Works by Dušek, K.

Results: 12

Influence of latent heat released from solder joints on the reflow temperature profile.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 543, doi. 10.1007/s10854-015-3787-4

By:

Dušek, K.;
Rudajevová, A.;
Plaček, M.

Publication type:

Article

Residual Strain in PCBs with Cu-Plated Holes.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 12, p. 6984, doi. 10.1007/s11664-017-5714-3

By:

Rudajevova, A.;
Dušek, K.

Publication type:

Article

Study of Undercooling and Recalescence During Solidification of SnPbAg and SnAgCu Solders in Real Electronic Joints.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2479, doi. 10.1007/s11664-014-3121-6

By:

Rudajevová, A.;
Dušek, K.

Publication type:

Article

Effect of etherification reaction on extraction and photoelastic and dynamic mechanical behavior of diepoxide-diamine networks.

Published in:

Journal of Applied Polymer Science, 1999, v. 74, n. 12, p. 2877, doi. 10.1002/(SICI)1097-4628(19991213)74:12<2877::AID-APP11>3.0.CO;2-V

By:

Vazquez, A.;
Ilavský, M.;
Dušek, K.

Publication type:

Article

Estimation of the macroscopic stress-strain curve of a particulate composite with a crosslinked polymer matrix.

Published in:

Mechanics of Composite Materials, 2012, v. 47, n. 6, p. 627, doi. 10.1007/s11029-011-9242-6

By:

Náhlík, L.;
Hutař, P.;
Dušková, M.;
Dušek, K.;
Máša, B.

Publication type:

Article

Structure and elasticity of non-crystalline polymer networks.

Published in:

2013

By:

Cantow, H. -J.;
Dall'Asta, G.;
Ferry, J. D.;
Fujita, H.;
Kern, W.;
Natta, G.;
Okamura, S.;
Overberger, C. G.;
Schulz, G. V.;
Slichter, W. P.;
Staverman, A. J.;
Stille, J. K.;
Stuart, H. A.;
Dušek, K.;
Prins, W.

Publication type:

Book Chapter

Processes and states during polymer film formation by simultaneous crosslinking and solvent evaporation.

Published in:

Journal of Materials Science, 2002, v. 37, n. 22, p. 4733, doi. 10.1023/A:1020843020379

By:

Dušková-smrčková, M.;
Dušek, K.

Publication type:

Article

Dynamic mechanical behavior and structure of polyurethaneimides.

Published in:

Journal of Applied Polymer Science, 1987, v. 34, n. 5, p. 1941, doi. 10.1002/app.1987.070340512

By:

Masiulanis, B.;
Hrouz, J.;
Baldrian, J.;
Ilavský, M.;
Dušek, K.

Publication type:

Article

Viscoelastic behavior of interpenetrating networks of polyurethane and polyurethane acrylate.

Published in:

Journal of Applied Polymer Science, 1979, v. 24, n. 4, p. 1007, doi. 10.1002/app.1979.070240414

By:

Rosovizky, V. F.;
Ilavský, M.;
Hrouz, J.;
Dušek, K.;
Lipatov, Yu. S.

Publication type:

Article

Deformational, swelling, and potentiometric behavior of ionized gels of 2-hydroxyethyl methacrylate-methacrylic acid copolymers.

Published in:

Journal of Applied Polymer Science, 1979, v. 23, n. 7, p. 2073, doi. 10.1002/app.1979.070230717

By:

Ilavský, M.;
Dušek, K.;
Vacík, J.;
Kopěek, J.

Publication type:

Article

Hydrophilic gels based on copolymers of 2-hydroxyethyl methacrylate with methacrylamide and acrylamide.

Published in:

Journal of Applied Polymer Science, 1975, v. 19, n. 11, p. 3061, doi. 10.1002/app.1975.070191111

By:

Dušek, K.;
Janáček, J.

Publication type:

Article

ATROPIN UND SCOPOLAMIN-ATROPIN KOMATHERAPIE.

Published in:

Acta Psychiatrica Scandinavica, 1967, v. 43, n. 3, p. 249, doi. 10.1111/j.1600-0447.1967.tb05761.x

By:

&, K. Dušek;
Lindtova, H.

Publication type:

Article