. 40010, doi. 10.1038/srep40010
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- Article
Ag<sub>3</sub>Sn Morphology Transitions During Eutectic Growth in Sn–Ag Alloys.
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- Metallurgical & Materials Transactions. Part A, 2023, v. 54, n. 3, p. 909, doi. 10.1007/s11661-022-06937-2
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- Article
Al8Mn5 in High-Pressure Die Cast AZ91: Twinning, Morphology and Size Distributions.
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- Metallurgical & Materials Transactions. Part A, 2020, v. 51, n. 5, p. 2523, doi. 10.1007/s11661-020-05708-1
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- Article
Feeding Mechanisms in High-Pressure Die Castings.
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- Metallurgical & Materials Transactions. Part A, 2010, v. 41, n. 7, p. 1836, doi. 10.1007/s11661-010-0222-6
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- Article
Defect Band Characteristics in Mg-Al and Al-Si High-Pressure Die Castings.
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- Metallurgical & Materials Transactions. Part A, 2007, v. 38, n. 8, p. 1833, doi. 10.1007/s11661-007-9243-1
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- Article
Migration of Crystals during the Filling of Semi-Solid Castings.
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- Metallurgical & Materials Transactions. Part A, 2005, v. 36, n. 3A, p. 805, doi. 10.1007/s11661-005-0195-z
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- Article
Al<sub>8</sub>Mn<sub>5</sub> Particle Settling and Interactions with Oxide Films in Liquid AZ91 Magnesium Alloys.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2019, v. 71, n. 7, p. 2235, doi. 10.1007/s11837-019-03471-2
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- Article
Advances in Electronic Interconnection Materials.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2019, v. 71, n. 1, p. 131, doi. 10.1007/s11837-018-3267-4
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- Article
Dilatant shear bands in solidifying metals.
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- Nature, 2007, v. 445, n. 7123, p. 70, doi. 10.1038/nature05426
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- Article
Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi solder joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 378, doi. 10.1007/s10854-018-0302-8
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- Article
Revealing the micromechanisms behind semi-solid metal deformation with time-resolved X-ray tomography.
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- Nature Communications, 2014, v. 5, n. 7, p. 4464, doi. 10.1038/ncomms5464
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- Article
Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints.
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- Metallurgical & Materials Transactions. Part A, 2024, v. 55, n. 11, p. 4342, doi. 10.1007/s11661-024-07580-9
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- Article
Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections.
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- Nature Communications, 2017, v. 8, n. 1, p. 1, doi. 10.1038/s41467-017-01727-6
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- Article
The role of microstructure in the thermal fatigue of solder joints.
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- Nature Communications, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41467-024-48532-6
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- Article