Found: 12
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Processes and states during polymer film formation by simultaneous crosslinking and solvent evaporation.
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- Journal of Materials Science, 2002, v. 37, n. 22, p. 4733, doi. 10.1023/A:1020843020379
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- Article
Effect of etherification reaction on extraction and photoelastic and dynamic mechanical behavior of diepoxide-diamine networks.
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- Journal of Applied Polymer Science, 1999, v. 74, n. 12, p. 2877, doi. 10.1002/(SICI)1097-4628(19991213)74:12<2877::AID-APP11>3.0.CO;2-V
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- Article
Estimation of the macroscopic stress-strain curve of a particulate composite with a crosslinked polymer matrix.
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- Mechanics of Composite Materials, 2012, v. 47, n. 6, p. 627, doi. 10.1007/s11029-011-9242-6
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- Article
Residual Strain in PCBs with Cu-Plated Holes.
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- Journal of Electronic Materials, 2017, v. 46, n. 12, p. 6984, doi. 10.1007/s11664-017-5714-3
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- Article
Study of Undercooling and Recalescence During Solidification of SnPbAg and SnAgCu Solders in Real Electronic Joints.
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- Journal of Electronic Materials, 2014, v. 43, n. 7, p. 2479, doi. 10.1007/s11664-014-3121-6
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- Article
ATROPIN UND SCOPOLAMIN-ATROPIN KOMATHERAPIE.
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- Acta Psychiatrica Scandinavica, 1967, v. 43, n. 3, p. 249, doi. 10.1111/j.1600-0447.1967.tb05761.x
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- Article
Dynamic mechanical behavior and structure of polyurethaneimides.
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- Journal of Applied Polymer Science, 1987, v. 34, n. 5, p. 1941, doi. 10.1002/app.1987.070340512
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- Article
Viscoelastic behavior of interpenetrating networks of polyurethane and polyurethane acrylate.
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- Journal of Applied Polymer Science, 1979, v. 24, n. 4, p. 1007, doi. 10.1002/app.1979.070240414
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- Article
Deformational, swelling, and potentiometric behavior of ionized gels of 2-hydroxyethyl methacrylate-methacrylic acid copolymers.
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- Journal of Applied Polymer Science, 1979, v. 23, n. 7, p. 2073, doi. 10.1002/app.1979.070230717
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- Article
Hydrophilic gels based on copolymers of 2-hydroxyethyl methacrylate with methacrylamide and acrylamide.
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- Journal of Applied Polymer Science, 1975, v. 19, n. 11, p. 3061, doi. 10.1002/app.1975.070191111
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- Article
Structure and elasticity of non-crystalline polymer networks.
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- 2013
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- Book Chapter
Influence of latent heat released from solder joints on the reflow temperature profile.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 543, doi. 10.1007/s10854-015-3787-4
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- Article