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Understanding solidification and wear behaviour of Al-3Cu-Bi alloys.
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- Materials Science & Technology, 2023, v. 39, n. 6, p. 694, doi. 10.1080/02670836.2022.2132733
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- Article
Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn-3.5 wt% Ag Solder Alloy.
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- Advanced Engineering Materials, 2023, v. 25, n. 6, p. 1, doi. 10.1002/adem.202201270
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- Article
Microstructure and Hardness of an Al–8 wt%Si–2.5 wt%Bi Alloy Subjected to Solidification Cooling Rates from 0.1 to 800 K s<sup>−1</sup>.
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- Advanced Engineering Materials, 2023, v. 25, n. 3, p. 1, doi. 10.1002/adem.202201060
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- Article
Microstructure, Hardness, Tensile Strength, and Sliding Wear of Hypoeutectic Al–Si Cast Alloys with Small Cr Additions and Fe‐Impurity Content.
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- Advanced Engineering Materials, 2022, v. 24, n. 8, p. 1, doi. 10.1002/adem.202001552
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- Article
The Roles of Ni and Co in Dendritic Growth and Tensile Properties of Fe‐Containing Al–Si–Cu–Zn Scraps under Slow and Fast Solidification Cooling.
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- Advanced Engineering Materials, 2022, v. 24, n. 3, p. 1, doi. 10.1002/adem.202100822
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- Article
The Roles of Ni and Co in Dendritic Growth and Tensile Properties of Fe‐Containing Al–Si–Cu–Zn Scraps under Slow and Fast Solidification Cooling.
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- Advanced Engineering Materials, 2022, v. 24, n. 3, p. 1, doi. 10.1002/adem.202100822
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- Article
The Roles of Ni and Co in Dendritic Growth and Tensile Properties of Fe‐Containing Al–Si–Cu–Zn Scraps under Slow and Fast Solidification Cooling.
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- Advanced Engineering Materials, 2022, v. 24, n. 3, p. 1, doi. 10.1002/adem.202100822
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- Article
Mechanical Properties, Microstructural Features, and Correlations with Solidification Rates of Al--Cu--Si Ultrafine Eutectic Alloys.
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- Advanced Engineering Materials, 2021, v. 23, n. 4, p. 1, doi. 10.1002/adem.202001177
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- Article
Morphology of Intermetallics Tailoring Tensile Properties and Quality Index of a Eutectic Al–Si–Ni Alloy.
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- Advanced Engineering Materials, 2020, v. 22, n. 12, p. 1, doi. 10.1002/adem.202000503
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- Article
Microstructure Growth Morphologies, Macrosegregation, and Microhardness in Bi–Sb Thermal Interface Alloys.
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- Advanced Engineering Materials, 2020, v. 22, n. 6, p. 1, doi. 10.1002/adem.201901592
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- Article
Dendritic Spacing/Columnar Grain Diameter of Al–2Mg–Zn Alloys Affecting Hardness, Tensile Properties, and Dry Sliding Wear in the As‐Cast/Heat‐Treated Conditions.
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- Advanced Engineering Materials, 2020, v. 22, n. 3, p. 1, doi. 10.1002/adem.201901145
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- Article
High Cooling Rate, Regular and Plate Like Cells in Sn–Ni Solder Alloys.
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- Advanced Engineering Materials, 2018, v. 20, n. 7, p. 1, doi. 10.1002/adem.201701179
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- Article
Solder/substrate interfacial thermal conductance and wetting angles of Bi-Ag solder alloys.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 2, p. 1994, doi. 10.1007/s10854-015-3983-2
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- Article
Experimental and numerical analyses of laser remelted Sn-0.7 wt%Cu solder surfaces.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 3100, doi. 10.1007/s10854-015-2802-0
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- Article
Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 478, doi. 10.1007/s10854-013-1612-5
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- Article
Microstructure and Tensile Strength of an Al-Si-Fe-V Alloy: Vanadium and Solidification Thermal Parameters as Recycling Strategies.
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- Sustainability (2071-1050), 2022, v. 14, n. 21, p. 13859, doi. 10.3390/su142113859
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- Article
The columnar to equiaxed transition in the directional solidification of aluminum based multicomponent alloys.
