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Hybrid Bright-Dark-Field Microscopic Fringe Projection System for Cu Pillar Height Measurement in Wafer-Level Package.
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- Sensors (14248220), 2024, v. 24, n. 16, p. 5157, doi. 10.3390/s24165157
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- Article
A Transit Tilt and Offset Errors Calibration Method for Improving Laser Tracker Measurement Accuracy Based on the Telecentric Measurement System.
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- Applied Sciences (2076-3417), 2024, v. 14, n. 6, p. 2251, doi. 10.3390/app14062251
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- Article
Estimation of seismic local slope using Hilbert transform noise correction method.
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- Earth Sciences Research Journal, 2024, v. 28, n. 1, p. 39, doi. 10.15446/esrj.v28n1.112425
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- Article
Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method.
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- Applied Sciences (2076-3417), 2023, v. 13, n. 3, p. 1997, doi. 10.3390/app13031997
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- Publication type:
- Article
High-precision Joint 2D Traveltime Calculation for Seismic Processing.
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- Earth Sciences Research Journal, 2018, n. 4, p. 327, doi. 10.15446/esrj.v22n4.77362
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- Article