Experimental Approach to Determine Damage Curves for SnAgCu Solder Under Sequential Cyclic Loads.
- Published in:
- Journal of Electronic Materials, 2020, v. 49, n. 2, p. 1412, doi. 10.1007/s11664-019-07811-5
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- Article
Works by George, Elviz
Results: 3
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2
High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 4021, doi. 10.1007/s10854-015-2940-4
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- Publication type:
- Article
3
Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 4, p. 137, doi. 10.4071/imaps.424
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- Publication type:
- Article