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- Rem: Revista Escola de Minas, 2015, v. 68, n. 1, p. 85, doi. 10.1590/0370-44672015680237
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- Article
Nature inspired algorithms for the solution of inverse heat transfer problems applied to distinct unsteady heat flux orientations in cylindrical castings.
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- Journal of Intelligent Manufacturing, 2023, v. 34, n. 5, p. 2407, doi. 10.1007/s10845-022-01935-y
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- Article
Dendritic solidification microstructure affecting mechanical and corrosion properties of a Zn4Al alloy.
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- Journal of Materials Science, 2005, v. 40, n. 17, p. 4493, doi. 10.1007/s10853-005-0852-z
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- Article
Dry Sliding Wear Features of an Al-20Sn-5Zn Alloy Affected by Microstructural Length Scales.
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- Lubricants (2075-4442), 2022, v. 10, n. 12, p. 352, doi. 10.3390/lubricants10120352
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- Article
CORRELAÇÃO ENTRE MICROESTRUTURA, RESISTÊNCIAS MECÂNICA E À CORROSÃO DA LIGA DE SOLDAGEM LIVRE DE CHUMBO Sn-0,7%Cu.
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- Tecnologia em Metalurgia, Materiais e Mineração, 2014, v. 11, n. 4, p. 277, doi. 10.4322/tmm.2014.045
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- Article
Effects of Melt Superheating on the Microstructure and Tensile Properties of a Ternary Al-15 Wt Pct Si-1.5 Wt Pct Mg Alloy.
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- Metallurgical & Materials Transactions. Part A, 2019, v. 50, n. 3, p. 1308, doi. 10.1007/s11661-018-5058-5
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- Article
Dendritic Growth, Solidification Thermal Parameters, and Mg Content Affecting the Tensile Properties of Al-Mg-1.5 Wt Pct Fe Alloys.
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- Metallurgical & Materials Transactions. Part A, 2017, v. 48, n. 4, p. 1841, doi. 10.1007/s11661-017-3978-0
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- Article
Thermal Parameters and Microstructural Development in Directionally Solidified Zn-Rich Zn-Mg Alloys.
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- Metallurgical & Materials Transactions. Part A, 2016, v. 47, n. 6, p. 3052, doi. 10.1007/s11661-016-3494-7
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- Article
Electrochemical and Mechanical Behavior of Lead-Silver and Lead-Bismuth Casting Alloys for Lead-Acid Battery Components.
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- Metallurgical & Materials Transactions. Part A, 2015, v. 46, n. 9, p. 4255, doi. 10.1007/s11661-015-3023-0
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- Article
Characterization of Dendritic Microstructure, Intermetallic Phases, and Hardness of Directionally Solidified Al-Mg and Al-Mg-Si Alloys.
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- Metallurgical & Materials Transactions. Part A, 2015, v. 46, n. 8, p. 3342, doi. 10.1007/s11661-015-2967-4
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- Article
Erratum to: Characterization of Dendritic Microstructure, Intermetallic Phases, and Hardness of Directionally Solidified Al-Mg and Al-Mg-Si Alloys.
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- 2015
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- Erratum
Dendritic Arm Spacing Affecting Mechanical Properties and Wear Behavior of Al-Sn and Al-Si Alloys Directionally Solidified under Unsteady-State Conditions.
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- Metallurgical & Materials Transactions. Part A, 2010, v. 41, n. 4, p. 972, doi. 10.1007/s11661-009-0161-2
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- Article
Microstructural Development in Al-Ni Alloys Directionally Solidified under Unsteady-State Conditions.
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- Metallurgical & Materials Transactions. Part A, 2008, v. 39, n. 7, p. 1712, doi. 10.1007/s11661-008-9536-z
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- Article
Effect of Aging on Dendritic Array, Ag<sub>3</sub>Sn Spacing, and Hardness of a Sn-2Ag-0.7Cu Solder Alloy.
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- Journal of Electronic Materials, 2022, v. 51, n. 8, p. 4640, doi. 10.1007/s11664-022-09713-5
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- Article
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 173, doi. 10.1007/s11664-019-07454-6
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- Article
Sn-Bi(-Ga) TIM Alloys: Microstructure, Tensile Properties, Wettability and Interfacial Reactions.
