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High-Resolution Soft Lithography: Enabling Materials for NanotechnologiesWe acknowledge partial support from the Office of Naval Research (N000140210185), partial support from the STC program of the National Science Foundation under Agreement No. CHE-9876674 and the William R. Kenan, Jr. Distinguished Professorship for financial support. We gratefully acknowledge Anthony Brennan at the University of Florida for providing the micron-scale master. We also acknowledge partial support from the MRSEC Program of the NSF Materials Science and Engineering Research Center Grant (9808677) to the Center for Polymer Interfaces and Macromolecular Assemblies (CPIMA) at Stanford University.
- Published in:
- Angewandte Chemie, 2004, v. 116, n. 43, p. 5920, doi. 10.1002/ange.200461122
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Titelbild: High-Resolution Soft Lithography: Enabling Materials for Nanotechnologies (Angew. Chem. 43/2004).
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- Angewandte Chemie, 2004, v. 116, n. 43, p. 5827, doi. 10.1002/ange.200490148
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- Publication type:
- Article
High-Resolution Soft Lithography: Enabling Materials for NanotechnologiesWe acknowledge partial support from the Office of Naval Research (N000140210185), partial support from the STC program of the National Science Foundation under Agreement No. CHE-9876674 and the William R. Kenan, Jr. Distinguished Professorship for financial support. We gratefully acknowledge Anthony Brennan at the University of Florida for providing the micron-scale master. We also acknowledge partial support from the MRSEC Program of the NSF Materials Science and Engineering Research Center Grant (9808677) to the Center for Polymer Interfaces and Macromolecular Assemblies (CPIMA) at Stanford University.
- Published in:
- Angewandte Chemie International Edition, 2004, v. 43, n. 43, p. 5796, doi. 10.1002/anie.200461122
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- Publication type:
- Article
Cover Picture: High-Resolution Soft Lithography: Enabling Materials for Nanotechnologies (Angew. Chem. Int. Ed. 43/2004).
- Published in:
- Angewandte Chemie International Edition, 2004, v. 43, n. 43, p. 5709, doi. 10.1002/anie.200490149
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- Publication type:
- Article