Found: 5
Select item for more details and to access through your institution.
Room temperature tensile property and fracture behavior of CuNi10Fe1Mn alloy rods produced by OCC process.
- Published in:
- Materials Science & Technology, 2013, v. 29, n. 3, p. 374, doi. 10.1179/mst.2013.29.3.21
- By:
- Publication type:
- Article
A review on future novel interconnect and polymeric materials for cryogenic memory packaging.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 29, p. 1, doi. 10.1007/s10854-023-11389-4
- By:
- Publication type:
- Article
Pediatric Nursing.
- Published in:
- 2000
- By:
- Publication type:
- Book Review
Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging.
- Published in:
- Journal of Nanomaterials, 2013, p. 1, doi. 10.1155/2013/486373
- By:
- Publication type:
- Article
Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging.
- Published in:
- Journal of Nanomaterials, 2012, p. 1, doi. 10.1155/2012/173025
- By:
- Publication type:
- Article