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- Journal of Electronic Materials, 2019, v. 48, n. 8, p. 4773, doi. 10.1007/s11664-019-07286-4
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- Article
Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys.
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- Journal of Electronic Materials, 2018, v. 47, n. 2, p. 1647, doi. 10.1007/s11664-017-5837-6
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- Article
Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys.
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- Journal of Electronic Materials, 2017, v. 46, n. 3, p. 1754, doi. 10.1007/s11664-016-5225-7
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- Article
Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu- xAg Solder Alloys.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1347, doi. 10.1007/s11664-014-3087-4
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- Article
Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Ni.
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- Journal of Electronic Materials, 2013, v. 42, n. 1, p. 179, doi. 10.1007/s11664-012-2263-7
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- Article
Application of an Artificial Intelligence Technique to Improve Purification in the Zone Refining Process.
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- Journal of Electronic Materials, 2010, v. 39, n. 1, p. 49, doi. 10.1007/s11664-009-0947-4
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- Article
Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys.
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- Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2405, doi. 10.1007/s11664-009-0888-y
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- Article
Diseño conceptual de luminarias a partir de la fibra vegetal Opuntia Spp.
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- Actas de Diseño, 2020, v. 15, n. 31, p. 138
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- Article
Effect of Bi content on microstructure and corrosion behaviour of Zn–8Al–(Bi) alloys.
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- Corrosion Engineering, Science & Technology, 2021, v. 56, n. 5, p. 461, doi. 10.1080/1478422X.2021.1916235
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- Article
Electrochemical corrosion behaviour of Sn–Sb solder alloys: the roles of alloy Sb content and type of intermetallic compound.
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- Corrosion Engineering, Science & Technology, 2021, v. 56, n. 1, p. 11, doi. 10.1080/1478422X.2020.1791446
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- Article
Galvanic corrosion analysis of a Bi–Zn solder alloy coupled to Ni and Cu substrates.
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- Corrosion Engineering, Science & Technology, 2020, v. 55, n. 8, p. 729, doi. 10.1080/1478422X.2020.1788772
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- Article
Length scale of solidification microstructure tailoring corrosion resistance and microhardness in T6 heat treatment of an Al–Cu–Mg alloy.
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- Corrosion Engineering, Science & Technology, 2020, v. 55, n. 6, p. 471, doi. 10.1080/1478422X.2020.1742410
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- Article
Correlation between microstructure and corrosion behaviour of Bi-Zn solder alloys.
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- Corrosion Engineering, Science & Technology, 2019, v. 54, n. 4, p. 362, doi. 10.1080/1478422X.2019.1600836
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- Article
Influence of Cu and Cr contents on the solidification path and microstructure formation of hypoeutectic as-cast Al–Cu–Cr alloys.
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- Journal of Thermal Analysis & Calorimetry, 2023, v. 148, n. 18, p. 9403, doi. 10.1007/s10973-023-12346-3
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- Article
Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth.
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- Journal of Thermal Analysis & Calorimetry, 2022, v. 147, n. 8, p. 4945, doi. 10.1007/s10973-021-10755-w
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- Article
Correlation between unsteady-state solidification thermal parameters and microstructural growth of Zn–8 mass% Al and Zn–8 mass% Al–XBi tribological alloys.
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- Journal of Thermal Analysis & Calorimetry, 2020, v. 139, n. 3, p. 1741, doi. 10.1007/s10973-019-08600-2
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- Article
Thermal analysis during solidification of an Al–Cu eutectic alloy: interrelation of thermal parameters, microstructure and hardness.
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- Journal of Thermal Analysis & Calorimetry, 2019, v. 137, n. 3, p. 983, doi. 10.1007/s10973-018-07992-x
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- Article
The influence of NbB inoculation on dendritic spacing and grain size of an aluminum 2017 alloy at different cooling rates.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 125, n. 11/12, p. 5681, doi. 10.1007/s00170-023-11104-x
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- Article
Laser remelting of AlSi10Mg(-Ni) alloy surfaces: influence of Ni content and cooling rate on the microstructure.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 11/12, p. 8117, doi. 10.1007/s00170-022-09263-4
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- Article